Traffic policing in ATM networks with multimedia traffic: the super leaky bucket

Traffic policing and bandwidth management strategies at the User Network Interface (UNI) of an ATM network are investigated by simulation. The network is assumed to transport real time (RT) traffic like voice and video as well as non-real time (non-RT) data traffic. The proposed policing function, called the super leaky bucket (S-LB), is based on the leaky bucket (LB), but handles the three types of traffic differently according to their quality of service (QoS) requirements. Separate queues are maintained for RT and non-RT traffic. They are normally served alternately, but if the number of RT cells exceeds a threshold, it gets non-pre-emptive priority. Further increase of the RT queue causes low priority cells to be discarded. Non-RT cells are buffered and the sources are throttled back during periods of congestion. The simulations clearly demonstrate the advantages of the proposed strategy in providing improved levels of service (delay, jitter and loss) for all types of traffic.

Modeling the structural breakdown of solder paste using the structural kinetic model

Solder paste is the most important strategic bonding material used in the assembly of surface mount devices in electronic industries. It is known to exhibit a thixotropic behavior, which is recognized by the decrease in apparent viscosity of paste material with time when subjected to a constant shear rate. The proper characterization of this time-dependent rheological behavior of solder pastes is crucial for establishing the relationships between the pastes structure and flow behavior; and for correlating the physical parameters with paste printing performance. In this article, we present a novel method which has been developed for characterizing the time-dependent and non-Newtonian rheological behavior of solder pastes and flux mediums as a function of shear rates. We also present results of the study of the rheology of the solder pastes and flux mediums using the structural kinetic modeling approach, which postulates that the network structure of solder pastes breaks down irreversibly under shear, leading to time and shear-dependent changes in the flow properties. Our results show that for the solder pastes used in the study, the rate and extent of thixotropy was generally found to increase with increasing shear rate. The technique demonstrated in this study has wide utility for R&D personnel involved in new paste formulation, for implementing quality control procedures used in solder-paste manufacture and packaging; and for qualifying new flip-chip assembly lines.