On the modelling of the thermal interactions between a spray curtain and an impinging cold gas cloud

A mixed Lagrangian-Eulerian model of a Water Curtain barrier is presented. The heat, mass and momentum processes are modelled in a Lagrangian framework for the dispersed phase and in an Eulerian framework for the carrier phase. The derivation of the coupling source terms is illustrated with reference to a given carrier phase cell. The turbulent character of the flow is treated with a single equation model, modified to directly account for the influence of the particles on the flow. The model is implemented in the form of a 2 D incompressible Navier Stokes solver, coupled to an adaptive Rung Kutta method for the Lagrangian sub-system. Simulations of a free standing full cone water spray show satisfactory agreement with experiment. Predictions of a Water Curtain barrier impacted by a cold gas cloud point to markedly different flow fields for the upward and downward configurations, which could influence the effectiveness of chemical absorption in the liquid phase.

Effect of bend orientation on life and puncture point location due to solid particle erosion of a high concentration flow in pneumatic conveyors

An investigation into predicting failure of pneumatic conveyor pipe bends due to hard solid particle impact erosion has been carried out on an industrial scale test rig. The bend puncture point locations may vary with many factors. However, bend orientation was suspected of being a main factor due to the biased particle distribution pattern of a high concentration flow. In this paper, puncture point locations have been studied with different pipe bend orientations and geometry (a solids loading ratio of 10 being used for the high concentration flow). Test results confirmed that the puncture point location is indeed most significantly influenced by the bend orientation (especially for a high concentration flow) due to the biased particle distribution and biased particle flux distribution.

Study of Anisotropic Conductive Adhesive Joint Behaviour under 3-Point Bending

Flip chip interconnections using anisotropic conductive film (ACF) are now a very attractive technique for electronic packaging assembly. Although ACF is environmentally friendly, many factors may influence the reliability of the final ACF joint. External mechanical loading is one of these factors. Finite element analysis (FEA) was carried out to understand the effect of mechanical loading on the ACF joint. A 3-dimensional model of adhesively bonded flip chip assembly was built and simulations were performed for the 3-point bending test. The results show that the stress at its highest value at the corners, where the chip and ACF were connected together. The ACF thickness was increased at these corner regions. It was found that higher mechanical loading results in higher stress that causes a greater gap between the chip and the substrate at the corner position. Experimental work was also carried out to study the electrical reliability of the ACF joint with the applied bending load. As per the prediction from FEA, it was found that at first the corner joint failed. Successive open joints from the corner towards the middle were also noticed with the increase of the applied load.