A prognostic assessment method for power electronics modules

This paper describes a prognostic method which combines the physics of failure models with probability reasoning algorithm. The measured real time data (temperature vs. time) was used as the loading profile for the PoF simulations. The response surface equation of the accumulated plastic strain in the solder interconnect in terms of two variables (average temperature, and temperature amplitude) was constructed. This response surface equation was incorporated into the lifetime model of solder interconnect, and therefore the remaining life time of the solder component under current loading condition was predicted. The predictions from PoF models were also used to calculate the conditional probability table for a Bayesian Network, which was used to take into account of the impacts of the health observations of each product in lifetime prediction. The prognostic prediction in the end was expressed as the probability for the product to survive the expected future usage. As a demonstration, this method was applied to an IGBT power module used for aircraft applications.

Computer modelling analysis of the globtop's effects on aluminium wirebond reliability

In power electronics modules, heavy aluminium wires, i.e. wire diameters greater than 100 microns, are bonded to the active semiconductor devices and conductor metallization to form electric circuits of the power electronic module. Due to the high currents that may flow through these wires, a single connection usually contains several wires and thus, a large number of wires are used in a power electronics module. Under normal operation or test condition, a significant amount of stresses and strains induced in the wire and bonding interfaces, resulting in failure over time. In this paper, computer modelling techniques are used to analyse the effect of globtop design on the reliability of aluminium wirebonds under cyclic thermal-mechanical loading conditions. The results will show the sensitivity of the reliability of the wirebonds to the changes in the geometry and the material properties of the wirebond globtop.

Computer simulation of crack propagation in power electronics module solder joints

A numerical modelling method for the analysis of solder joint damage and crack propagation has been described in this paper. The method is based on the disturbed state concept. Under cyclic thermal-mechanical loading conditions, the level of damage that occurs in solder joints is assumed to be a simple monotonic scalar function of the accumulated equivalent plastic strain. The increase of damage leads to crack initiation and propagation. By tracking the evolution of the damage level in solder joints, crack propagation path and rate can be simulated using Finite Element Analysis method. The discussions are focused on issues in the implementation of the method. The technique of speeding up the simulation and the mesh dependency issues are analysed. As an example of the application of this method, crack propagation in solder joints of power electronics modules under cyclic thermal-mechanical loading conditions has been analyzed and the predicted cracked area size after 3000 loading cycles is consistent with experimental results.

Computer simulation of aluminium wirebonds with globtop in power electronics modules

In this paper, computer modelling techniques are used to analyse the effects of globtops on the reliability of aluminium wirebonds in power electronics modules under cyclic thermal-mechanical loading conditions. The sensitivity of the wirehond reliability to the changes of the geometric and the material property parameters of wirebond globtop are evaluated and the optimal combination of the Young's modulus and the coefficient of thermal expansion have been predicted.

Assessment of existing soakaways for reuse

This paper describes a practical approach for the investigation, assessment and design of existing soakaways. This method can be utilised for measuring the performance and capacity of the systems and examining whether the systems are suitable for reuse when information about the design and installation of the systems is not available. The requirements for field observations and the procedure for a soil infiltration test for the installed system are suggested for successful assessment. The soil infiltration rate of the system is estimated from the field test data without requiring information on the design and construction details of the system. The system's working condition is measured by a performance indicator related to the time taken to empty the soakaway. This is then employed to evaluate the potential reuse of the system. The system's drain capacity is determined by the design principles of current practice and the effect of climate change on its drain capacity is considered. Contamination of soils around the systems after long-term use of discharge service and the water present in soakaway chambers are also investigated. A detailed case study for the reuse of four installed soakaways for a new housing development demonstrates how the proposed approach provides a straightforward process for the infiltration performance and drain capacity assessment of the existing systems. The effectiveness and applicability of the proposed approach are further demonstrated from the assessments for a number of installed systems over various sites

Concise introduction to image processing using C++

A Concise Intro to Image Processing using C++ presents state-of-the-art image processing methodology, including current industrial practices for image compression, image de-noising methods based on partial differential equations, and new image compression methods such as fractal image compression and wavelet compression. It includes elementary concepts of image processing and related fundamental tools with coding examples as well as exercises. With a particular emphasis on illustrating fractal and wavelet compression algorithms, the text covers image segmentation, object recognition, and morphology. An accompanying CD-ROM contains code for all algorithms.

C-H activations on a 1H-1,4-benzodiazepin-2(3H)-one template

Air stable benzodiazepine containing palladacycles were synthesized by a C-H activation reaction and studied by mass spectrometry and X-ray crystallography. Catalytic C-H functionalizations of 1-methyl-5-phenyl-1H-1,4-benzodiazepin-2(3H)-one with diphenyliodonium hexafluorophosphate led to a mixture, which included the starting material and the expected product 1-methyl-5-(2'-biphenyl)-1H-1,4-benzodiazepin-2(3H)-one. (C) 2008 Elsevier Ltd. All rights reserved.

C-H activations via palladacycles

Summary: This chapter contains sections titled: * Introduction: CC Bond Formation via Cyclopalladation Reactions * Stoichiometric CH Activation Chemistry * Catalytic Chemistry * Arylations * Direct CH CH Coupling Reactions * Alkylations * Other Reactions * Conclusion * References