Simulating the Swissair flight 111 in-flight fire using the CFD fire simulation software SMARTFIRE

At 8.18pm on 2 September 1998, Swissair Flight 111 (SR 111), took off from New York’s JFK airport bound for Geneva, Switzerland. Tragically, the MD-11 aircraft never arrived. According to the crash investigation report, published on 27 March 2003, electrical arcing in the ceiling void cabling was the most likely cause of the fire that brought down the aircraft. No one on board was aware of the disaster unfolding in the ceiling of the aircraft and, when a strange odour entered the cockpit, the pilots thought it was a problem with the air-conditioning system. Twenty minutes later, Swissair Flight 111 plunged into the Atlantic Ocean five nautical miles southwest of Peggy’s Cove, Nova Scotia, with the loss of all 229 lives on board. In this paper, the Computational Fluid Dynamics (CFD) analysis of the in-flight fire that brought down SR 111 is described. Reconstruction of the wreckage disclosed that the fire pattern was extensive and complex in nature. The fire damage created significant challenges to identify the origin of the fire and to appropriately explain the heat damage observed. The SMARTFIRE CFD software was used to predict the “possible” behaviour of airflow as well as the spread of fire and smoke within SR 111. The main aims of the CFD analysis were to develop a better understanding of the possible effects, or lack thereof, of numerous variables relating to the in-flight fire. Possible fire and smoke spread scenarios were studied to see what the associated outcomes would be. This assisted investigators at Transportation Safety Board (TSB) of Canada, Fire & Explosion Group in assessing fire dynamics for cause and origin determination.

CFD fire simulation of the Swissair flight 111 in-flight fire - part II: fire spread analysis

In 1998, Swissair Flight I I I (SR111) developed an in-flight fire shortly after take-off which resulted in the loss of the aircraft, a McDonnell Douglas MD-I 1, and all passengers and crew. The Transportation Safety Board (TSB) of Canada, Fire and Explosion Group launched a four year investigation into the incident in an attempt to understand the cause and subsequent mechanisms which lead to the rapid spread of the in-flight fire. As part of this investigation, the SMARTFIRE Computational Fluid Dynamics (CFD) software was used to predict the 'possible' development of the fire and associated smoke movement. In this paper the CFD fire simulations are presented and model predictions compared with key findings from the investigation. The model predictions are shown to be consistent with a number of the investigation findings associated with the early stages of the fire development. The analysis makes use of simulated pre-fire airflow conditions within the MD-11 cockpit and above ceiling region presented in an earlier publication (Part 1) which was published in The Aeronautical Journal in January 2006(4).

Multiple reflow study of ball grid array (BGA) solder joints on Au/Ni metallization

This paper evaluates the shearing behavior of ball grid array (BGA) solder joints on Au/Ni/Cu pads of FR4 substrates after multiple reflow soldering. A new Pb-free solder, Sn–3Ag–0.5Cu–8In (SACI), has been compared with Sn–3Ag–0.5Cu (SAC) and Sn–37Pb (SP) solders, in terms of fracture surfaces, shearing forces and microstructures. Three failure modes, ball cut, a combination of solder shear and solder/pad bond separation, and pad lift, are assessed for the different solders and reflow cycles. It is found that the shearing forces of the SP and SAC solder joints tend to increase slightly with an increase in the number of reflow cycles due to diffusion-induced solid solution strengthening of the bulk solder and augmentation of the shearing area. However, the shearing forces of the SACI solder joints decrease slightly after four cycles of reflow, which is ascribed to the thermal degradation of both the solder/intermetallic compound (IMC) and IMC/Ni interfaces. The SACI solder joints yield the highest strengths, whereas the SP solder joints give the smallest values, irrespective of the number of reflow cycles. Thickening of the interfacial IMC layer and coarsening of the dispersing IMC particles within the bulk solders were also observed. Nevertheless, the variation of shearing forces and IMC thickness with different numbers of reflow cycles was not so significant since the Ni under layer acted as an effective diffusion barrier. In addition, the initially-formed IMC layer retarded the further extensive dissolution of the pad material and its interaction with the solder