Effect of current stressing on the reliability of 63Sn37Pb solder joints

The effect of current stressing on the reliability of 63Sn37Pb solder joints with Cu pads was investigated at temperatures of −5 °C and 125 °C up to 600 h. The samples were stressed with 3 A current (6.0 × 102 A/cm2 in the solder joint with diameter of 800 μm and 1.7 × 104 A/cm2 in the Cu trace with cross section area of 35 × 500 μm). The temperatures of the samples and interfacial reaction within the solder joints were examined. The microstructural change of the solder joints aged at 125 °C without current flow was also evaluated for comparison. It was confirmed that the current flow could cause the temperature of solder joints to rise rapidly and remarkably due to accumulation of massive Joule heat generated by the Cu trace. The solder joints stressed at 125 °C with 3 A current had an extensive growth of Cu6Sn5 and Cu3Sn intermetallic compounds (IMC) at both top and bottom solder-to-pad interfaces. It was a direct result of accelerated aging rather than an electromigration or thermomigration effect in this experiment. The kinetic is believed to be bulk diffusion controlled solid-state reaction, irrespective of the electron flow direction. When stressed at −5 °C with 3 A current, no significant change in microstructure and composition of the solder joints had occurred due to a very low diffusivity of the atoms as most Joule heat was eliminated at low temperature. The IMC evolution of the solder joints aged at 125 °C exhibited a subparabolic growth behavior, which is presumed to be a combined mechanism of grain boundary diffusion and bulk diffusion. This is mainly ascribed to the retardant effect against the diffusion course by the sufficiently thick IMC layer that was initially formed during the reflow soldering.

The palaeoenvironment and stratigraphy of Late Cretaceous Chalks

Since the publication of Hancock's ‘the Petrology of the Chalk’ there have been numerous developments in our appreciation of the palaeoenvironment and stratigraphie correlation of the UK Chalk. This work presents a review of some of the key developments over the last 30 years. Our detailed understanding of Chalk lithostratigraphy and advances in our understanding of chalk sedimentation indicate that large-scale mass transport and re-sedimentation of chalks by low-angle suspension flows is required to explain the observed thickness variations. The provenance of clay minerals and the process of flint and granular phosphate formation are discussed. The growing importance of isotopic studies in high resolution stratigraphy and improving our understanding of the late Cretaceous oceans and climate are emphasized. Developments in lithostratigraphic studies and recent proposals for a new stratigraphie division of the Chalk in the UK are evaluated.