Reliability predictions for high density packaging

Predicting the reliability of newly designed products, before manufacture, is obviously highly desirable for many organisations. Understanding the impact of various design variables on reliability allows companies to optimise expenditure and release a package in minimum time. Reliability predictions originated in the early years of the electronics industry. These predictions were based on historical field data which has evolved into industrial databases and specifications such as the famous MIL-HDBK-217 standard, plus numerous others. Unfortunately the accuracy of such techniques is highly questionable especially for newly designed packages. This paper discusses the use of modelling to predict the reliability of high density flip-chip and BGA components. A number of design parameters are investigated at the assembly stage, during testing, and in-service.

Creative environments for art, craft & design teaching in the 21st century

This booklet has been designed for student teachers in particular and those in their early years as teachers of art, craft and design. It is suitable however for all teachers of art and design, and will be useful when considering the 2007 review of the Art and Design programme of study (POS) with its focus on creativity and ideas developments. The contents are intended as prompts or guides and ideas for initiating individual responses to themes or projects and a "way in" for the teacher when guiding pupils. It explains in detail how one might inspire all groups with appropriate and varied resources.