Wall-slip effects in SnAgCu solder pastes used in electronics assembly applications

Solder paste is the most important strategic bonding material used in the assembly of surface mount components in electronics manufacturing. As the trend towards miniaturisation of electronic products continues, there is an increasing demand for better understanding of the flow and deformation that is, the rheological behaviour of solder paste formulations. Wall slip plays an important role in characterising the flow behaviour of solder paste materials. The problem of wall slip arises due to the various attractive and repulsive forces acting between the solder particles and the walls of the measuring geometry. These interactions could lead to the presence of a thin solvent layer adjacent to the wall, which gives rise to slippage. In rheological measurements, slip effects can generally be avoided by using roughened surfaces for measuring geometries. In this paper, a novel technique is developed to study the effect of wall slip in the rheological measurements of lead-free solder paste. The viscosity and oscillatory data obtained for three different solder paste samples (from measuring geometries of different surface roughness) havebeen analysed and compared. In viscosity measurements, slip effects were dominant at low shear rates and the use of serrated surfaces was found to be quite effective in minimizing slip effects. Oscillatory measurements were also affected by roughening the surfaces of measuring geometries.

Start-up and running forces on bulk solids feeders: experimental findings versus available models

Many different models have been postulated over the years for sizing of feeder drives; these models have different bases, some rationally based and others more rule-of-thumb. Experience of Jenike & Johanson and likewise of The Wolfson Centre in trouble-shooting feeder drives has shown that drive powers are often poorly matched, so there is clearly still some way to go towards establishing a universally-used reliable approach. This paper presents an on-going programme of work designed to measure feeder forces experimentally on a purpose designed testing rig, and to compare these against some of the best known available models, and also against a full size installation. One aspect which is novel is the monitoring of the transition between the “filling stress field” load on the feeder and the “flowing stress field” load.