Collector-metal behaviour in the recovery of platinum-group metals from catalytic converters

A commercial pyrometallurgical process for the extraction of platinum-group metals (PGM) from a feedstock slag was analysed with the use of a model based on computational fluid dynamics. The results of the modelling indicate that recovery depends on the behaviour of the collector phase. A possible method is proposed for estimation of the rate at which PGM particles in slag are absorbed into an iron collector droplet that falls through it. Nanoscale modelling techniques (for particle migration or capture) are combined with a diffusion-controlled mass-transfer model to determine the iron collector droplet size needed for >95% PGM recovery in a typical process bath (70 mm deep) in a realistic time-scale (<1 h). The results show that an iron droplet having a diameter in the range 0.1–0.3 mm gives good recovery (>90%) within a reasonable time. This finding is compatible with published experimental data. Pyrometallurgical processes similar to that investigated should be applicable to other types of waste that contain low levels of potentially valuable metals.

Computational modelling of bubbles, droplets and particles in metals reduction and refining

The CFD modelling of metals reduction processes particularly always seems to involve the interaction of liquid metals, a gas (often air) top space, liquid droplets in the top space and injection of both solid particles and gaseous bubbles into the bath. These phases all interact and exhange mass, momentum and energy. Often it is the extent to which these multi-phase phemomena can be effectively captured within the CFD model which determines whether or not a tool of genuine use to the target industry sector can constructed. In this paper we discuss these issues in the context of two problems - one involving the injection of sparging gases into a steel continuous caster and the other based on the development of a novel process for aluminium electrolysis.

Computational modelling of freeze layers in smelting processes

The use of computational modelling in examining process engineering issues is very powerful. It has been used in the development of the HIsmelt process from its concept. It is desirable to further water-cool the HIsmelt vessel to reduce downtime for replacing refractory. Water-cooled elements close to a metal bath run the risk of failure. This generally occurs when a process perturbation causes the freeze and refractory layers to come away from the water-cooled element, which is then exposed to liquid metal. The element fails as they are unable to remove all the heat. Modelling of the water-cooled element involves modelling the heat transfer, fluid flow, stress and solidification for a localised section of the reaction vessel. The complex interaction between the liquid slag and the refractory applied to the outside of thewater-cooled element is also being examined to model the wear of this layer. The model is being constructed in Physica, a CFD code developed at the University of Greenwich. Modelling of this system has commenced with modelling solidification test cases. These test cases have been used to validate the CFD code’s capability to model the solidification in this system. A model to track the penetration of slag into refractory has also been developed and tested.

Modelling the wave soldering process

Compuational fluid dynamics (CFD) is used to help understand the gas flow characteristics in the wave soldering process. CFD has the ability to calculate (1) heal transfer, (2) fluid dynamics, and (3) oxygen concentration throughout the wave soldering machine. Understanding the impact of fluid dynamics on oxygen concentration is important as excessive oxygen at the solder bath can lead to high dross contents and hence poor solder joint quality on the printed circuit board. This paper describes the CFD modelling approach and illustrates its capability for a machine which has nitrogen injectors near the solder bath. Different magnitiutes of nitrogen flow rates are investigated and it is demonstrated how these effect the oxygen concentration at the bath surface.

Wetting and Reaction of Sn-2.8Ag-0.5Cu-1.0Bi Solder with Cu and Ni Substrates

The wettability of newly developed Sn-2.8Ag-0.5Cu-1.0Bi lead-free solder on Cu and Ni substrates was assessed through the wetting balance tests. The wettability assessment parameters such as contact angle (ϑc) and maximum wetting force (Fw) were documented for three solder bath temperatures with three commercial fluxes, namely, no-clean (NC), nonactivated (R), and water-soluble organic acid flux (WS). It was found that the lead-free Sn-2.8Ag-0.5Cu-1.0Bi solder exhibited less wetting force, i.e., poorer wettability, than the conventional Sn-37Pb solder for all flux types and solder bath temperatures. The wettability of Sn-2.8Ag-0.5Cu-1.0Bi lead-free solder on Cu substrate was much higher than that on Ni substrate. Nonwetting for Sn-2.8Ag-0.5Cu-1.0Bi and Sn-Pb solders on Ni substrate occurred when R-type flux was used. A model was built and simulations were performed for the wetting balance test. The simulation results were found very close to the experimental results. It was also observed that larger values of immersion depth resulted in a decrease of the wetting force and corresponding meniscus height, whereas the increase in substrate perimeter enhanced the wettability. The wetting reactions between the solder and Cu/Ni substrates were also investigated, and it was found that Cu atoms diffused into the solder through the intermetallic compounds (IMCs) much faster than did the Ni atoms. Rapid formation of IMCs inhibited the wettability of Sn-2.8Ag-0.5Cu-1.0Bi solder compared to the Sn-Pb solder.

Optimising the wave soldering process for lead free solders

Nitrogen is now used in wave soldering machines to help lower the amount of dross that can be formed on the solder bath surface. The paper provides details on the use of computational fluid dynamics in helping understand the flow profiles of nitrogen in a wave soldering machine and to predict the concentration of nitrogen and oxygen around the solder bath.

Computational modelling of bubbles, droplets and particles in metals reduction and refining

A multi-phase framework is typically required for the CFD modelling of metals reduction processes. Such processes typically involve the interaction of liquid metals, a gas (often air) top space, liquid droplets in the top space and injection of both solid particles and gaseous bubbles into the bath. The exchange of mass, momentum and energy between the phases is fundamental to these processes. Multi-phase algorithms are complex and can be unreliable in terms of either or both convergence behaviour or in the extent to which the physics is captured. In this contribution, we discuss these multi-phase flow issues and describe an example of each of the main “single phase” approaches to modelling this class of problems (i.e., Eulerian–Lagrangian and Eulerian–Eulerian). Their utility is illustrated in the context of two problems – one involving the injection of sparging gases into a steel continuous slab caster and the other based on the development of a novel process for aluminium electrolysis. In the steel caster, the coupling of the Lagrangian tracking of the gas phase with the continuum enables the simulation of the transient motion of the metal–flux interface. The model of the electrolysis process employs a novel method for the calculation of slip velocities of oxygen bubbles, resulting from the dissolution of alumina, which allows the efficiency of the process to be predicted.

Comparative wetting behavior of Sn-0.7Cu and Sn-0.7Cu-0.3Ni solders on Cu and Ni substrates

Electronic packaging industries are now in great challenge to find a suitable lead-free solder as an interconnection material to replace the conventional SnPb solders. Many solders such as SnCu, SnAg, SnAgCu, SnZn, SnBi have already been proposed as the replacement but none of them has reached the physical and metallurgical properties similar to the SnPb solder. However, wetting is one of the basic problems that make the lead-free solder inferior as compared to the SnPb solder. Therefore, alloying with the help of third, fourth or fifth element is the researchers' interest to improve the wetting behavior of lead-free solders. This paper describes the comparative wetting behavior of Sn-0.7Cu and Sn-0.7Cu-0.3Ni solders on Cu and Ni substrates. Wetting balance tests were performed to assess the wetting behaviors. Three different commercial fluxes namely no-clean (NC), non-activated (R) and water soluble organic acid (WS)fluxes were used to assess the wettability for three solder bath temperatures. It was found that Sn0.7Cu-03Ni solder exhibits better wettability on Cu substrate for NC and WS fluxes whereas reverse results were found for R-type flux. In the case of Ni substrate, Sn-0.7Cu-0.3Ni solder showed better wetting behavior compared to the well-known Sn-0.7Cu solder. Among the three fluxes, R-type flux showed the worst performance. Very large contact angles were documented for both solders with this flux. Higher solder bath temperature lowered the contact angles, increased the wetting forces and enhanced the wettability. Computer modeling of wetting balance test revealed that both the wetting force and meniscus height are inversely proportional to the contact angles. Modeling results also reveal that increase in solder bath depths and radiuses do not affect significantly on the wetting behavior.

Reliability study of the electroless Ni–P layer against solder alloy

Copper (Cu) has been widely used in the under bump metallurgy of chip and substrate metallization for chip packaging. However, due to the rapid formation of Cu–Sn intermetallic compound (IMC) at the tin-based solder/Cu interface during solder reaction, the reliability of this type of solder joint is a serious concern. In this work, electroless nickel–phosphorous (Ni–P) layer was deposited on the Cu pad of the flexible substrate as a diffusion barrier between Cu and the solder materials. The deposition was carried out in a commercial acidic sodium hypophosphite bath at 85 °C for different pH values. It was found that for the same deposition time period, higher pH bath composition (mild acidic) yields thicker Ni–P layer with lower phosphorous content. Solder balls having composition 62%Sn–36%Pb–2%Ag were reflowed at 240 °C for 1 to 180 min on three types of electroless Ni–P layers deposited at the pH value of 4, 4.8 and 6, respectively. Thermal stability of the electroless Ni–P barrier layer against the Sn–36%Pb–2%Ag solder reflowed for different time periods was examined by scanning electron microscopy equipped with energy dispersed X-ray. Solder ball shear test was performed in order to find out the relationship between the mechanical strength of solder joints and the characteristics of the electroless Ni–P layer deposited. The layer deposited in the pH 4 acidic bath showed the weak barrier against reflow soldering whereas layer deposited in pH 6 acidic bath showed better barrier against reflow soldering. Mechanical strength of the joints were deteriorated quickly in the layer deposited at pH 4 acidic bath, which was found to be thin and has a high phosphorous content. From the cross-sectional studies and fracture surface analyses, it was found that the appearance of the dark crystalline phosphorous-rich Ni layer weakened the interface and hence lower solder ball shear strength. Ni–Sn IMC formed at the interfaces was found to be more stable at the low phosphorous content (∼14 at.%) layer. Electroless Ni–P deposited at mild acidic bath resulting phosphorous content of around 14 at.% is suggested as the best barrier layer for Sn–36%Pb–2%Ag solder.

Effect of adding 0.3 wt% Ni into the Sn–0.7 wt%Cu solder: part I: wetting behavior on Cu and Ni substrates

Comparative wetting behavior of Sn-0.7Cu and Sn-0.7Cu-0.3Ni solders on Cu and Ni substrates were assessed through the wetting balance test. No-clean (NC), non-activated (R) and water soluble organic acid (WS) fluxes were used to assess the wetting behavior for three different solder bath temperatures of 255, 275 and 295 °C. Experimental results unveiled that adding of 0.3 wt% Ni into Sn-0.7Cu solder can improve the wetting on Cu substrate when NC and WS fluxes are used. However, such addition of Ni did not improve the wetting of Sn-0.7Cu solder for R-type flux. In the case of Ni substrate, addition of Ni helped to improve the wetting for all three types of fluxes as higher wetting forces were documented for Sn-0.7Cu-0.3Ni solder compared to the Sn-0.7Cu solder. Among the fluxes, worst performance was observed for R-type flux. Very large contact angles were recorded for both solders with this kind of flux. Experimental results also revealed that higher solder bath temperature played an important role to lower the contact angle, to increase the wetting force and to enhance the wetting. Computer modeling of wetting balance test also revealed that both the wetting force and meniscus height are inversely proportional to the contact angles. Besides, solder bath depth and radius do not affect significantly on the wetting behavior.