Zone based systems design framework for the realisation of efficient block cipher based message authentication code algorithms

A zone based systems design framework is described and utilised in the implementation of a message authentication code (MAC) algorithm based on symmetric key block ciphers. The resulting block cipher based MAC algorithm may be used to provide assurance of the authenticity and, hence, the integrity of binary data. Using software simulation to benchmark against the de facto cipher block chaining MAC (CBC-MAC) variant used in the TinySec security protocol for wireless sensor networks and the NIST cipher block chaining MAC standard, CMAC; we show that our zone based systems design framework can lead to block cipher based MAC constructs that point to improvements in message processing efficiency, processing throughput and processing latency.

Conference report: 7th Annual Congress of International Drug Discovery Science and Technology

This is a report on the 7th Annual Congress of International Drug Discovery Science and Technology held in Shanghai, China from 22–25 October, 2009. The conference, organized by BIT Life Sciences, comprised several parallel sessions, keynote presentations and a selection of selection of 20-minute presentations covering a range of therapeutic areas, including general medicinal chemistry, oncology, inflammation, receptors and ion channels, drug, metabolism and pharmokinetics, and fragment-based drug discovery. There were also sessions devoted to genomics, biomarkers, immunology, cell biology, molecular imaging and biochips. Supported by an exhibition of services/products and posters, the conference underlined the marked presence of Asian CROs.

Thermal, mechanical and optical modelling of VCSEL packaging

Hybrid OECB (Opto-Electrical Circuit Boards) are expected to make a significant impact in the telecomm switches arena within the next five years, creating optical backplanes with high speed point-to-point optical interconnects. OECB's incorporate short range optical interconnects, and are based on VCSEL (Vertical Cavity Surface Emitting Diode) and PD (Photo Diode) pairs, connected to each other via embedded waveguides in the OECB. The VCSEL device is flip-chip assembled onto an organic substrate with embedded optical waveguides. The performance of the VCSEL device is governed by the thermal, mechanical and optical characteristics of this assembly. During operation, the VCSEL device will heat up and the thermal change together with the CTE mismatch in the materials, will result in potential misalignment between the VCSEL apertures and the waveguide openings in the substrate. Any degree of misalignment will affect the optical performance of the package. This paper will present results from a highly coupled modelling analysis involving thermal, mechanical and optical models. The paper will also present results from an optimisation analysis based on Design of Experiments (DOE).

Modelling the behavior of solder joints for wafer level SiP

Design for manufacture of system-in-package (SiP) structures is dependent on a number of physical processes that affect the final quality of the package in terms of its performance and reliability. Solder joints are key structures in a SiP and their behavior can be the critical factor in terms of reliability. This paper discusses the results from a research programme on design for manufacturing of system in package (SiP) technologies. The focus of the paper is on thermo-mechanical modelling of solder joints. This includes the behavior of the joints during testing plus some important insights into the reflow process and how physical phenomena taking place at the assembly stage can affect solder joint behavior. Finite element analysis of a numerical model of an SiP structure with various design parameters is discussed. The goal of this analysis is to identify the most promising combination of design parameters which guarantee longer lifetime of the solder joints and hence the SiP component. The parameters that were studied are the size of the package (i.e. number of solder joints per row), the presence of the underfill and/or the reinforcement as well as the thickness of the passive die. Discussion was also provided on phenomena that take place during the reflow process where the solder joints are formed. In particular, the formation of intermetallics at the solder-pad interfaces