Ultra-fine pitch flip-chip assembly using isotropic conductive adhesives

This paper discusses results from a highly interdisciplinary research project which investigated different packaging options for ultra-fine pitch, low temperature and low cost flip-chip assembly. Isotropic Conductive Adhesives (ICAs) are stencil printed to form the interconnects for the package. ICAs are utilized to ensure a low temperature assembly process of flip-chip copper column bumped packages. Results are presented on the structural integrity of novel electroformed stencils. ICA deposits at sub-100 micron pitch and the subsequent thermo-mechanical behaviour of the flip-chip ICA joints are analysed using numerical modelling techniques. Optimal design rules for enhanced performance and thermomechanical reliability of ICA assembled flip-chip packages are formulated.

Stencil printing at sub-100 microns pitch

This article presents the latest print results at less than 100 microns pitch obtained in stencil printing type 6 and 7 lead-free solder pastes and conductive adhesives. The advantages of the microengineered stencil arc presented and compared with other bonding technologies. Characterisation of the print deposits is presented and future applications of stencil printing are described.

Stencil printing at sub-100 microns pitch

This article presents the latest print results at less than 100 microns pitch obtained in stencil printing type 6 and 7 leadfree solder pastes and conductive adhesives. The advantages of the microengineered stencil are presented and compared with other bonding technologies. Characterisation of the print deposits is presented and future applications of stencil printing are described.

A hybrid fractal video compression method

Fractal image compression is a relatively recent image compression method. Its extension to a sequence of motion images is important in video compression applications. There are two basic fractal compression methods, namely the cube-based and the frame-based methods, being commonly used in the industry. However there are advantages and disadvantages in both methods. This paper proposes a hybrid algorithm highlighting the advantages of the two methods in order to produce a good compression algorithm for video industry. Experimental results show the hybrid algorithm improves the compression ratio and the quality of decompressed images.

Matching search in fractal video compression and its parallel implementation in distributed computing environments

Fractal video compression is a relatively new video compression method. Its attraction is due to the high compression ratio and the simple decompression algorithm. But its computational complexity is high and as a result parallel algorithms on high performance machines become one way out. In this study we partition the matching search, which occupies the majority of the work in a fractal video compression process, into small tasks and implement them in two distributed computing environments, one using DCOM and the other using .NET Remoting technology, based on a local area network consists of loosely coupled PCs. Experimental results show that the parallel algorithm is able to achieve a high speedup in these distributed environments.

Adaptive partition and hybrid method in fractal video compression

Fractal image compression is a relatively recent image compression method, which is simple to use and often leads to a high compression ratio. These advantages make it suitable for the situation of a single encoding and many decoding, as required in video on demand, archive compression, etc. There are two fundamental fractal compression methods, namely, the cube-based and the frame-based methods, being commonly studied. However, there are advantages and disadvantages in both methods. This paper gives an extension of the fundamental compression methods based on the concept of adaptive partition. Experimental results show that the algorithms based on adaptive partition may obtain a much higher compression ratio compared to algorithms based on fixed partition while maintaining the quality of decompressed images.

Computational modelling for reliable flip-chip packaging at sub-100 micron pitch using isotropic conductive adhesives

This paper presents the assembly process using next generation electroformed stencils and Isotropic Conductive Adhesives (ICAs) as interconnection material. The utilisation of ICAs in flip-chip assembly process is investigated as an alternative to the lead and lead-free solder alloys and aims to ensure a low temperature (T < 100 °C) assembly process. The paper emphasizes and discusses in details the assembly of a flip-chip package based on copper columns bumped die and substrate with stencil printed ICA deposits at sub-100 μm pitch. A computational modelling approach is undertaken to provide comprehensive results on reliability trends of ICA joints subject to thermal cycling of the flip-chip assembly based on easy to use damage criteria and damage evaluation. Important design parameters in the package are selected and investigated using numerical modelling techniques to provide knowledge and understanding of their impact on the thermo-mechanical behaviour of the flip-chip ICA joints. Sensitivity analysis of the damage in the adhesive material is also carried out. Optimal design rules for enhanced performance and improved thermo-mechanical reliability of ICA assembled flip-chip packages are finally formulated.

Ultra-fine pitch stencil printing for a low cost and low temperature flip-chip assembly process

This paper presents the results of a packaging process based on the stencil printing of isotropic conductive adhesives (ICAs) that form the interconnections of flip-chip bonded electronic packages. Ultra-fine pitch (sub-100-mum), low temperature (100degC), and low cost flip-chip assembly is demonstrated. The article details recent advances in electroformed stencil manufacturing that use microengineering techniques to enable stencil fabrication at apertures sizes down to 20mum and pitches as small as 30mum. The current state of the art for stencil printing of ICAs and solder paste is limited between 150-mum and 200-mum pitch. The ICAs-based interconnects considered in this article have been stencil printed successfully down to 50-mum pitch with consistent printing demonstrated at 90-mum pitch size. The structural integrity or the stencil after framing and printing is also investigated through experimentation and computational modeling. The assembly of a flip-chip package based on copper column bumped die and ICA deposits stencil printed at sub-100-mum pitch is described. Computational fluid dynamics modeling of the print performance provides an indicator on the optimum print parameters. Finally, an organic light emitting diode display chip is packaged using this assembly process

Design of parallel algorithms for fractal video compression

The intrinsic independent features of the optimal codebook cubes searching process in fractal video compression systems are examined and exploited. The design of a suitable parallel algorithm reflecting the concept is presented. The Message Passing Interface (MPI) is chosen to be the communication tool for the implementation of the parallel algorithm on distributed memory parallel computers. Experimental results show that the parallel algorithm is able to reduce the compression time and achieve a high speed-up without changing the compression ratio and the quality of the decompressed image. A scalability test was also performed, and the results show that this parallel algorithm is scalable.

Grey video compression methods using fractals

The authors' experience in the treatment of grey video compression using fractals is summarized and compared with other research in the same field. Experience with parallel and distributed computing is also discussed.

Character-angle based video annotation

A video annotation system includes clips organization, feature description and pattern determination. This paper aims to present a system for basketball zone-defence detection. Particularly, a character-angle based descriptor for feature description is proposed. The well-performed experimental results in basketball zone-defence detection demonstrate that it is robust for both simulations and real-life cases, with less sensitivity to the distribution caused by local translation of subprime defenders. Such a framework can be easily applied to other team-work sports.

Temporal pattern recognition in video clips detection

Temporal representation and reasoning plays an important role in Data Mining and Knowledge Discovery, particularly, in mining and recognizing patterns with rich temporal information. Based on a formal characterization of time-series and state-sequences, this paper presents the computational technique and algorithm for matching state-based temporal patterns. As a case study of real-life applications, zone-defense pattern recognition in basketball games is specially examined as an illustrating example. Experimental results demonstrate that it provides a formal and comprehensive temporal ontology for research and applications in video events detection.

Can the use of supplementary video and audio materials support student understanding of 3D animation? Some results, analysis and conclusions

A project within a computing department at the University of Greenwich, has been carried out to identify whether podcasting can be used to help understanding and learning of a subject (3D Animation). We know that the benefits of podcasting in education (HE) can be justified, [1]; [2]; [3]; [4]; [5]; [6] and that some success has been proven, but this paper aims to report the results of a term-long project that provided podcast materials for students to help support their learning using Xserve and Podcast Producer technology. Findings in a previous study [6] identified podcasting as a way to diversify learning and provde a more personalised learning experience for students, as well as being able to provide access to a greater mix of learning styles [7]. Finally this paper aims to present the method of capture and distribution, the methodologies of the study, analysis of results, and conclusions that relate to podcasting and enhanced supported learning.