Emergence: a paradigm for robust and scalable distributed applications

Natural distributed systems are adaptive, scalable and fault-tolerant. Emergence science describes how higher-level self-regulatory behaviour arises in natural systems from many participants following simple rulesets. Emergence advocates simple communication models, autonomy and independence, enhancing robustness and self-stabilization. High-quality distributed applications such as autonomic systems must satisfy the appropriate nonfunctional requirements which include scalability, efficiency, robustness, low-latency and stability. However the traditional design of distributed applications, especially in terms of the communication strategies employed, can introduce compromises between these characteristics. This paper discusses ways in which emergence science can be applied to distributed computing, avoiding some of the compromises associated with traditionally-designed applications. To demonstrate the effectiveness of this paradigm, an emergent election algorithm is described and its performance evaluated. The design incorporates nondeterministic behaviour. The resulting algorithm has very low communication complexity, and is simultaneously very stable, scalable and robust.

Natural inspiration for self-adaptive systems

The emergent behaviour of autonomic systems, together with the scale of their deployment, impedes prediction of the full range of configuration and failure scenarios; thus it is not possible to devise management and recovery strategies to cover all possible outcomes. One solution to this problem is to embed self-managing and self-healing abilities into such applications. Traditional design approaches favour determinism, even when unnecessary. This can lead to conflicts between the non-functional requirements. Natural systems such as ant colonies have evolved cooperative, finely tuned emergent behaviours which allow the colonies to function at very large scale and to be very robust, although non-deterministic. Simple pheromone-exchange communication systems are highly efficient and are a major contribution to their success. This paper proposes that we look to natural systems for inspiration when designing architecture and communications strategies, and presents an election algorithm which encapsulates non-deterministic behaviour to achieve high scalability, robustness and stability.

"System in package technology" - design for manufacture challenges

Purpose – To present key challenges associated with the evolution of system-in-package technologies and present technical work in reliability modeling and embedded test that contributes to these challenges. Design/methodology/approach – Key challenges have been identified from the electronics and integrated MEMS industrial sectors. Solutions to optimising the reliability of a typical assembly process and reducing the cost of production test have been studied through simulation and modelling studies based on technology data released by NXP and in collaboration with EDA tool vendors Coventor and Flomerics. Findings – Characterised models that deliver special and material dependent reliability data that can be used to optimize robustness of SiP assemblies together with results that indicate relative contributions of various structural variables. An initial analytical model for solder ball reliability and a solution for embedding a low cost test for a capacitive RF-MEMS switch identified as an SiP component presenting a key test challenge. Research limitations/implications – Results will contribute to the further development of NXP wafer level system-in-package technology. Limitations are that feedback on the implementation of recommendations and the physical characterisation of the embedded test solution. Originality/value – Both the methodology and associated studies on the structural reliability of an industrial SiP technology are unique. The analytical model for solder ball life is new as is the embedded test solution for the RF-MEMS switch.

Computational approach for reliable and robust system-in-package design

A computational modelling approach integrated with optimisation and statistical methods that can aid the development of reliable and robust electronic packages and systems is presented. The design for reliability methodology is demonstrated for the design of a SiP structure. In this study the focus is on the procedure for representing the uncertainties in the package design parameters, their impact on reliability and robustness of the package design and how these can be included in the design optimisation modelling framework. The analysis of thermo-mechanical behaviour of the package is conducted using non-linear transient finite element simulations. Key system responses of interest, the fatigue life-time of the lead-free solder interconnects and warpage of the package, are predicted and used subsequently for design purposes. The design tasks are to identify the optimal SiP designs by varying several package input parameters so that the reliability and the robustness of the package are improved and in the same time specified performance criteria are also satisfied