8 resultados para Bill of Material (BOM)
em Greenwich Academic Literature Archive - UK
Resumo:
The numerical model for electrically conducting liquid droplets levitated in AC magnetic field is extended to demonstrate various factors affecting the accuracy of material property value measurements. The effects included are the electromagnetic force induced stirring and the resulting turbulence, thermo-capillary convection, and the droplet rotation. The results are validated against available analytical solutions.
Resumo:
The effects of a constant uniform magnetic field on thermoelectric currents during dendritic solidification were investigated using an enthalpy based numerical model. It was found that the resulting Lorentz force generates a complex flow influencing the solidification pattern. Experimental work of material processing under high magnetic field conditions has shown that the microstructure can be significantly altered. There is evidence that these effects can be atrtributed to the Lorentz force created through the thermoelectric magentohydrodynamic interactions.[1,2] However the mechanism of how this occurs is not very well understood. In this paper, our aim is to investigate the flow field created from the Lorentz force and how this influences the morphology of dendritic growth for both pure materials and binary alloys.
Resumo:
The numerical model for electrically conducting liquid droplets levitated in AC magnetic field is applied to demonstrate various factors affecting the accuracy of material property value measurements in microgravity conditions. The included effects are the electromagnetic force induced stirring and the resulting turbulence, the thermo-capillary convection, and the droplet rotation. The results are validated against available analytical solutions.
Resumo:
Purpose: To study the impact of powder flow properties on dosator filling systems, with particular focus on improvements in dose weight accuracy and repeatability. Method: This study evaluates a range of critical powder flow properties such as: flow function, cohesion, wall friction, adhesion to wall surfaces, density/compressibility data, stress ratio “K” and gas permeability. The characterisations of the powders considered in this study were undertaken using an annular shear cell using a sample size of 0.5 litres. This tester also incorporated the facility to measure bed expansion during shear in addition to contraction under consolidation forces. A modified Jenike type linear wall friction tester was used to develop the failure loci for the powder sample in conjunction with multiple wall samples (representing a variety of material types and surface finishes). Measurements of the ratio of applied normal stress versus lateral stress were determined using a piece of test equipment specifically designed for the purpose. Results: The correct characterisation of powders and the incorporation of this data into the design of process equipment are recognised as critical for reliable and accurate operation. An example of one aspect of this work is the stress ratio “K”. This characteristic is not well understood or correctly interpreted in many cases – despite its importance. Fig 1 [Omitted] (illustrates a sample of test data. The slope of the line gives the stress ratio in a uniaxial compaction system – indicating the behaviour of the material under compaction during dosing processes. Conclusions: A correct assessment of the bulk powder properties for a given formulation can allow prediction of: cavity filling behaviour (and hence dosage), efficiency of release from dosator, and strength and stability of extruded dose en route to capsule filling Influences over the effectiveness of dosator systems have been shown to be impacted upon by: bed pre-compaction history, gas permeability in the bed (with respect to local density effects), and friction effects for materials of construction for dosators
Resumo:
The market for solder paste materials in the electronic manufacturing and assembly sector is very large and consists of material and equipment suppliers and end users. These materials are used to bond electronic components (such as flip-chip, CSP and BGA) to printed circuit boards (PCB's) across a range of dimensions where the solder interconnects can be in the order of 0.05mm to 5mm in size. The non-Newtonian flow properties exhibited by solder pastes during its manufacture and printing/deposition phases have been of practical concern to surface mount engineers and researchers for many years. The printing of paste materials through very small-sized stencil apertures is known to lead to increased stencil clogging and incomplete transfer of paste to the substrate pads. At these very narrow aperture sizes the paste rheology and particle-wall interactions become crucial for consistent paste withdrawal. These non-Newtonian effects must be understood so that the new paste formulations can be optimised for consistent printing. The focus of the study reported in this paper is the characterisation of the rheological properties of solder pastes and flux mediums, and the evaluation of the effect of these properties on the pastes' printing performance at the flip-chip assembly application level. Solder pastes are known to exhibit a thixotropic behaviour, which is recognised by the decrease in apparent viscosity of paste material with time when subjected to a constant shear rate. The proper characterisation of this time-dependent theological behaviour of solder pastes is crucial for establishing the relationships between the pastes' structure and flow behaviour; and for correlating the physical parameters with paste printing performance. In this paper, we present a number of methods which have been developed for characterising the time-dependent and non-Newtonian rheological behaviour of solder pastes and flux mediums as a function of shear rates. We also present results of the study of the rheology of the solder pastes and flux mediums using the structural kinetic modelling approach, which postulates that the network structure of solder pastes breaks down irreversibly under shear, leading to time and shear dependent changes in the flow properties. Our results show that for the solder pastes used in the study, the rate and extent of thixotropy was generally found to increase with increasing shear rate. The technique demonstrated in this study has wide utility for R&D personnel involved in new paste formulation, for implementing quality control procedures used in solder paste manufacture and packaging; and for qualifying new flip-chip assembly lines
Resumo:
One of the core tasks of the virtual-manufacturing environment is to characterise the transformation of the state of material during each of the unit processes. This transformation in shape, material properties, etc. can only be reliably achieved through the use of models in a simulation context. Unfortunately, many manufacturing processes involve the material being treated in both the liquid and solid state, the trans-formation of which may be achieved by heat transfer and/or electro-magnetic fields. The computational modelling of such processes, involving the interactions amongst various interacting phenomena, is a consider-able challenge. However, it must be addressed effectively if Virtual Manufacturing Environments are to become a reality! This contribution focuses upon one attempt to develop such a multi-physics computational toolkit. The approach uses a single discretisation procedure and provides for direct interaction amongst the component phenomena. The need to exploit parallel high performance hardware is addressed so that simulation elapsed times can be brought within the realms of practicality. Examples of Multiphysics modelling in relation to shape casting, and solder joint formation reinforce the motivation for this work.
Resumo:
The erosion processes resulting from flow of fluids (gas-solid or liquid-solid) are encountered in nature and many industrial processes. The common feature of these erosion processes is the interaction of the fluid (particle) with its boundary thus resulting in the loss of material from the surface. This type of erosion in detrimental to the equipment used in pneumatic conveying systems. The puncture of pneumatic conveyor bends in industry causes several problems. Some of which are: (1) Escape of the conveyed product causing health and dust hazard; (2) Repairing and cleaning up after punctures necessitates shutting down conveyors, which will affect the operation of the plant, thus reducing profitability. The most common occurrence of process failure in pneumatic conveying systems is when pipe sections at the bends wear away and puncture. The reason for this is particles of varying speed, shape, size and material properties strike the bend wall with greater intensity than in straight sections of the pipe. Currently available models for predicting the lifetime of bends are inaccurate (over predict by 80%. The provision of an accurate predictive method would lead to improvements in the structure of the planned maintenance programmes of processes, thus reducing unplanned shutdowns and ultimately the downtime costs associated with these unplanned shutdowns. This is the main motivation behind the current research. The paper reports on two aspects of the first phases of the study-undertaken for the current project. These are (1) Development and implementation; and (2) Testing of the modelling environment. The model framework encompasses Computational Fluid Dynamics (CFD) related engineering tools, based on Eulerian (gas) and Lagrangian (particle) approaches to represent the two distinct conveyed phases, to predict the lifetime of conveyor bends. The method attempts to account for the effect of erosion on the pipe wall via particle impacts, taking into account the angle of attack, impact velocity, shape/size and material properties of the wall and conveyed material, within a CFD framework. Only a handful of researchers use CFD as the basis of predicting the particle motion, see for example [1-4] . It is hoped that this would lead to more realistic predictions of the wear profile. Results, for two, three-dimensional test cases using the commercially available CFD PHOENICS are presented. These are reported in relation to the impact intensity and sensitivity to the inlet particle distributions.