Design and modeling challenges for high density packaging

Today most of the IC and board designs are undertaken using two-dimensional graphics tools and rule checks. System-in-package is driving three-dimensional design concepts and this is posing a number of challenges for electronic design automation (EDA) software vendors. System-in-package requires three-dimensional EDA tools and design collaboration systems with appropriate manufacturing and assembly rules for these expanding technologies. Simulation and Analysis tools today focus on one aspect of the design requirement, for example, thermal, electrical or mechanical. System-in-Package requires analysis and simulation tools that can easily capture the complex three dimensional structures and provided integrated fast solutions to issues such as thermal management, reliability, electromagnetic interference, etc. This paper discusses some of the challenges faced by the design and analysis community in providing appropriate tools to engineers for System-in-Package design

Deriving explanations from partial temporal information

The representation and manipulation of natural human understanding of temporal phenomena is a fundamental field of study in Computer Science, which aims both to emulate human thinking, and to use the methods of human intelligence to underpin engineering solutions. In particular, in the domain of Artificial Intelligence, temporal knowledge may be uncertain and incomplete due to the unavailability of complete and absolute temporal information. This paper introduces an inferential framework for deriving logical explanations from partial temporal information. Based on a graphical representation which allows expression of both absolute and relative temporal knowledge in incomplete forms, the system can deliver a verdict to the question if a given set of statements is temporally consistent or not, and provide understandable logical explanation of analysis by simplified contradiction and rule based reasoning.