The role of plug design in determining wall thickness distribution in thermoforming

An experimental investigation has been carried out into the effects of changes in plug design on the wall thickness distribution of thermoformed products. Plugs were machined with a series of geometrical variations and their effects on the process were measured. The overall results show that the plug has a crucial role in controlling the wall thickness distribution in thermoforming. Larger plugs tend to distribute more material to the base of the product, but the introduction of a small sidewall taper, base radius, or a reduction in plug diameter tend to lead to more balanced distributions. However, larger changes in any of the variables tend to destroy these benefits. It has also been demonstrated that the frictional and thermal properties of the plug are important in determining the deformation response of the sheet material. There is a clear evidence of slip in the sheet during plug contact and, although the cooling effect of the plug appears to be minimal, cooling in the highly deformed regions away from the plug appears to be a significant factor.

Wall thickness dependence of the scaling law for ferroic stripe domains

The periodicity of 180 degrees. stripe domains as a function of crystal thickness scales with the width of the domain walls, both for ferroelectric and for ferromagnetic materials. Here we derive an analytical expression for the generalized ferroic scaling factor and use this to calculate the domain wall thickness and gradient coefficients ( exchange constants) in some ferroelectric and ferromagnetic materials. We then use these to discuss some of the wider implications for the physics of ferroelectric nanodevices and periodically poled photonic crystals.

Understanding thickness effects in thin film capacitors

Pulsed Laser Deposition (PLD) was used to make Au/(Ba0.5Sr0.5)TiO3/(La0.5Sr0.5) CoO3/MgO thin film capacitor structures. Functional properties were studied with changing BST thickness from similar to1265 nm to similar to63 nm. The dielectric constant was found to decrease, and migration of T-m (the temperature at which the dielectric constant is maximum) to lower temperatures occurred as thickness was reduced. Curie-Weiss plots of the as-obtained dielectric data, indicated that the Curie temperature was also systemmatically progressively depressed. Further, fitting to expressions previously used to describe diffuse phase transitions suggested increased diffuseness in transformation behaviour as film thickness decreased. This paper discusses the care needed in interpreting the observations given above. We make particular distinction between the apparent Curie-temperature derived from Curie-Weiss plots of as-measured data, and the inherent Curie temperature determined after correction for the interfacial capacitance. We demonstrate that while the apparent Curie temperature decreases as thickness decreases, the inherent Curie temperature is thickness independent. Thickness-invariant phase transition behaviour is confirmed from analysis of polarisation loops, and from examination of the temperature dependence of the loss-tangent. We particularly note that correction of data for interfacial capacitance does not alter the position of T-m. We must therefore conclude that the position of T-m is not related simply to phase transformation behaviour in BST thin films.