Application of modelling for predicting the behaviour of polymers and adhesives in microelectronic and photonic devices

With the growth in computing power, and advances in numerical methods for the solution of partial differential equations, modeling technologies based around computational fluid dynamics, finite element analysis and optimisation are now being widely used by researchers and industry. Polymer and adhesive materials are now being widely used in electronic and photonic devices. This paper will illustrate the use of modeling tools to predict the behaviour of these materials from product assembly to its performance and reliability.

Artificial neural networks in modelling osmotic dehydration of foods

Artificial neural network (ANN) models for water loss (WL) and solid gain (SG) were evaluated as potential alternative to multiple linear regression (MLR) for osmotic dehydration of apple, banana and potato. The radial basis function (RBF) network with a Gaussian function was used in this study. The RBF employed the orthogonal least square learning method. When predictions of experimental data from MLR and ANN were compared, an agreement was found for ANN models than MLR models for SG than WL. The regression coefficient for determination (R2) for SG in MLR models was 0.31, and for ANN was 0.91. The R2 in MLR for WL was 0.89, whereas ANN was 0.84.Osmotic dehydration experiments found that the amount of WL and SG occurred in the following descending order: Golden Delicious apple > Cox apple > potato > banana. The effect of temperature and concentration of osmotic solution on WL and SG of the plant materials followed a descending order as: 55 > 40 > 32.2C and 70 > 60 > 50 > 40%, respectively.

Radio propagation modeling for capacity optimization in wireless relay MIMO systems with partial CSI

The enormous growth of wireless communication systems makes it important to evaluate the capacity of such channels. Multiple Input Multiple Output (MIMO) wireless communication systems are shown to yield significant performance improvement to data rates when compared to the traditional Single Input Single Output (SISO) wireless systems. The benefits of multiple antenna elements at the transmitter and receiver have become necessary to the research and the development of the next generation of mobile communication systems. In this paper we propose the use of Relaying MIMO wireless communication systems for use over long throughput. We investigate how Relays can be used in a "demodulate-and-forward" operation when the transmitter is equipped with spatially correlated multiple antenna elements and the receiver has only partial knowledge of the statistics of the channel. We show that Relays between the source and destination nodes of a wireless communication system in MIMO configuration improve the throughput of the system when compared to the typical MIMO systems, or achieve the desired channel capacity with significantly lower power resources needed.

Modeling the effect of lead-free soldering on flexible substrates

Flexible Circuit Boards (FPCs) are now being widely used in the electronic industries especially in the areas of electronic packages. Due to European lead-free legislation which has been implemented since July 2006, electronic packaging industries have to switch to use in the lead-free soldering technology. This change has posed a number of challenges in terms of development of lead-free solders and compatible substrates. An increase of at least 20-50 degrees in the reflow temperature is a concern and substantial research is required to investigate a sustainable design of flexible circuit boards as carrier substrates. This paper investigates a number of design variables such as copper conductor width, type of substrate materials, effect of insulating materials, etc. Computer modeling has been used to investigate thermo-mechanical behavior, and reliability, of flexible substrates after they have been subjected to a lead- free solder processing. Results will show particular designs that behave better for a particular rise in peak reflow temperature. Also presented will be the types of failures that can occur in these substrates and what particular materials are more reliable.