5 resultados para participatory evaluation methodology
em Greenwich Academic Literature Archive - UK
Resumo:
Over the past ten years, mentoring of children and young people has become an increasingly important feature of social policy in the UK. This has been mirrored in the rapid growth in the number of mentoring schemes operating. However, it is widely acknowledged that no one single definition or model of mentoring exists; rather there are a number of different models providing support to young people in a range of settings. This research was undertaken during the autumn term of 2006 and the summer term of 2007. The methodology comprised an analysis of mentoring models in the 180 participating schools; questionnaires sent to all co-ordinators and to mentors/proteges in 40 schools; interviews with co-ordinators, pupils and support agents in 8 case study schools. Includes: •Introduction •Evaluation methodology •Analysis of school pilot application forms •Evaluation results •Conclusions •Recommendations •Bibliography •Appendices
Resumo:
In recognition of the differences of scale between the welding pool and the heat affected zone along the welding line on one hand, and the overall size of the components being welded on the other, a local-global finite element approach was developed for the evaluation of distortions in laser welded shipbuilding parts. The approach involves the tandem use of a 'local' and a 'global' step. The local step involves a three-dimensional finite element model for the simulation of the laser welding process using the Sysweld finite element code, which takes into account thermal, metallurgical, and mechanical aspects. The simulation of the laser welding process was performed using a non-linear heat transfer analysis, based on a keyhole formation model, and a coupled transient thermomechanical analysis, which takes into account metallurgical transformations using the temperature dependent material properties and the continuous cooling transformation diagram. The size and shape of the keyhole used in the local finite element analysis was evaluated using a keyhole formation model and the Physica finite volume code. The global step involves the transfer of residual plastic strains and the stiffness of the weld obtained from the local model to the global analysis, which then provides the predicted distortions for the whole part. This newly developed methodology was applied to the evaluation of global distortions due to laser welding of stiffeners on a shipbuilding part. The approach has been proved reliable in comparison with experiments and of practical industrial use in terms of computing time and storage.
Resumo:
Evaluating ship layout for human factors (HF) issues using simulation software such as maritimeEXODUS can be a long and complex process. The analysis requires the identification of relevant evaluation scenarios; encompassing evacuation and normal operations; the development of appropriate measures which can be used to gauge the performance of crew and vessel and finally; the interpretation of considerable simulation data. Currently, the only agreed guidelines for evaluating HFs performance of ship design relate to evacuation and so conclusions drawn concerning the overall suitability of a ship design by one naval architect can be quite different from those of another. The complexity of the task grows as the size and complexity of the vessel increases and as the number and type of evaluation scenarios considered increases. Equally, it can be extremely difficult for fleet operators to set HFs design objectives for new vessel concepts. The challenge for naval architects is to develop a procedure that allows both accurate and rapid assessment of HFs issues associated with vessel layout and crew operating procedures. In this paper we present a systematic and transparent methodology for assessing the HF performance of ship design which is both discriminating and diagnostic. The methodology is demonstrated using two variants of a hypothetical naval ship.
Resumo:
Brusilovsky and Millan (2007) state that learning styles are typically defined as the way people prefer to learn. Learning styles and how we learn is a vast research area and many research projects (SMILE, INSPIRE, iWeaver amongst others) attempt to incorporate these learning styles into e-Learning systems. This paper describes commonly used learning styles and how they are currently being used within the area of adaptive e-Learning. This work also builds upon current research and evaluates learning styles using criteria proposed by Sampson and Karagiannidis (2004) in order to select a suitable learning methodology for the iLearn e-Learning platform. The Sampson and Karagiannidis (2004) criteria is adapted for the purpose of the research and describes the measurability, time effectiveness and descriptiveness and prescriptiveness of the specific learning style. A suitable learning style for the iLearn e-Learning platform is then proposed within the paper and finally the research briefly introduces how the chosen learning style will be used for the proposed e-Learning platform.
Resumo:
The paper reports on the investigation of the rheological behaviour new lead-free solder pastes formulations for use in flip-chip assembly applications. The study is made up of three parts; namely the evaluation of the effect of plate geometry, the effect of temperature and processing environment and the effect of torsional frequencies on the rheological measurements. Different plate geometries and rheological tests were used to evaluate new formulations in terms of wall slip characteristics, linear viscoelastic region and shear thinning behaviour. A technique which combines the use of the creep-recovery and dynamic frequency sweep tests was used to further characterise the paste structure, rheological behaviour and the processing performance of the new paste formulations. The technique demonstrated in this study has wide utility for R & D personnel involved in new paste formulation, for implementing quality control procedures used in paste manufacture and packaging and for qualifying new flip-chip assembly lines