Proposed methodology for the use of computer simulation to enhance aircraft evacuation certification

In this paper a methodology for the application of computer simulation to evacuation certification of aircraft is suggested. This involves the use of computer simulation, historic certification data, component testing, and full-scale certification trials. The methodology sets out a framework for how computer simulation should be undertaken in a certification environment and draws on experience from both the marine and building industries. In addition, a phased introduction of computer models to certification is suggested. This involves as a first step the use of computer simulation in conjunction with full-scale testing. The combination of full-scale trial, computer simulation (and if necessary component testing) provides better insight into aircraft evacuation performance capabilities by generating a performance probability distribution rather than a single datum. Once further confidence in the technique is established the requirement for the full-scale demonstration could be dropped. The second step in the adoption of computer simulation for certification involves the introduction of several scenarios based on, for example, exit availability, instructed by accident analysis. The final step would be the introduction of more realistic accident scenarios. This would require the continued development of aircraft evacuation modeling technology to include additional behavioral features common in real accident scenarios.

Microwave curing for high density package

Summary form only given. Currently the vast majority of adhesive materials in electronic products are bonded using convection heating or infra-red as well as UV-curing. These thermal processing steps can take several hours to perform, slowing throughput and contributing a significant portion of the cost of manufacturing. With the demand for lighter, faster, and smaller electronic devices, there is a need for innovative material processing techniques and control methodologies. The increasing demand for smaller and cheaper devices pose engineering challenges in designing a curing systems that minimize the time required between the curing of devices in a production line, allowing access to the components during curing for alignment and testing. Microwave radiation exhibits several favorable characteristics and over the past few years has attracted increased academic and industrial attention as an alternative solution to curing of flip-chip underfills, bumps, glob top and potting cure, structural bonding, die attach, wafer processing, opto-electronics assembly as well as RF-ID tag bonding. Microwave energy fundamentally accelerates the cure kinetics of polymer adhesives. It provides a route to focus heat into the polymer materials penetrating the substrates that typically remain transparent. Therefore microwave energy can be used to minimise the temperature increase in the surrounding materials. The short path between the energy source and the cured material ensures a rapid heating rate and an overall low thermal budget. In this keynote talk, we will review the principles of microwave curing of materials for high density packing. Emphasis will be placed on recent advances within ongoing research in the UK on the realization of "open-oven" cavities, tailored to address existing challenges. Open-ovens do not require positioning of the device into the cavity through a movable door, hence being more suitable for fully automated processing. Further potential advantages of op- - en-oven curing include the possibility for simultaneous fine placement and curing of the device into a larger assembly. These capabilities promise productivity gains by combining assembly, placement and bonding into a single processing step. Moreover, the proposed design allows for selective heating within a large substrate, which can be useful particularly when the latter includes parts sensitive to increased temperatures.