High current density induced damage mechanisms in electronic solder joints: a state-of-the-art review

High current density induced damages such as electromigration in the on-chip interconnection /metallization of Al or Cu has been the subject of intense study over the last 40 years. Recently, because of the increasing trend of miniaturization of the electronic packaging that encloses the chip, electromigration as well as other high current density induced damages are becoming a growing concern for off-chip interconnection where low melting point solder joints are commonly used. Before long, a huge number of publications have been explored on the electromigration issue of solder joints. However, a wide spectrum of findings might confuse electronic companies/designers. Thus, a review of the high current induced damages in solder joints is timely right this moment. We have selected 6 major phenomena to review in this paper. They are (i) electromigration (mass transfer due electron bombardment), (ii) thermomigration (mass transfer due to thermal gradient), (iii) enhanced intermetallic compound growth, (iv) enhanced current crowding, (v) enhanced under bump metallisation dissolution and (vi) high Joule heating and (vii) solder melting. the damage mechanisms under high current stressing in the tiny solder joint, mentioned in the review article, are significant roadblocks to further miniaturization of electronics. Without through understanding of these failure mechanisms by experiments coupled with mathematical modeling work, further miniaturization in electronics will be jeopardized

Experimental study of the effectiveness of emergency signage

Signage systems play an important role in aiding occupants during both circulation and evacuation. Despite the fact that signage systems are an important component in building wayfinding systems, there is a lack of relevant data regarding how occupants detect, interpret and use the information conveyed by emergency signage. The effectiveness of signage systems is therefore difficult to assess. In this paper we address this issue through experimentation. The experiment involved measuring the impact of a signage system on a population of 68 test subjects who were instructed to individually vacate a building as quickly as possible via any means they thought appropriate. The evacuation path involved a number of decision points at which emergency signage was available to identify the appropriate path. Through analysis of video footage and data derived from questionnaires, the number of people who saw and utilised the signage information to assist their egress is determined. The results are then incorporated within the buildingEXODUS software and used in a demonstration of agent interaction with signage systems in a hypothetical evacuation scenario.