Evaluation of a Passive Millimeter Wave (PMMW) imager for wire detection in degraded visual conditions

Ground vehicle tests have been performed to evaluate the performance of a Passive Millimeter Wave (PMMW) imager in reduced visibility conditions and in particular, the ability to detect power lines and cables. A PMMW imager was
compared with Long Wave Infrared (LWIR) and visible imaging cameras. The three sensors were mounted on a Land Rover, together with GPS and digital recording system. All three sensors plus the GPS data were recorded simultaneously in order to provide direct comparisons. The vehicle collected imagery from a number of sites in the vicinity of Malvern, UK, in January, 2008. Imagery was collected both while the vehicle was stationary at specific sites
and while it was moving. Weather conditions during the data collection included clear, drizzle, rain and fog. Imagery was collected during the day, at night, and during dusk/dawn transition periods. The PMMW imager was a prototype which operated at 94 GHz and was based on a conically scanned folded Schmidt camera and the LWIR and visible sensors were commercial off the shelf items.

State detection of bond wires in IGBT modules using eddy current pulsed thermography

Insulated gate bipolar transistor (IGBT) modules are important safety critical components in electrical power systems. Bond wire lift-off, a plastic deformation between wire bond and adjacent layers of a device caused by repeated power/thermal cycles, is the most common failure mechanism in IGBT modules. For the early detection and characterization of such failures, it is important to constantly detect or monitor the health state of IGBT modules, and the state of bond wires in particular. This paper introduces eddy current pulsed thermography (ECPT), a nondestructive evaluation technique, for the state detection and characterization of bond wire lift-off in IGBT modules. After the introduction of the experimental ECPT system, numerical simulation work is reported. The presented simulations are based on the 3-D electromagnetic-thermal coupling finite-element method and analyze transient temperature distribution within the bond wires. This paper illustrates the thermal patterns of bond wires using inductive heating with different wire statuses (lifted-off or well bonded) under two excitation conditions: nonuniform and uniform magnetic field excitations. Experimental results show that uniform excitation of healthy bonding wires, using a Helmholtz coil, provides the same eddy currents on each, while different eddy currents are seen on faulty wires. Both experimental and numerical results show that ECPT can be used for the detection and characterization of bond wires in power semiconductors through the analysis of the transient heating patterns of the wires. The main impact of this paper is that it is the first time electromagnetic induction thermography, so-called ECPT, has been employed on power/electronic devices. Because of its capability of contactless inspection of multiple wires in a single pass, and as such it opens a wide field of investigation in power/electronic devices for failure detection, performance characterization, and health monitoring.