Exploiting virtual prototyping for reliability assessment

Products manufactured by the electronics sector are having a major impact in telecommunications, transportation space applications, biomedical applications, consumer products, intelligent hand held devices, and of course,the computer. Demands from end-users in terms of greater product functionality, adoption of environmentally friendly materials, and further miniaturization continually pose several challenges to electronics companies. In the context of electronic product design and manufacture, virtual prototying software tools are allowing companies to dramatically reduce the number of phsysical prototypes and design iterations required in product development and hence reduce costs and time to market. This paper details of the trends in these technolgies and provides an example of their use for flip-chip assembly technology.

Optimization and finite element analysis for reliable electronic packaging

This paper demonstrates a modeling and design approach that couples computational mechanics techniques with numerical optimisation and statistical models for virtual prototyping and testing in different application areas concerning reliability of eletronic packages. The integrated software modules provide a design engineer in the electronic manufacturing sector with fast design and process solutions by optimizing key parameters and taking into account complexity of certain operational conditions. The integrated modeling framework is obtained by coupling the multi-phsyics finite element framework - PHYSICA - with the numerical optimisation tool - VisualDOC into a fully automated design tool for solutions of electronic packaging problems. Response Surface Modeling Methodolgy and Design of Experiments statistical tools plus numerical optimisaiton techniques are demonstrated as a part of the modeling framework. Two different problems are discussed and solved using the integrated numerical FEM-Optimisation tool. First, an example of thermal management of an electronic package on a board is illustrated. Location of the device is optimized to ensure reduced junction temperature and stress in the die subject to certain cooling air profile and other heat dissipating active components. In the second example thermo-mechanical simulations of solder creep deformations are presented to predict flip-chip reliability and subsequently used to optimise the life-time of solder interconnects under thermal cycling.

Modelling the effect of temperature on product reliability

Reliability of electronic parts is a major concern for many manufacturers, since early failures in the field can cost an enormous amount to repair - in many cases far more than the original cost of the product. A great deal of effort is expended by manufacturers to determine the failure rates for a process or the fraction of parts that will fail in a period of time. It is widely recognized that the traditional approach to reliability predictions for electronic systems are not suitable for today's products. This approach, based on statistical methods only, does not address the physics governing the failure mechanisms in electronic systems. This paper discusses virtual prototyping technologies which can predict the physics taking place and relate this to appropriate failure mechanisms. Simulation results illustrate the effect of temperature on the assembly process of an electronic package and the lifetime of a flip-chip package.

Virtual manufacturing and design in the real world - implementation and scalability on HPPC systems

Virtual manufacturing and design assessment increasingly involve the simulation of interacting phenomena, sic. multi-physics, an activity which is very computationally intensive. This chapter describes an attempt to address the parallel issues associated with a multi-physics simulation approach based upon a range of compatible procedures operating on one mesh using a single database - the distinct physics solvers can operate separately or coupled on sub-domains of the whole geometric space. Moreover, the finite volume unstructured mesh solvers use different discretization schemes (and, particularly, different ‘nodal’ locations and control volumes). A two-level approach to the parallelization of this simulation software is described: the code is restructured into parallel form on the basis of the mesh partitioning alone, that is, without regard to the physics. However, at run time, the mesh is partitioned to achieve a load balance, by considering the load per node/element across the whole domain. The latter of course is determined by the problem specific physics at a particular location.

The specification and design of an interactive virtual environment for use in teacher training

The original concept was to create a 'simulation' which would provide trainee teachers, specializing in Information and Communications Technology (ICT) with the opportunity to explore a primary school environment. Within the simulation, factors affecting the development and implementation of ICT would be modelled so that trainees would be able to develop the skills, knowledge and understanding necessary to identify appropriate strategies to overcome the limitations. To this end, we have developed Allsorts Primary - the prototype of a simulated interactive environment, representing a typical primary school

Powering the virtual university with standard portal technology

This article describes ongoing research on developing a portal framework based on the OASIS Web Services for Remote Portlets (WSRP) standard for integration of Web-based education contents and services made available through a model for a European Networked University. We first identify the requirements for such a framework that supports integration at the presentation level and collaboration in developing and updating study programmes and course materials. We then outline the architecture design, and report on the initial implementation and preliminary evaluation.

Optimisation modelling for design of advanced interconnects

This paper describes a computational strategy for virtual design and prototyping of electronic components and assemblies. The design process is formulated as a design optimisation problem. The solution of this problem identifies not only the design which meets certain user specified requirements but also the design with the maximum possible improvement in particular aspects such as reliability, cost, etc. The modelling approach exploits numerical techniques for computational analysis (Finite Element Analysis) integrated with numerical methods for approximation, statistical analysis and optimisation. A software framework of modules that incorporates the required numerical techniques is developed and used to carry out the design optimisation modelling of fine-pitch flip-chip lead free solder interconnects.

Multiphysics simulation of microwave curing in micro-electronics packaging applications

Purpose – This paper aims to present an open-ended microwave curing system for microelectronics components and a numerical analysis framework for virtual testing and prototyping of the system, enabling design of physical prototypes to be optimized, expediting the development process. Design/methodology/approach – An open-ended microwave oven system able to enhance the cure process for thermosetting polymer materials utilised in microelectronics applications is presented. The system is designed to be mounted on a precision placement machine enabling curing of individual components on a circuit board. The design of the system allows the heating pattern and heating rate to be carefully controlled optimising cure rate and cure quality. A multi-physics analysis approach has been adopted to form a numerical model capable of capturing the complex coupling that exists between physical processes. Electromagnetic analysis has been performed using a Yee finite-difference time-domain scheme, while an unstructured finite volume method has been utilized to perform thermophysical analysis. The two solvers are coupled using a sampling-based cross-mapping algorithm. Findings – The numerical results obtained demonstrate that the numerical model is able to obtain solutions for distribution of temperature, rate of cure, degree of cure and thermally induced stresses within an idealised polymer load heated by the proposed microwave system. Research limitations/implications – The work is limited by the absence of experimentally derived material property data and comparative experimental results. However, the model demonstrates that the proposed microwave system would seem to be a feasible method of expediting the cure rate of polymer materials. Originality/value – The findings of this paper will help to provide an understanding of the behaviour of thermosetting polymer materials during microwave cure processing.

Modelling and prototyping the conceptual design of 3D CMM micro-probe

This paper details the prototyping of a novel three axial micro probe based on utilisation of piezoelectric sensors and actuators for true three dimensional metrology and measurements at micro- and nanometre scale. Computational mechanics is used first to model and simulate the performance of the conceptual design of the micro-probe. Piezoelectric analysis is conducted to understand performance of three different materials - silicon, glassy carbon, and nickel - and the effect of load parameters (amplitude, frequency, phase angle) on the magnitude of vibrations. Simulations are also used to compare several design options for layout of the lead zirconium titanate (PZT) sensors and to identify the most feasible from fabrication point of view design. The material options for the realisation of the device have been also tested. Direct laser machining was selected as the primary means of production. It is found that a Yb MOPA based fiber laser was capable of providing the necessary precision on glassy carbon (GC), although machining trials on Si and Ni were less successful due to residual thermal effects.To provide the active and sensing elements on the flexures of the probe, PZT thick films are developed and deposited at low temperatures (Lt720 degC) allowing a high quality functional ceramic to be directly integrated with selected materials. Characterisation of the materials has shown that the film has a homogenous and small pore microstructure.

Virtual assignments: breach of covenant against parting with or sharing of possession

Comments on the Chancery Division decision in Clarence House Ltd v National Westminster Bank Plc on whether the alienation covenant in a lease of commercial premises had been breached by the tenant effecting a virtual assignment of it, under which all the economic benefits and burdens of the lease were transferred to a third party without there being any actually assignment of the leasehold interest or change in occupancy.

Delivering processing instruction in classroom and virtual contexts

Processing Instruction (PI) is an approach to grammar instruction for second language learning. It derives its name from the fact that the instruction (both the explicit explanation as well as the practices) attempt to influence, alter, and/or improve the way learners process input. PI contrasts with traditional grammar instruction in many ways, most principally in its focus on input whereas traditional grammar instruction focuses on learners' output. The greatest contribution of PI to both theory and practice is the concept of "structured input", a form of comprehensible input that has been manipulated to maximize learners' benefit of exposure to input. This volume focuses on a new issue for PI, the role of technology in language learning. It examines empirically the differential effects of delivering PI in classrooms with an instructor and students interacting (with each other and with the instructor) versus on computers to students working individually. It also contributes to the growing body of research on the effects of PI on different languages as well as different linguistic items: preterite/imperfect aspectual contrast and negative informal commands in Spanish, the subjunctive of doubt and opinion in Italian, and the subjunctive of doubt in French. Further research contributions are made by comparing PI with other types of instruction, specifically, with meaning-oriented output instruction.

Engineering design knowledge management in de-centralised virtual enterprises

The problems of collaborative engineering design and knowledge management at the conceptual stage in a network of dissimilar enterprises was investigated. This issue in engineering design is a result of the supply chain and virtual enterprise (VE) oriented industry that demands faster time to market and accurate cost/manufacturing analysis from conception. The solution consisted of a de-centralised super-peer net architecture to establish and maintain communications between enterprises in a VE. In the solution outlined below, the enterprises are able to share knowledge in a common format and nomenclature via the building-block shareable super-ontology that can be tailored on a project by project basis, whilst maintaining the common nomenclature of the ‘super-ontology’ eliminating knowledge interpretation issues. The two-tier architecture layout of the solution glues together the peer-peer and super-ontologies to form a coherent system for both internal and virtual enterprise knowledge management and product development.

Slicing issues in CAD translation to STL in rapid prototyping

The rapid prototyping (RP) process is being used widely with great potential for rapid manufacturing of functional parts. The RP process involves translation of the CAD file to STL format followed by slicing of the model into multiple horizontal layers, each of which is reproduced physically in making the prototype. The thickness of the resulting slices has a profound effect on the surface finish and build time of the prototype. The purpose of this paper is to show the effects of slice thickness on the surface finish, layering error, and build time of a prototype, as well as to show how an efficient STL file can be developed. Three objects were modeled and STL files were generated. One STL file for each object was sliced using different slice thicknesses, and the build times were obtained. Screenshots were used to show the slicing effect on layering error and surface finish and to demonstrate the means to a more efficient STL file. From the results, it is clear that the surface finish and build time are important factors that are affected by slice thickness