Numerical algorithms for modelling electrodeposition: Tracking the deposition front under forced convection from megasonic agitation

Electrodeposition is a widely used technique for the fabrication of high aspect ratio microstructures. In recent years, much research has been focused within this area aiming to understand the physics behind the filling of high aspect ratio vias and trenches on substrates and in particular how they can be made without the formation of voids in the deposited material. This paper reports on the fundamental work towards the advancement of numerical algorithms that can predict the electrodeposition process in micron scaled features. Two different numerical approaches have been developed, which capture the motion of the deposition interface and 2-D simulations are presented for both methods under two deposition regimes: those where surface kinetics is governed by Ohm’s law and the Butler–Volmer equation, respectively. In the last part of this paper the modelling of acoustic forces and their subsequent impact on the deposition profile through convection is examined.

Numerical modelling and validation of Marangoni and surface tension phenomena using the finite volume method

Surface tension induced flow is implemented into a numerical modelling framework and validated for a number of test cases. Finite volume unstructured mesh techniques are used to discretize the mass, momentum and energy conservation equations in three dimensions. An explicit approach is used to include the effect of surface tension forces on the flow profile and final shape of a liquid domain. Validation of this approach is made against both analytical and experimental data. Finally, the method is used to model the wetting balance test for solder alloy material, where model predictions are used to gain a greater insight into this process. Copyright © 2000 John Wiley & Sons, Ltd.

Adult personality inconsistency and problems with parents: uncovering the roots of the false self

Research has established that individuals who tend to vary their personality depending on who they are with, show a variety of signs of psychological maladjustment in comparison to those who do not; they show more negative affect (Baird, Le and Lucas, 2006), lower life satisfaction (Suh, 2002), lower self-esteem (Sheldon et al., 1997), lower role-satisfaction (Donahue et al., 1993), higher rates of depression (Lutz and Ross, 2003), more anxiety (Diehl, Hastings and Stanton, 2001) and poorer physical health (Cross, Gore and Morris, 2003). It has also been shown that personality variability is positively related to the experience of inauthenticity and falsity (Sheldon et al., 1997). Donahue, Roberts, Robins and John (1993) found that personality inconsistency of this type is related to tension within the family. Psychoanalytic theory has also linked the operation of an adult false self to experiences with parents, particularly in early life (Winnicott, 1960). It was hypothesized that personality variability and the adult experience of falsity in social situations would be related to an emotionally unstable relationship with parents. The method to test this comprised a questionnaire-based survey given to a non-clinical population. The final sample comprised 305, with 193 women and 112 men, aged from 19 to 55. The first questionnaire asked participants to rate personality traits, including emotional stability, in three social contexts - with parents, with friends and with work colleagues. The second part involved 3 questions; participants were asked to select in which of the aforementioned three social contexts they felt “most themselves”; in which they were “most authentic” and in which they “put on a front”. It was found, consistent with predictions, that an index of overall personality variability calculated from the personality questionnaire correlated strongly with emotional instability around parents (r = 0.46, p<0.001), while not correlating with emotional instability in either of the other two contexts measured. This suggests a specific link between a person’s relationship with their parents and their overall personality integration. Furthermore, it was found that participants who cited one of the three social contexts (parents, friends, work colleagues) as being one in which they were “more themselves” or “more authentic” had significantly higher ratings of emotional instability with parents than those participants who found that they were equally authentic across settings (F = 9.8, p<0.005). The results suggest a clear link between a person’s relationships with their parents and their adult personality integration. An explanation is that individuals who experience an anxious or ambiguous attachment with their parents in childhood may fear rejection or abandonment in later life, and so habitually adapt their personality to fit in to social contexts as adults, in order to be accepted by others and to minimize the possibility of social rejection. These individuals meanwhile retain an emotionally unstable relationship with their parents in adulthood. This interpretation is speculative but is open to empirical testing. Clinicians should be aware that attachment problems with parents may underlie poor personality integration in adulthood.

Approximation Algorithms for a Symmetric Quadratic Knapsack Problem and its Scheduling Applications

We consider a knapsack problem to minimize a symmetric quadratic function. We demonstrate that this symmetric quadratic knapsack problem is relevant to two problems of single machine scheduling: the problem of minimizing the weighted sum of the completion times with a single machine non-availability interval under the non-resumable scenario; and the problem of minimizing the total weighted earliness and tardiness with respect to a common small due date. We develop a polynomial-time approximation algorithm that delivers a constant worst-case performance ratio for a special form of the symmetric quadratic knapsack problem. We adapt that algorithm to our scheduling problems and achieve a better performance. For the problems under consideration no fixed-ratio approximation algorithms have been previously known.

Numerical simulation of incompressible flow problems using an unstructured staggered mesh method

A number of two dimensional staggered unstructured discretisation schemes for the solution of fluid flow and heat transfer problems have been developed. All schemes store and solve velocity vector components at cell faces with scalar variables solved at cell centres. The velocity is resolved into face-normal and face-parallel components and the various schemes investigated differ in the treatment of the parallel component. Steady-state and time-dependent fluid flow and thermal energy equations are solved with the well known pressure correction scheme, SIMPLE, employed to couple continuity and momentum. The numerical methods developed are tested on well known benchmark cases: the Lid-Driven Cavity, Natural Convection in a Cavity and Melting of Gallium in a rectangular domain. The results obtained are shown to be comparable to benchmark, but with accuracy dependent on scheme selection.

Comparison of three algorithms for nonlinear metal cutting problems

This paper compares three alternative numerical algorithms applied to a nonlinear metal cutting problem. One algorithm is based on an explicit method and the other two are implicit. Domain decomposition (DD) is used to break the original domain into subdomains, each containing a properly connected, well-formulated and continuous subproblem. The serial version of the explicit algorithm is implemented in FORTRAN and its parallel version uses MPI (Message Passing Interface) calls. One implicit algorithm is implemented by coupling the state-of-the-art PETSc (Portable, Extensible Toolkit for Scientific Computation) software with in-house software in order to solve the subproblems. The second implicit algorithm is implemented completely within PETSc. PETSc uses MPI as the underlying communication library. Finally, a 2D example is used to test the algorithms and various comparisons are made.

Optimization and finite element analysis for reliable electronic packaging

This paper demonstrates a modeling and design approach that couples computational mechanics techniques with numerical optimisation and statistical models for virtual prototyping and testing in different application areas concerning reliability of eletronic packages. The integrated software modules provide a design engineer in the electronic manufacturing sector with fast design and process solutions by optimizing key parameters and taking into account complexity of certain operational conditions. The integrated modeling framework is obtained by coupling the multi-phsyics finite element framework - PHYSICA - with the numerical optimisation tool - VisualDOC into a fully automated design tool for solutions of electronic packaging problems. Response Surface Modeling Methodolgy and Design of Experiments statistical tools plus numerical optimisaiton techniques are demonstrated as a part of the modeling framework. Two different problems are discussed and solved using the integrated numerical FEM-Optimisation tool. First, an example of thermal management of an electronic package on a board is illustrated. Location of the device is optimized to ensure reduced junction temperature and stress in the die subject to certain cooling air profile and other heat dissipating active components. In the second example thermo-mechanical simulations of solder creep deformations are presented to predict flip-chip reliability and subsequently used to optimise the life-time of solder interconnects under thermal cycling.

[Review] M. Feistauer, J. Felcman, I. Straskbraba, Mathematical and Computational Methods for Compressible Flow, Oxford Science Publication, Oxford, ISBN 0198505884, 2004 (535pp.)

The growth of computer power allows the solution of complex problems related to compressible flow, which is an important class of problems in modern day CFD. Over the last 15 years or so, many review works on CFD have been published. This book concerns both mathematical and numerical methods for compressible flow. In particular, it provides a clear cut introduction as well as in depth treatment of modern numerical methods in CFD. This book is organised in two parts. The first part consists of Chapters 1 and 2, and is mainly devoted to theoretical discussions and results. Chapter 1 concerns fundamental physical concepts and theoretical results in gas dynamics. Chapter 2 describes the basic mathematical theory of compressible flow using the inviscid Euler equations and the viscous Navier–Stokes equations. Existence and uniqueness results are also included. The second part consists of modern numerical methods for the Euler and Navier–Stokes equations. Chapter 3 is devoted entirely to the finite volume method for the numerical solution of the Euler equations and covers fundamental concepts such as order of numerical schemes, stability and high-order schemes. The finite volume method is illustrated for 1-D as well as multidimensional Euler equations. Chapter 4 covers the theory of the finite element method and its application to compressible flow. A section is devoted to the combined finite volume–finite element method, and its background theory is also included. Throughout the book numerous examples have been included to demonstrate the numerical methods. The book provides a good insight into the numerical schemes, theoretical analysis, and validation of test problems. It is a very useful reference for applied mathematicians, numerical analysts, and practice engineers. It is also an important reference for postgraduate researchers in the field of scientific computing and CFD.

Numerical solutions of certain nonlinear models in European options on a distributed computing environment

Financial modelling in the area of option pricing involves the understanding of the correlations between asset and movements of buy/sell in order to reduce risk in investment. Such activities depend on financial analysis tools being available to the trader with which he can make rapid and systematic evaluation of buy/sell contracts. In turn, analysis tools rely on fast numerical algorithms for the solution of financial mathematical models. There are many different financial activities apart from shares buy/sell activities. The main aim of this chapter is to discuss a distributed algorithm for the numerical solution of a European option. Both linear and non-linear cases are considered. The algorithm is based on the concept of the Laplace transform and its numerical inverse. The scalability of the algorithm is examined. Numerical tests are used to demonstrate the effectiveness of the algorithm for financial analysis. Time dependent functions for volatility and interest rates are also discussed. Applications of the algorithm to non-linear Black-Scholes equation where the volatility and the interest rate are functions of the option value are included. Some qualitative results of the convergence behaviour of the algorithm is examined. This chapter also examines the various computational issues of the Laplace transformation method in terms of distributed computing. The idea of using a two-level temporal mesh in order to achieve distributed computation along the temporal axis is introduced. Finally, the chapter ends with some conclusions.

A comprehensive copper stockpile leach model: background and model formulation

The first phase in the sign, development and implementation of a comprehensive computational model of a copper stockpile leach process is presented. The model accounts for transport phenomena through the stockpile, reaction kinetics for the important mineral species, oxgen and bacterial effects on the leach reactions, plus heat, energy and acid balances for the overall leach process. The paper describes the formulation of the leach process model and its implementation in PHYSICA+, a computational fluid dynamic (CFD) software environment. The model draws on a number of phenomena to represent the competing physical and chemical features active in the process model. The phenomena are essentially represented by a three-phased (solid liquid gas) multi-component transport system; novel algorithms and procedures are required to solve the model equations, including a methodology for dealing with multiple chemical species with different reaction rates in ore represented by multiple particle size fractions. Some initial validation results and application simulations are shown to illustrate the potential of the model.

Correlation of solder paste rheology with computational simulations of the stencil printing process

Soldering technologies continue to evolve to meet the demands of the continuous miniaturisation of electronic products, particularly in the area of solder paste formulations used in the reflow soldering of surface mount devices. Stencil printing continues to be a leading process used for the deposition of solder paste onto printed circuit boards (PCBs) in the volume production of electronic assemblies, despite problems in achieving a consistent print quality at an ultra-fine pitch. In order to eliminate these defects a good understanding of the processes involved in printing is important. Computational simulations may complement experimental print trials and paste characterisation studies, and provide an extra dimension to the understanding of the process. The characteristics and flow properties of solder pastes depend primarily on their chemical and physical composition and good material property data is essential for meaningful results to be obtained by computational simulation.This paper describes paste characterisation and computational simulation studies that have been undertaken through the collaboration of the School of Aeronautical, Mechanical and Manufacturing Engineering at Salford University and the Centre for Numerical Modelling and Process Analysis at the University of Greenwich. The rheological profile of two different paste formulations (lead and lead-free) for sub 100 micron flip-chip devices are tested and applied to computational simulations of their flow behaviour during the printing process.

Numerical Modelling for Electronic Packaging - Future Requirements

The fabrication, assembly and testing of electronic packaging can involve complex interactions between physical phenomena such as temperature, fluid flow, electromagnetics, and stress. Numerical modelling and optimisation tools are key computer-aided-engineering technologies that aid design engineers. This paper discusses these technologies and there future developments.

Concise introduction to image processing using C++

A Concise Intro to Image Processing using C++ presents state-of-the-art image processing methodology, including current industrial practices for image compression, image de-noising methods based on partial differential equations, and new image compression methods such as fractal image compression and wavelet compression. It includes elementary concepts of image processing and related fundamental tools with coding examples as well as exercises. With a particular emphasis on illustrating fractal and wavelet compression algorithms, the text covers image segmentation, object recognition, and morphology. An accompanying CD-ROM contains code for all algorithms.