10 resultados para Bäck, Erik Johan,

em Greenwich Academic Literature Archive - UK


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Graph partitioning divides a graph into several pieces by cutting edges. Very effective heuristic partitioning algorithms have been developed which run in real-time, but it is unknown how good the partitions are since the problem is, in general, NP-complete. This paper reports an evolutionary search algorithm for finding benchmark partitions. Distinctive features are the transmission and modification of whole subdomains (the partitioned units) that act as genes, and the use of a multilevel heuristic algorithm to effect the crossover and mutations. Its effectiveness is demonstrated by improvements on previously established benchmarks.

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The aim of integrating computational mechanics (FEA and CFD) and optimization tools is to speed up dramatically the design process in different application areas concerning reliability in electronic packaging. Design engineers in the electronics manufacturing sector may use these tools to predict key design parameters and configurations (i.e. material properties, product dimensions, design at PCB level. etc) that will guarantee the required product performance. In this paper a modeling strategy coupling computational mechanics techniques with numerical optimization is presented and demonstrated with two problems. The integrated modeling framework is obtained by coupling the multi-physics analysis tool PHYSICA - with the numerical optimization package - Visua/DOC into a fuJly automated design tool for applications in electronic packaging. Thermo-mechanical simulations of solder creep deformations are presented to predict flip-chip reliability and life-time under thermal cycling. Also a thermal management design based on multi-physics analysis with coupled thermal-flow-stress modeling is discussed. The Response Surface Modeling Approach in conjunction with Design of Experiments statistical tools is demonstrated and used subsequently by the numerical optimization techniques as a part of this modeling framework. Predictions for reliable electronic assemblies are achieved in an efficient and systematic manner.

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Cu column bumping is a novel flip chip packaging technique that allows Cu columns to be bonded directly with the dies. It has eliminated the under-bump-metallurgy (UBM) fonnation step of the traditional flip chip manufacturing process. This bumping technique has the potential benefits of simplifying the flip chip manufacturing process, increasing productivity and the UO counts. In this paper, a study of reliability of Cu column bumped flip chips will be presented. Computer modelling methods have been used to predict the shape of solder joints and the response of flip chips to cyclic thermal-mechanical loading. The accumulated plastic strain energy at the corner solder joints has been used as an indicator of the solder joint reliability. Models with a wide range of design parameters have been compared for their reliability. The design parameters that have been investigated are the copper column height and radius, PCB pad radius, solder volume and Cu column wetting height. The relative importance ranking of these parameters has been obtained. The Lead-free solder material 96.5Sn3.5Ag has been used in this modelling work.

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This paper describes work carried out in the FIRE EXIT research project. FIRE EXIT aims to develop an Evacuation Simulator, capable of addressing issues of mustering, ship motions, fire and abandonment. In achieving these aims, FIRE EXIT took as its starting point the state-of-the-art in ship evacuation simulation (the maritimeEXODUS software), fire simulation (the SMARTFIRE software) and large-scale experimental facilities (the SHEBA facility). It then significantly enhanced these capabilities. A number of new technologies have been developed in achieving these objectives. The innovations include directly linking CFD fire simulation with evacuation and abandonment software and automatic data transfer from concept design software allowing rapid generation of ship simulation models. Software usability was augmented by a module for interpretation of evacuation software output. Enhancements to a ship evacuation testing rig have resulted in a unique facility, capable of providing passenger movement data for realistic evacuation scenarios and large scale tests have provided meaningful data for the evacuation simulation.

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Digital Forestry has been proposed as “the science, technology, and art of systematically acquiring, integrating, analyzing, and applying digital information to support sustainable forests.” Although rooted in traditional forestry disciplines, Digital Forestry draws from a host of other fields that, in the past few decades, have become important for implementing the concept of forest ecosystem management and the principle of sustainable forestry. Digital Forestry is a framework that links all facets of forestry information at local, national, and global levels through an organized digital network. It is anticipated that a new set of principles will be established when practicing Digital Forestry concept for the evolution of forestry education, research, and practices as the 21st century unfolds.

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This chapter focuses on what the key decision makers in organizations decide after having received information on the current state of the organizational performance. Because of strong attributions to success and failure, it is impossible to predict in advance which concrete actions will occur. We can however find out what kinds of actions are decided upon by means of an organizational learning model that focuses on the hastenings and delays after performance feedback. As an illustration, the responses to performance signals by trainers and club owners in Dutch soccer clubs are analyzed.

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Book review of 'Turkey and the European Union: Prospects for a Difficult Encounter', edited by Esra Lagro and Knud Erik Jorgensen, Basingstoke and New York: Palgrave Macmillan, 2007 Pp. xii þ 240; 1 table; 1 figure; index; ISBN 9780230019553; £47.00 (hb).