1 resultado para oxidation of methionine, oxidative stress
em Greenwich Academic Literature Archive - UK
Filtro por publicador
- ABACUS. Repositorio de Producción Científica - Universidad Europea (2)
- Aberdeen University (2)
- Abertay Research Collections - Abertay University’s repository (1)
- Acceda, el repositorio institucional de la Universidad de Las Palmas de Gran Canaria. España (1)
- AMS Tesi di Dottorato - Alm@DL - Università di Bologna (4)
- AMS Tesi di Laurea - Alm@DL - Università di Bologna (1)
- Aquatic Commons (3)
- ArchiMeD - Elektronische Publikationen der Universität Mainz - Alemanha (4)
- Archivo Digital para la Docencia y la Investigación - Repositorio Institucional de la Universidad del País Vasco (2)
- Aston University Research Archive (25)
- Biblioteca Digital da Produção Intelectual da Universidade de São Paulo (32)
- Biblioteca Digital da Produção Intelectual da Universidade de São Paulo (BDPI/USP) (21)
- Biblioteca Digital de Teses e Dissertações Eletrônicas da UERJ (2)
- Bioline International (3)
- BORIS: Bern Open Repository and Information System - Berna - Suiça (28)
- Brock University, Canada (3)
- Bucknell University Digital Commons - Pensilvania - USA (1)
- CaltechTHESIS (4)
- Cambridge University Engineering Department Publications Database (25)
- CentAUR: Central Archive University of Reading - UK (25)
- Chinese Academy of Sciences Institutional Repositories Grid Portal (216)
- Cochin University of Science & Technology (CUSAT), India (1)
- CORA - Cork Open Research Archive - University College Cork - Ireland (7)
- Dalarna University College Electronic Archive (1)
- Deakin Research Online - Australia (37)
- DI-fusion - The institutional repository of Université Libre de Bruxelles (1)
- Digital Commons - Michigan Tech (1)
- DigitalCommons@The Texas Medical Center (3)
- DRUM (Digital Repository at the University of Maryland) (2)
- Duke University (2)
- Glasgow Theses Service (2)
- Greenwich Academic Literature Archive - UK (1)
- Helda - Digital Repository of University of Helsinki (10)
- Indian Institute of Science - Bangalore - Índia (141)
- Institutional Repository of Leibniz University Hannover (1)
- Instituto Politécnico de Viseu (1)
- Instituto Politécnico do Porto, Portugal (3)
- National Center for Biotechnology Information - NCBI (24)
- Plymouth Marine Science Electronic Archive (PlyMSEA) (8)
- Publishing Network for Geoscientific & Environmental Data (1)
- QUB Research Portal - Research Directory and Institutional Repository for Queen's University Belfast (58)
- Queensland University of Technology - ePrints Archive (61)
- Repositório Alice (Acesso Livre à Informação Científica da Embrapa / Repository Open Access to Scientific Information from Embrapa) (1)
- Repositório Científico da Universidade de Évora - Portugal (1)
- Repositório Institucional UNESP - Universidade Estadual Paulista "Julio de Mesquita Filho" (128)
- SAPIENTIA - Universidade do Algarve - Portugal (1)
- Scielo España (2)
- Universidad de Alicante (3)
- Universidad Politécnica de Madrid (1)
- Universidade Estadual Paulista "Júlio de Mesquita Filho" (UNESP) (1)
- Universidade Federal do Pará (3)
- Université de Lausanne, Switzerland (2)
- Université de Montréal (1)
- Université de Montréal, Canada (7)
- University of Queensland eSpace - Australia (22)
- WestminsterResearch - UK (1)
Resumo:
The thermal stress in a Sn3.5Ag1Cu half-bump solder joint under a 3.82×108 A/m2 current stressing was analyzed using a coupled-field simulation. Substantial thermal stress accumulated around the Al-to-solder interface, especially in the Ni+(Ni,Cu)3Sn4 layer, where a maximal stress of 138 MPa was identified. The stress gradient in the Ni layer was about 1.67×1013 Pa/m, resulting in a stress migration force of 1.82×10-16 N, which is comparable to the electromigration force, 2.82×10-16 N. Dissolution of the Ni+(Ni,Cu)3Sn4 layer, void formation with cracks at the anode side, and extrusions at the cathode side were observed