Evaluation of loadsharing algorithms for heterogeneous distributed systems

The performance of loadsharing algorithms for heterogeneous distributed systems is investigated by simulation. The systems considered are networks of workstations (nodes) which differ in processing power. Two parameters are proposed for characterising system heterogeneity, namely the variance and skew of the distribution of processing power among the network nodes. A variety of networks are investigated, with the same number of nodes and total processing power, but with the processing power distributed differently among the nodes. Two loadsharing algorithms are evaluated, at overall system loadings of 50% and 90%, using job response time as the performance metric. Comparison is made with the ideal situation of ‘perfect sharing’, where it is assumed that the communication delays are zero and that complete knowledge is available about job lengths and the loading at the different nodes, so that an arriving job can be sent to the node where it will be completed in the shortest time. The algorithms studied are based on those already in use for homogeneous networks, but were adapted to take account of system heterogeneity. Both algorithms take into account the differences in the processing powers of the nodes in their location policies, but differ in the extent to which they ‘discriminate’ against the slower nodes. It is seen that the relative performance of the two is strongly influenced by the system utilisation and the distribution of processing power among the nodes.

Decision support systems for eco-friendly electronic products

This paper discusses an optimisation based decision support system and methodology for electronic packaging and product design and development which is capable of addressing in efficient manner specified environmental, reliability and cost requirements. A study which focuses on the design of a flip-chip package is presented. Different alternatives for the design of the flip-chip package are considered based on existing options for the applied underfill and volume of solder material used to form the interconnects. Variations in these design input parameters have simultaneous effect on package aspects such as cost, environmental impact and reliability. A decision system for the design of the flip-chip that uses numerical optimisation approach is used to identify the package optimal specification which satisfies the imposed requirements. The reliability aspect of interest is the fatigue of solder joints under thermal cycling. Transient nonlinear finite element analysis (FEA) is used to simulate the thermal fatigue damage in solder joints subject to thermal cycling. Simulation results are manipulated within design of experiments and response surface modelling framework to provide numerical model for reliability which can be used to quantify the package reliability. Assessment of the environmental impact of the package materials is performed by using so called Toxic Index (TI). In this paper we demonstrate the evaluation of the environmental impact only for underfill and lead-free solder materials. This evaluation is based on the amount of material per flip-chip package. Cost is the dominant factor in contemporary flip-chip packaging industry. In the optimisation based decision support system for the design of the flip-chip package, cost of materials which varies as a result of variations in the design parameters is considered.