Intelligent technologies for nuclear power systems: heuristic and neural tools

The consecutive, partly overlapping emergence of expert systems and then neural computation methods among intelligent technologies, is reflected in the evolving scene of their application to nuclear engineering. This paper provides a bird's eye view of the state of the application in the domain, along with a review of a particular task, the one perhaps economically more important: refueling design in nuclear power reactors.

International perspectives on energy policy and the role of nuclear power

In this book, expert energy economists assess the energy policy of thirty-one countries and the role of nuclear power. For many years the shock of Chernobyl took nuclear power off the agenda in most countries. Intense public relations activities by the industry, increasing evidence of climate change and failures to effectively reduce greenhouse gas emissions, have brought nuclear power issues back to the forefront of policy discussion in the nuclear renaissance countries. But some countries are just not prepared to go in that direction and, indeed, are still divesting themselves of their nuclear legacy, the nuclear phase-out countries. And how are nuclear issues being approached in the industrializing countries? An in-depth country-by-country analysis is presented within this framework. Out of such an analysis emerge thematic discussions on, among others, strategy in energy policy; nuclear plant safety, the impacts of nuclear accidents; the adequacy of nuclear power expertise. [Source: publisher's product description].

The financial crisis and nuclear power

An assessment of the impact of the financial crisis on the prospects for new nuclear power plant orders worldwide.

The future of energy: are competitive markets and nuclear power the answer?

The inaugural lecture of Professor Stephen Thomas at the University of Greenwich, 4th February 2010. It examines whether further pursuit of competition in energy markets and expansion in the role of nuclear power can be the main elements in a policy to meet goals of security, sustainability and affordability.

Can nuclear power plants be built in Britain without public subsidies and guarantees?

This report examines the credibility of the claim by the UK government that nuclear power plants can be built in the UK without public subsidies and guarantees

Refueling in nuclear engineering: the FUELCON project

Over a time span of almost a decade, the FUELCON project in nuclear engineering has led to a fully functional expert system and spawned sequel projects. Its task is in-core fuel management, also called `refueling', i.e., good fuel-allocation for reloading the core of a given nuclear reactor, for a given operation cycle. The task is crucial for keeping down operation costs at nuclear power plants. Fuel comes in different types and is positioned in a grid representing the core of a reactor. The tool is useful for practitioners but also helps the expert in the domain to test his or her rules of thumb and to discover new ones.

ENEL: business prospects and risks in nuclear energy

This report examines the level of debt of ENEL and how that will be impacted by its plans for new nuclear power plants.

2009 world nuclear industry status report

Although some countries plan to build new nuclear power plants in the near future, in aggregate the data indicates that nuclear power's influence will continue to dwindle across the globe in coming decades.

Exploring genetic alternative concepts for FUELGEN

This paper describes new crossover operators and mutation strategies for the FUELGEN system, a genetic algorithm which designs fuel loading patterns for nuclear power reactors. The new components are applications of new ideas from recent research in genetic algorithms. They are designed to improve the performance of FUELGEN by using information in the problem as yet not made explicit in the genetic algorithm's representation. The paper introduces new developments in genetic algorithm design and explains how they motivate the proposed new components.

Thermo-mechanical modelling of power electronics module structures

Power electronic modules distinguish themselves from other modules by their high power operation. These modules are used extensively in high power application markets such as aerospace, automotive, industrial and traction and drives. This paper discusses typical packaging technologies for power electronics modules. It also discusses the latest results from a UK research project investigating the physics-of-failure approach to reliability analysis and predictions for power modules. An integrated design enviroment for incorporating of affects of uncertainty into the design environment was outlined.

Reliability analysis for power electronics modules

This paper discusses the reliability of power electronics modules. The approach taken combines numerical modeling techniques with experimentation and accelerated testing to identify failure modes and mechanisms for the power module structure and most importantly the root cause of a potential failure. The paper details results for two types of failure (i) wire bond fatigue and (ii) substrate delamination. Finite element method modeling techniques have been used to predict the stress distribution within the module structures. A response surface optimisation approach has been employed to enable the optimal design and parameter sensitivity to be determined. The response surface is used by a Monte Carlo method to determine the effects of uncertainty in the design.

Thermal-mechanical modelling of power electronic module packaging

In this paper the reliability of the isolation substrate and chip mountdown solder interconnect of power modules under thermal-mechanical loading has been analysed using a numerical modelling approach. The damage indicators such as the peel stress and the accumulated plastic work density in solder interconnect are calculated for a range of geometrical design parameters, and the effects of these parameters on the reliability are studied by using a combination of the finite element analysis (FEA) method and optimisation techniques. The sensitivities of the reliability of the isolation substrate and solder interconnect to the changes of the design parameters are obtained and optimal designs are studied using response surface approximation and gradient optimization method

Wire bond reliability for power electronic modules - effect of bonding temperature

In this paper, thermal cycling reliability along with ANSYS analysis of the residual stress generated in heavy-gauge Al bond wires at different bonding temperatures is reported. 99.999% pure Al wires of 375 mum in diameter, were ultrasonically bonded to silicon dies coated with a 5mum thick Al metallisation at 25degC (room temperature), 100degC and 200degC, respectively (with the same bonding parameters). The wire bonded samples were then subjected to thermal cycling in air from -60degC to +150degC. The degradation rate of the wire bonds was assessed by means of bond shear test and via microstructural characterisation. Prior to thermal cycling, the shear strength of all of the wire bonds was approximately equal to the shear strength of pure aluminum and independent of bonding temperature. During thermal cycling, however, the shear strength of room temperature bonded samples was observed to decrease more rapidly (as compared to bonds formed at 100degC and 200degC) as a result of a high crack propagation rate across the bonding area. In addition, modification of the grain structure at the bonding interface was also observed with bonding temperature, leading to changes in the mechanical properties of the wire. The heat and pressure induced by the high temperature bonding is believed to promote grain recovery and recrystallisation, softening the wires through removal of the dislocations and plastic strain energy. Coarse grains formed at the bonding interface after bonding at elevated temperatures may also contribute to greater resistance for crack propagation, thus lowering the wire bond degradation rate

Lifetime prediction for power electronics module substrate mount-down solder interconnect

A numerical modeling method for the prediction of the lifetime of solder joints of relatively large solder area under cyclic thermal-mechanical loading conditions has been developed. The method is based on the Miner's linear damage accumulation rule and the properties of the accumulated plastic strain in front of the crack in large area solder joint. The nonlinear distribution of the damage indicator in the solder joints have been taken into account. The method has been used to calculate the lifetime of the solder interconnect in a power module under mixed cyclic loading conditions found in railway traction control applications. The results show that the solder thickness is a parameter that has a strong influence on the damage and therefore the lifetime of the solder joint while the substrate width and the thickness of the baseplate are much less important for the lifetime