Thermal-mechanical modelling of power electronic module packaging

In this paper the reliability of the isolation substrate and chip mountdown solder interconnect of power modules under thermal-mechanical loading has been analysed using a numerical modelling approach. The damage indicators such as the peel stress and the accumulated plastic work density in solder interconnect are calculated for a range of geometrical design parameters, and the effects of these parameters on the reliability are studied by using a combination of the finite element analysis (FEA) method and optimisation techniques. The sensitivities of the reliability of the isolation substrate and solder interconnect to the changes of the design parameters are obtained and optimal designs are studied using response surface approximation and gradient optimization method

Artificial neural networks in modelling osmotic dehydration of foods

Artificial neural network (ANN) models for water loss (WL) and solid gain (SG) were evaluated as potential alternative to multiple linear regression (MLR) for osmotic dehydration of apple, banana and potato. The radial basis function (RBF) network with a Gaussian function was used in this study. The RBF employed the orthogonal least square learning method. When predictions of experimental data from MLR and ANN were compared, an agreement was found for ANN models than MLR models for SG than WL. The regression coefficient for determination (R2) for SG in MLR models was 0.31, and for ANN was 0.91. The R2 in MLR for WL was 0.89, whereas ANN was 0.84.Osmotic dehydration experiments found that the amount of WL and SG occurred in the following descending order: Golden Delicious apple > Cox apple > potato > banana. The effect of temperature and concentration of osmotic solution on WL and SG of the plant materials followed a descending order as: 55 > 40 > 32.2C and 70 > 60 > 50 > 40%, respectively.