Reliability analysis for power electronics modules

This paper discusses the reliability of power electronics modules. The approach taken combines numerical modeling techniques with experimentation and accelerated testing to identify failure modes and mechanisms for the power module structure and most importantly the root cause of a potential failure. The paper details results for two types of failure (i) wire bond fatigue and (ii) substrate delamination. Finite element method modeling techniques have been used to predict the stress distribution within the module structures. A response surface optimisation approach has been employed to enable the optimal design and parameter sensitivity to be determined. The response surface is used by a Monte Carlo method to determine the effects of uncertainty in the design.

Wire bond reliability for power electronic modules - effect of bonding temperature

In this paper, thermal cycling reliability along with ANSYS analysis of the residual stress generated in heavy-gauge Al bond wires at different bonding temperatures is reported. 99.999% pure Al wires of 375 mum in diameter, were ultrasonically bonded to silicon dies coated with a 5mum thick Al metallisation at 25degC (room temperature), 100degC and 200degC, respectively (with the same bonding parameters). The wire bonded samples were then subjected to thermal cycling in air from -60degC to +150degC. The degradation rate of the wire bonds was assessed by means of bond shear test and via microstructural characterisation. Prior to thermal cycling, the shear strength of all of the wire bonds was approximately equal to the shear strength of pure aluminum and independent of bonding temperature. During thermal cycling, however, the shear strength of room temperature bonded samples was observed to decrease more rapidly (as compared to bonds formed at 100degC and 200degC) as a result of a high crack propagation rate across the bonding area. In addition, modification of the grain structure at the bonding interface was also observed with bonding temperature, leading to changes in the mechanical properties of the wire. The heat and pressure induced by the high temperature bonding is believed to promote grain recovery and recrystallisation, softening the wires through removal of the dislocations and plastic strain energy. Coarse grains formed at the bonding interface after bonding at elevated temperatures may also contribute to greater resistance for crack propagation, thus lowering the wire bond degradation rate

Reliability of power electronic modules

The electric car, the all electric aircraft and requirements for renewable energy are examples of potential technologies needed to address the world problem of global warming/carbon emission etc. Power electronics and packaged modules are fundamental for the underpinning of these technologies and with the diverse requirements for electrical configurations and the range of environmental conditions, time to market is paramount for module manufacturers and systems designers alike. This paper details some of the results from a major UK project into the reliability of power electronic modules using physics of failure techniques. This paper presents a design methodology together with results that demonstrate enhanced product design with improved reliability, performance and value within acceptable time scales

Predicting the reliability of power electronic modules

This paper discusses the reliability of an IGBT power electronics module. This work is part of a major UK funded initiative into the design, packaging and reliability of power electronic modules. The predictive methodology combines numerical modeling techniques with experimentation and accelerated testing to identify failure modes and mechanisms for these type of power electronic module structures. The paper details results for solder joint failure substrate solder. Finite element method modeling techniques have been used to predict the stress and strain distribution within the module structures. Together with accelerated life testing, these results have provided a failure model for these joints which has been used to predict reliability of a rail traction application

A prognostic assessment method for power electronics modules

This paper describes a prognostic method which combines the physics of failure models with probability reasoning algorithm. The measured real time data (temperature vs. time) was used as the loading profile for the PoF simulations. The response surface equation of the accumulated plastic strain in the solder interconnect in terms of two variables (average temperature, and temperature amplitude) was constructed. This response surface equation was incorporated into the lifetime model of solder interconnect, and therefore the remaining life time of the solder component under current loading condition was predicted. The predictions from PoF models were also used to calculate the conditional probability table for a Bayesian Network, which was used to take into account of the impacts of the health observations of each product in lifetime prediction. The prognostic prediction in the end was expressed as the probability for the product to survive the expected future usage. As a demonstration, this method was applied to an IGBT power module used for aircraft applications.

Computer simulation of aluminium wirebonds with globtop in power electronics modules

In this paper, computer modelling techniques are used to analyse the effects of globtops on the reliability of aluminium wirebonds in power electronics modules under cyclic thermal-mechanical loading conditions. The sensitivity of the wirehond reliability to the changes of the geometric and the material property parameters of wirebond globtop are evaluated and the optimal combination of the Young's modulus and the coefficient of thermal expansion have been predicted.

Integrated reliability and prognostics prediction methodology for power electronic modules

The article consists of a PowerPoint presentation on integrated reliability and prognostics prediction methodology for power electronic modules. The areas discussed include: power electronics flagship; design for reliability; IGBT module; design for manufacture; power module components; reliability prediction techniques; failure based reliability; etc.

Predictive reliability, prognostics and risk assessment for power modules

This paper describes a framework that is being developed for the prediction and analysis of electronics power module reliability both for qualification testing and in-service lifetime prediction. Physics of failure (PoF) reliability methodology using multi-physics high-fidelity and reduced order computer modelling, as well as numerical optimization techniques, are integrated in a dedicated computer modelling environment to meet the needs of the power module designers and manufacturers as well as end-users for both design and maintenance purposes. An example of lifetime prediction for a power module solder interconnect structure is described. Another example is the lifetime prediction of a power module for a railway traction control application. Also in the paper a combined physics of failure and data trending prognostic methodology for the health monitoring of power modules is discussed.