High current density induced damage mechanisms in electronic solder joints: a state-of-the-art review

High current density induced damages such as electromigration in the on-chip interconnection /metallization of Al or Cu has been the subject of intense study over the last 40 years. Recently, because of the increasing trend of miniaturization of the electronic packaging that encloses the chip, electromigration as well as other high current density induced damages are becoming a growing concern for off-chip interconnection where low melting point solder joints are commonly used. Before long, a huge number of publications have been explored on the electromigration issue of solder joints. However, a wide spectrum of findings might confuse electronic companies/designers. Thus, a review of the high current induced damages in solder joints is timely right this moment. We have selected 6 major phenomena to review in this paper. They are (i) electromigration (mass transfer due electron bombardment), (ii) thermomigration (mass transfer due to thermal gradient), (iii) enhanced intermetallic compound growth, (iv) enhanced current crowding, (v) enhanced under bump metallisation dissolution and (vi) high Joule heating and (vii) solder melting. the damage mechanisms under high current stressing in the tiny solder joint, mentioned in the review article, are significant roadblocks to further miniaturization of electronics. Without through understanding of these failure mechanisms by experiments coupled with mathematical modeling work, further miniaturization in electronics will be jeopardized

A UK perspective on e-learning: an overview of the "workflow" and "reusable learning object" approach in the UK eUniversities project

The UK government started the UK eUniversities project in order to create a virtual campus for online education provisions, competing in a global market. The UKeU (WWW.ukeu.com) claims to "have created a new approach to e-learning" which "opens up a range of exciting opportunities for students, business and industry worldwide" to obtain both postgraduate and undergraduate qualifications. Although there has been many promises about the e-learning revolution using state-of-the-art multimedia technology, closer scrutiny of what is being delivered reveals that many of the e-learning models currently being used are little more than the old text based computer aided learning running on a global network. As part of the UKeU project a consortium of universities have been involved in developing a two year foundation degree from 2004. We look at the approach taken by the consortium in developing global e-learning provisions and the problems and the pitfalls that lay ahead.