7 resultados para Thick
em Greenwich Academic Literature Archive - UK
Resumo:
We consider the problem of finding the heat distribution and the shape of the liquid fraction during laser welding of a thick steel plate using the finite volume CFD package PHYSICA. Since the shape of the keyhole is not known in advance, the following two-step approach to handling this problem has been employed. In the first stage, we determine the geometry of the keyhole for the steady-state case and form an appropriate mesh that includes both the workpiece and the keyhole. In the second stage, we impose the boundary conditions by assigning temperature to the walls of the keyhole and find the heat distribution and the shape of the liquid fraction for a given welding speed and material properties. We construct a fairly accurate approximation of the keyhole as a sequence of include sliced cones. A formula for finding the initial radius of the keyhole is derived by determining the radius of the vaporisation isotherm for the line heat source. We report on the results of a series of computational experiments for various heat input values and welding velocities.
Resumo:
Micromagnetic ripple structures on the surfaces of thick specimens of ultra-soft magnetic material having strong surface anisotropy Ks favouring out-of-surface magnetization have been calculated. These ripples have wavelengths of the order of 0.1 μm and extend to a depth ∼ √A/Ms, where A is the exchange constant and Ms is the saturation magnetization. The wave-vectors of the ripple structures are either transverse or parallel to the bulk magnetization. Both structures have lower energy than the one-dimensional structure discussed by O'Handley and Woods, and they exhibit stronger normal magnetization. The transverse structure requires a surface anisotropy Ks ≥ 0.80K0, where is that required for the one-dimensional structure. The threshold for longitudinal ripples is 0.84K0. It is suggested that the transverse structure probably constitutes the ground state. The magnitudes of Ks and A should be obtainable from measurements of the ripple wavelength and amplitude, and Ms.
Resumo:
In this paper, thermal cycling reliability along with ANSYS analysis of the residual stress generated in heavy-gauge Al bond wires at different bonding temperatures is reported. 99.999% pure Al wires of 375 mum in diameter, were ultrasonically bonded to silicon dies coated with a 5mum thick Al metallisation at 25degC (room temperature), 100degC and 200degC, respectively (with the same bonding parameters). The wire bonded samples were then subjected to thermal cycling in air from -60degC to +150degC. The degradation rate of the wire bonds was assessed by means of bond shear test and via microstructural characterisation. Prior to thermal cycling, the shear strength of all of the wire bonds was approximately equal to the shear strength of pure aluminum and independent of bonding temperature. During thermal cycling, however, the shear strength of room temperature bonded samples was observed to decrease more rapidly (as compared to bonds formed at 100degC and 200degC) as a result of a high crack propagation rate across the bonding area. In addition, modification of the grain structure at the bonding interface was also observed with bonding temperature, leading to changes in the mechanical properties of the wire. The heat and pressure induced by the high temperature bonding is believed to promote grain recovery and recrystallisation, softening the wires through removal of the dislocations and plastic strain energy. Coarse grains formed at the bonding interface after bonding at elevated temperatures may also contribute to greater resistance for crack propagation, thus lowering the wire bond degradation rate
Resumo:
The effect of current stressing on the reliability of 63Sn37Pb solder joints with Cu pads was investigated at temperatures of −5 °C and 125 °C up to 600 h. The samples were stressed with 3 A current (6.0 × 102 A/cm2 in the solder joint with diameter of 800 μm and 1.7 × 104 A/cm2 in the Cu trace with cross section area of 35 × 500 μm). The temperatures of the samples and interfacial reaction within the solder joints were examined. The microstructural change of the solder joints aged at 125 °C without current flow was also evaluated for comparison. It was confirmed that the current flow could cause the temperature of solder joints to rise rapidly and remarkably due to accumulation of massive Joule heat generated by the Cu trace. The solder joints stressed at 125 °C with 3 A current had an extensive growth of Cu6Sn5 and Cu3Sn intermetallic compounds (IMC) at both top and bottom solder-to-pad interfaces. It was a direct result of accelerated aging rather than an electromigration or thermomigration effect in this experiment. The kinetic is believed to be bulk diffusion controlled solid-state reaction, irrespective of the electron flow direction. When stressed at −5 °C with 3 A current, no significant change in microstructure and composition of the solder joints had occurred due to a very low diffusivity of the atoms as most Joule heat was eliminated at low temperature. The IMC evolution of the solder joints aged at 125 °C exhibited a subparabolic growth behavior, which is presumed to be a combined mechanism of grain boundary diffusion and bulk diffusion. This is mainly ascribed to the retardant effect against the diffusion course by the sufficiently thick IMC layer that was initially formed during the reflow soldering.
Resumo:
This paper details the prototyping of a novel three axial micro probe based on utilisation of piezoelectric sensors and actuators for true three dimensional metrology and measurements at micro- and nanometre scale. Computational mechanics is used first to model and simulate the performance of the conceptual design of the micro-probe. Piezoelectric analysis is conducted to understand performance of three different materials - silicon, glassy carbon, and nickel - and the effect of load parameters (amplitude, frequency, phase angle) on the magnitude of vibrations. Simulations are also used to compare several design options for layout of the lead zirconium titanate (PZT) sensors and to identify the most feasible from fabrication point of view design. The material options for the realisation of the device have been also tested. Direct laser machining was selected as the primary means of production. It is found that a Yb MOPA based fiber laser was capable of providing the necessary precision on glassy carbon (GC), although machining trials on Si and Ni were less successful due to residual thermal effects.To provide the active and sensing elements on the flexures of the probe, PZT thick films are developed and deposited at low temperatures (Lt720 degC) allowing a high quality functional ceramic to be directly integrated with selected materials. Characterisation of the materials has shown that the film has a homogenous and small pore microstructure.
Resumo:
Image inpainting refers to restoring a damaged image with missing information. The total variation (TV) inpainting model is one such method that simultaneously fills in the regions with available information from their surroundings and eliminates noises. The method works well with small narrow inpainting domains. However there remains an urgent need to develop fast iterative solvers, as the underlying problem sizes are large. In addition one needs to tackle the imbalance of results between inpainting and denoising. When the inpainting regions are thick and large, the procedure of inpainting works quite slowly and usually requires a significant number of iterations and leads inevitably to oversmoothing in the outside of the inpainting domain. To overcome these difficulties, we propose a solution for TV inpainting method based on the nonlinear multi-grid algorithm.
Resumo:
OBJECTIVE: The aim of this study was to investigate how the release of fluoride from two compomers and a fluoridated composite resin was affected by exposure to KF solution. MATERIAL AND METHODS: Two compomers (Dyract AP and Compoglass F) and one fluoridated composite (Wave) were prepared as discs (6 mm diameter and 2 mm thick), curing with a standard dental lamp. They were then stored in either water or 0.5% KF for 1 week, followed by placement in water for periods of 1 week up to 5 weeks total. Fluoride was determined with and without TISAB (to allow complexed and decomplexed fluoride to be determined), and other ion release (Na, Ca, Al, Si, P) was determined by ICP-OES. RESULTS: Specimens were found not to take up fluoride from 100 ppm KF solution in 24 h, but to release additional fluoride when stored for up to five weeks. Compomers released more fluoride cumulatively following exposure to KF solution (p<0.001), all of which was decomplexed, though initial (1 week) values were not statistically significant for Dyract AP. Other ions showed no variations in release over 1 week, regardless of whether the specimens were exposed to KF. Unlike the compomers, Wave showed no change in fluoride release as a result of exposure to KF. CONCLUSIONS: Compomers are affected by KF solution, and release more fluoride (but not other ions) after exposure than if stored in water.