Evaluation of loadsharing algorithms for heterogeneous distributed systems

The performance of loadsharing algorithms for heterogeneous distributed systems is investigated by simulation. The systems considered are networks of workstations (nodes) which differ in processing power. Two parameters are proposed for characterising system heterogeneity, namely the variance and skew of the distribution of processing power among the network nodes. A variety of networks are investigated, with the same number of nodes and total processing power, but with the processing power distributed differently among the nodes. Two loadsharing algorithms are evaluated, at overall system loadings of 50% and 90%, using job response time as the performance metric. Comparison is made with the ideal situation of ‘perfect sharing’, where it is assumed that the communication delays are zero and that complete knowledge is available about job lengths and the loading at the different nodes, so that an arriving job can be sent to the node where it will be completed in the shortest time. The algorithms studied are based on those already in use for homogeneous networks, but were adapted to take account of system heterogeneity. Both algorithms take into account the differences in the processing powers of the nodes in their location policies, but differ in the extent to which they ‘discriminate’ against the slower nodes. It is seen that the relative performance of the two is strongly influenced by the system utilisation and the distribution of processing power among the nodes.

Modelling the behavior of solder joints for wafer level SiP

Design for manufacture of system-in-package (SiP) structures is dependent on a number of physical processes that affect the final quality of the package in terms of its performance and reliability. Solder joints are key structures in a SiP and their behavior can be the critical factor in terms of reliability. This paper discusses the results from a research programme on design for manufacturing of system in package (SiP) technologies. The focus of the paper is on thermo-mechanical modelling of solder joints. This includes the behavior of the joints during testing plus some important insights into the reflow process and how physical phenomena taking place at the assembly stage can affect solder joint behavior. Finite element analysis of a numerical model of an SiP structure with various design parameters is discussed. The goal of this analysis is to identify the most promising combination of design parameters which guarantee longer lifetime of the solder joints and hence the SiP component. The parameters that were studied are the size of the package (i.e. number of solder joints per row), the presence of the underfill and/or the reinforcement as well as the thickness of the passive die. Discussion was also provided on phenomena that take place during the reflow process where the solder joints are formed. In particular, the formation of intermetallics at the solder-pad interfaces

"System in package technology" - design for manufacture challenges

Purpose – To present key challenges associated with the evolution of system-in-package technologies and present technical work in reliability modeling and embedded test that contributes to these challenges. Design/methodology/approach – Key challenges have been identified from the electronics and integrated MEMS industrial sectors. Solutions to optimising the reliability of a typical assembly process and reducing the cost of production test have been studied through simulation and modelling studies based on technology data released by NXP and in collaboration with EDA tool vendors Coventor and Flomerics. Findings – Characterised models that deliver special and material dependent reliability data that can be used to optimize robustness of SiP assemblies together with results that indicate relative contributions of various structural variables. An initial analytical model for solder ball reliability and a solution for embedding a low cost test for a capacitive RF-MEMS switch identified as an SiP component presenting a key test challenge. Research limitations/implications – Results will contribute to the further development of NXP wafer level system-in-package technology. Limitations are that feedback on the implementation of recommendations and the physical characterisation of the embedded test solution. Originality/value – Both the methodology and associated studies on the structural reliability of an industrial SiP technology are unique. The analytical model for solder ball life is new as is the embedded test solution for the RF-MEMS switch.

Self-optimising data farming for web applications

Many Web applications walk the thin line between the need for dynamic data and the need to meet user performance expectations. In environments where funds are not available to constantly upgrade hardware inline with user demand, alternative approaches need to be considered. This paper introduces a ‘Data farming’ model whereby dynamic data, which is ‘grown’ in operational applications, is ‘harvested’ and ‘packaged’ for various consumer markets. Like any well managed agricultural operation, crops are harvested according to historical and perceived demand as inferred by a self-optimising process. This approach aims to make enhanced use of available resources through better utlilisation of system downtime - thereby improving application performance and increasing the availability of key business data.

Flexible and robust run-time configuration for self-managing systems

This paper describes a methodology for deploying flexible dynamic configuration into embedded systems whilst preserving the reliability advantages of static systems. The methodology is based on the concept of decision points (DP) which are strategically placed to achieve fine-grained distribution of self-management logic to meet application-specific requirements. DP logic can be changed easily, and independently of the host component, enabling self-management behavior to be deferred beyond the point of system deployment. A transparent Dynamic Wrapper mechanism (DW) automatically detects and handles problems arising from the evaluation of self-management logic within each DP and ensures that the dynamic aspects of the system collapse down to statically defined default behavior to ensure safety and correctness despite failures. Dynamic context management contributes to flexibility, and removes the need for design-time binding of context providers and consumers, thus facilitating run-time composition and incremental component upgrade.