Computational modelling-a key component in materials processing

Computational analysis software is now widely accepted as a key industrial tool for plant design and process analysis. This is due in part to increased accuracy in the models, larger and faster computer systems and better graphical interfaces that allow easy use of the technology by engineers. The use of computational modelling to test new ideas and analyse current processes helps to take the guesswork out of industrial process design and offers attractive cost savings. An overview of computer-based modelling techniques as applied to the materials processing industry is presented and examples of their application are provided in the contexts of the mixing and refining of lead bullion and the manufacture of lead ingots.

A case based model to assist in the design process in the manufacture of furniture products

This paper describes progress on a project to utilise case based reasoning methods in the design and manufacture of furniture products. The novel feature of this research is that cases are represented as structures in a relational database of products, components and materials. The paper proposes a method for extending the usual "weighted sum" over attribute similarities for a ·single table to encompass relational structures over several tables. The capabilities of the system are discussed, particularly with respect to differing user objectives, such as cost estimation, CAD, cutting scheme re-use, and initial design. It is shown that specification of a target case as a relational structure combined with suitable weights can fulfil several user functions. However, it is also shown that some user functions cannot satisfactorily be specified via a single target case. For these functions it is proposed to allow the specification of a set of target cases. A derived similarity measure between individuals and sets of cases is proposed.

"System in package technology" - design for manufacture challenges

Purpose – To present key challenges associated with the evolution of system-in-package technologies and present technical work in reliability modeling and embedded test that contributes to these challenges. Design/methodology/approach – Key challenges have been identified from the electronics and integrated MEMS industrial sectors. Solutions to optimising the reliability of a typical assembly process and reducing the cost of production test have been studied through simulation and modelling studies based on technology data released by NXP and in collaboration with EDA tool vendors Coventor and Flomerics. Findings – Characterised models that deliver special and material dependent reliability data that can be used to optimize robustness of SiP assemblies together with results that indicate relative contributions of various structural variables. An initial analytical model for solder ball reliability and a solution for embedding a low cost test for a capacitive RF-MEMS switch identified as an SiP component presenting a key test challenge. Research limitations/implications – Results will contribute to the further development of NXP wafer level system-in-package technology. Limitations are that feedback on the implementation of recommendations and the physical characterisation of the embedded test solution. Originality/value – Both the methodology and associated studies on the structural reliability of an industrial SiP technology are unique. The analytical model for solder ball life is new as is the embedded test solution for the RF-MEMS switch.

Integrated reliability and prognostics prediction methodology for power electronic modules

The article consists of a PowerPoint presentation on integrated reliability and prognostics prediction methodology for power electronic modules. The areas discussed include: power electronics flagship; design for reliability; IGBT module; design for manufacture; power module components; reliability prediction techniques; failure based reliability; etc.

Modelling and optimization of a pneumatic microfeeder system

This paper presents modelling and design optimization of a microfeeder which, as part of a microassembly system, is used for contactless object delivery. The microfeeder consists of an array of microactuators which are controlled by electrostatic actuation and used for maneuvering outcoming air jet for object hovering and delibery. The airflow behaviour in the microactuator is analysed by means of fluid mechanics and Computational Fluid Dynamics (CFD) simulation from three aspects, theoretical analysis, initial design assessment, and design modifications. The focus is put on the basic types of the microfeeder structure and the effects of structural details to the systematic performance. The structural pattern of the microactuator for forming airflow nozzle is identified and two design plans are proposed as basic structure patterns of pneumatic microactuators. The optimized design numerically shows the ability of delivering objects. This paper analyses the flow distribution pattern in microactuators and points out a way for effective design of pneumatic microfeeder systems. The optimization strategy provided by the present paper has close relevance to the design and manufacture of pneumatic microfeeder systems.

Study of the rheological behaviour of Sn-Ag-Cu solder pastes and their correlation with printing performance

Solder paste plays an important role in the electronic assembly process by providing electrical, mechanical and thermal bonding between the components and the substrate. The rheological characterisation of pastes is an important step in the design and development of new paste formulations. With the ever increasing trend of miniaturisation of electronic products, the study of the rheological properties of solder pastes is becoming an integral part in the R&D of new paste formulations and in the quality monitoring and control during paste manufacture and electronic assembly process. This research work outlines some of the novel techniques which can be successfully used to investigate the rheology of leadfree solder pastes. The report also presents the results of the correlation of rheological properties with solder paste printing performance. Four different solder paste samples (namely paste P1, P2, P3 and P4) with different flux vehicle systems and particle size distributions were investigated in the study. As expected, all the paste samples showed shear thinning behaviour. Although the samples displayed similar flow behaviour at high shear rates, differences were observed at low shear rates. In the stencil printing trials, round deposits showed better results than rectangular deposits in terms of paste heights and aperture filling. Our results demonstrate a good correlation between higher paste viscosity and good printing performance. The results of the oscillatory and thixotropy tests were also successfully correlated to the printing behaviour of solder paste.

Modelling dosator filling and discharge of powder

Dosators and other dosing mechanisms operating on generally similar principles are very widely used in the pharmaceutical industry for capsule filling, and for dosing products that are delivered to the customer in powder form such as inhalers. This is a trend that is set to increase. However a significant problem for this technology is being able to predict how accurately and reliably, new drug formulations will be dosed from these machines prior to manufacture. This paper presents a review of the literature relating to powder dosators which considers mathematical models for predicting dosator performance, the effects of the dosator geometry and machine settings on the accuracy of the dose weight. An overview of a model based on classical powder mechanics theory that has been developed at The University of Greenwich is presented. The model uses inputs from a range of powder characterisation tests including, wall friction, bulk density, stress ratio and permeability. To validate the model it is anticipated that it will be trialled for a range of powders alongside a single shot dosator test rig.