Modelling the effect of temperature on product reliability

Reliability of electronic parts is a major concern for many manufacturers, since early failures in the field can cost an enormous amount to repair - in many cases far more than the original cost of the product. A great deal of effort is expended by manufacturers to determine the failure rates for a process or the fraction of parts that will fail in a period of time. It is widely recognized that the traditional approach to reliability predictions for electronic systems are not suitable for today's products. This approach, based on statistical methods only, does not address the physics governing the failure mechanisms in electronic systems. This paper discusses virtual prototyping technologies which can predict the physics taking place and relate this to appropriate failure mechanisms. Simulation results illustrate the effect of temperature on the assembly process of an electronic package and the lifetime of a flip-chip package.

Modelling the behavior of solder joints for wafer level SiP

Design for manufacture of system-in-package (SiP) structures is dependent on a number of physical processes that affect the final quality of the package in terms of its performance and reliability. Solder joints are key structures in a SiP and their behavior can be the critical factor in terms of reliability. This paper discusses the results from a research programme on design for manufacturing of system in package (SiP) technologies. The focus of the paper is on thermo-mechanical modelling of solder joints. This includes the behavior of the joints during testing plus some important insights into the reflow process and how physical phenomena taking place at the assembly stage can affect solder joint behavior. Finite element analysis of a numerical model of an SiP structure with various design parameters is discussed. The goal of this analysis is to identify the most promising combination of design parameters which guarantee longer lifetime of the solder joints and hence the SiP component. The parameters that were studied are the size of the package (i.e. number of solder joints per row), the presence of the underfill and/or the reinforcement as well as the thickness of the passive die. Discussion was also provided on phenomena that take place during the reflow process where the solder joints are formed. In particular, the formation of intermetallics at the solder-pad interfaces

Constitutive modeling of kinematic-hardening and damage in solder joints

Solder constitutive models are important as they are widely used in FEA simulations to predict the lifetime of soldered assemblies. This paper briefly reviews some common constitutive laws to capture creep in solder and presents work on laws capturing both kinematic hardening and damage. Inverse analysis is used to determine constants for the kinematic hardening law which match experimental creep curves. The mesh dependence of the damage law is overcome by using volume averaging and is applied to predict the crack path in a thermal cycled resistor component

Review of methods to predict solder joint reliability under thermo-mechanical cycling

Solder joints are often the cause of failure in electronic devices, failing due to cyclic creep induced ductile fatigue. This paper will review the modelling methods available to predict the lifetime of SnPb and SnAgCu solder joints under thermo-mechanical cycling conditions such as power cycling, accelerated thermal cycling and isothermal testing, the methods do not apply to other damage mechanisms such as vibration or drop-testing. Analytical methods such as recommended by the IPC are covered, which are simple to use but limited in capability. Finite element modelling methods are reviewed, along with the necessary constitutive laws and fatigue laws for solder, these offer the most accurate predictions at the current time. Research on state-of-the-art damage mechanics methods is also presented, although these have not undergone enough experimental validation to be recommended at present

Lifetime prediction for power electronics module substrate mount-down solder interconnect

A numerical modeling method for the prediction of the lifetime of solder joints of relatively large solder area under cyclic thermal-mechanical loading conditions has been developed. The method is based on the Miner's linear damage accumulation rule and the properties of the accumulated plastic strain in front of the crack in large area solder joint. The nonlinear distribution of the damage indicator in the solder joints have been taken into account. The method has been used to calculate the lifetime of the solder interconnect in a power module under mixed cyclic loading conditions found in railway traction control applications. The results show that the solder thickness is a parameter that has a strong influence on the damage and therefore the lifetime of the solder joint while the substrate width and the thickness of the baseplate are much less important for the lifetime

Development of a model to predict the life of pneumatic conveyor bends subject to erosive wear

The erosion processes resulting from flow of fluids (gas-solid or liquid-solid) are encountered in nature and many industrial processes. The common feature of these erosion processes is the interaction of the fluid (particle) with its boundary thus resulting in the loss of material from the surface. This type of erosion in detrimental to the equipment used in pneumatic conveying systems. The puncture of pneumatic conveyor bends in industry causes several problems. Some of which are: (1) Escape of the conveyed product causing health and dust hazard; (2) Repairing and cleaning up after punctures necessitates shutting down conveyors, which will affect the operation of the plant, thus reducing profitability. The most common occurrence of process failure in pneumatic conveying systems is when pipe sections at the bends wear away and puncture. The reason for this is particles of varying speed, shape, size and material properties strike the bend wall with greater intensity than in straight sections of the pipe. Currently available models for predicting the lifetime of bends are inaccurate (over predict by 80%. The provision of an accurate predictive method would lead to improvements in the structure of the planned maintenance programmes of processes, thus reducing unplanned shutdowns and ultimately the downtime costs associated with these unplanned shutdowns. This is the main motivation behind the current research. The paper reports on two aspects of the first phases of the study-undertaken for the current project. These are (1) Development and implementation; and (2) Testing of the modelling environment. The model framework encompasses Computational Fluid Dynamics (CFD) related engineering tools, based on Eulerian (gas) and Lagrangian (particle) approaches to represent the two distinct conveyed phases, to predict the lifetime of conveyor bends. The method attempts to account for the effect of erosion on the pipe wall via particle impacts, taking into account the angle of attack, impact velocity, shape/size and material properties of the wall and conveyed material, within a CFD framework. Only a handful of researchers use CFD as the basis of predicting the particle motion, see for example [1-4] . It is hoped that this would lead to more realistic predictions of the wear profile. Results, for two, three-dimensional test cases using the commercially available CFD PHOENICS are presented. These are reported in relation to the impact intensity and sensitivity to the inlet particle distributions.

Lifetime assessment of electronic components for high reliability aerospace applications

This paper details a modelling approach for assessing the in-service (field) reliability and thermal fatigue life-time of electronic package interconnects for components used in the assembly of an aerospace system. The Finite Element slice model of a Plastic Ball Grid Array (PBGA) package and suitable energy based damage models for crack length predictions are used in this study. Thermal fatigue damage induced in tin-lead solder joints are investigated by simulating the crack growth process under a set of prescribed field temperature profiles that cover the period of operational life. The overall crack length in the solder joint for all different thermal profiles and number of cycles for each profile is predicted using a superposition technique. The effect of using an underfill is also presented. A procedure for verifying the field lifetime predictions for the electronic package by using reliability assessment under Accelerated Thermal Cycle (ATC) testing is also briefly outlined.