Predicting the relationship between reliability and geometric parameters of cu column bumped flip-chips

Cu column bumping is a novel flip chip packaging technique that allows Cu columns to be bonded directly with the dies. It has eliminated the under-bump-metallurgy (UBM) fonnation step of the traditional flip chip manufacturing process. This bumping technique has the potential benefits of simplifying the flip chip manufacturing process, increasing productivity and the UO counts. In this paper, a study of reliability of Cu column bumped flip chips will be presented. Computer modelling methods have been used to predict the shape of solder joints and the response of flip chips to cyclic thermal-mechanical loading. The accumulated plastic strain energy at the corner solder joints has been used as an indicator of the solder joint reliability. Models with a wide range of design parameters have been compared for their reliability. The design parameters that have been investigated are the copper column height and radius, PCB pad radius, solder volume and Cu column wetting height. The relative importance ranking of these parameters has been obtained. The Lead-free solder material 96.5Sn3.5Ag has been used in this modelling work.

Explosion in fume cupboard damages several laboratories

An explosion occurred in a busy university laboratory during a few minutes when it happened to be unoccupied. The explosion was puzzling since the laboratory was dedicated to geochemical work, such as digesting rock samples with stable, inorganic reagents. The only unstable substance knowingly stored or handled for this purpose, perchloric acid, was not in use on the day of the incident. The investigation was unable to reach an exact conclusion but did prove that a substantial organic contaminant, not on the laboratory inventory, must have been present