The many-to-many location-routing problem

In this paper the many to many location routing problem is introduced, and its relationship to various problems in distribution management is emphasised. Useful mathematical formulations which can be easily extended to cater for other related problems are produced. Techniques for tackling this complex distribution problem are also outlined.

Multilevel refinement for the vehicle routing problem

Multilevel approaches to computational problems are pervasive across many areas of applied mathematics and scientific computing. The multilevel paradigm uses recursive coarsening to create a hierarchy of approximations to the original problem, then an initial solution is found for the coarsest problem and iteratively refined and improved at each level, coarsest to finest. The solution process is aided by the global perspective (or `global view') imparted to the optimisation by the coarsening. This paper looks at their application to the Vehicle Routing Problem.

Multilevel refinement strategies for the capacity vehicle routing problem

We discuss the application of the multilevel (ML) refinement technique to the Vehicle Routing Problem (VRP), and compare it to its single-level (SL) counterpart. Multilevel refinement recursively coarsens to create a hierarchy of approximations to the problem and refines at each level. A SL algorithm, which uses a combination of standard VRP heuristics, is developed first to solve instances of the VRP. A ML version, which extends the global view of these heuristics, is then created, using variants of the construction and improvement heuristics at each level. Finally some multilevel enhancements are developed. Experimentation is used to find suitable parameter settings and the final version is tested on two well-known VRP benchmark suites. Results comparing both SL and ML algorithms are presented.

The application of multilevel refinement to the vehicle routing problem

We discuss the application of the multilevel (ML) refinement technique to the Vehicle Routing Problem (VRP), and compare it to its single-level (SL) counterpart. Multilevel refinement recursively coarsens to create a hierarchy of approximations to the problem and refines at each level. A SL heuristic, termed the combined node-exchange composite heuristic (CNCH), is developed first to solve instances of the VRP. A ML version (the ML-CNCH) is then created, using the construction and improvement heuristics of the CNCH at each level. Experimentation is used to find a suitable combination, which extends the global view of these heuristics. Results comparing both SL and ML are presented.

A nested location-routing heuristic using route length estimation

A nested heuristic approach that uses route length approximation is proposed to solve the location-routing problem. A new estimation formula for route length approximation is also developed. The heuristic is evaluated empirically against the sequential method and a recently developed nested method for location routing problems. This testing is carried out on a set of problems of 400 customers and around 15 to 25 depots with good results.

Domain decomposition methods for welding problems

This paper, a 2-D non-linear electric arc-welding problem is considered. It is assumed that the moving arc generates an unknown quantity of energy which makes the problem an inverse problem with an unknown source. Robust algorithms to solve such problems e#ciently, and in certain circumstances in real-time, are of great technological and industrial interest. There are other types of inverse problems which involve inverse determination of heat conductivity or material properties [CDJ63][TE98], inverse problems in material cutting [ILPP98], and retrieval of parameters containing discontinuities [IK90]. As in the metal cutting problem, the temperature of a very hot surface is required and it relies on the use of thermocouples. Here, the solution scheme requires temperature measurements lied in the neighbourhood of the weld line in order to retrieve the unknown heat source. The size of this neighbourhood is not considered in this paper, but rather a domain decomposition concept is presented and an examination of the accuracy of the retrieved source are presented. This paper is organised as follows. The inverse problem is formulated and a method for the source retrieval is presented in the second section. The source retrieval method is based on an extension of the 1-D source retrieval method as proposed in [ILP].

Modelling the metal arc weldpool

Traditionally, before flip chips can be assembled the dies have to be attached with solder bumps. This process involves the deposition of metal layers on the Al pads on the dies and this is called the under bump metallurgy (UBM). In an alternative process, however, Copper (Cu) columns can be used to replace solder bumps and the UBM process may be omitted altogether. After the bumping process, the bumped dies can be assembled on to the printed circuit board (PCB) by using either solder or conductive adhesives. In this work, the reliability issues of flip chips with Cu column bumped dies have been studied. The flip chip lifetime associated with the solder fatigue failure has been modeled for a range of geometric parameters. The relative importance of these parameters is given and solder volume has been identified as the most important design parameter for long-term reliability. Another important problem that has been studied in this work is the dissolution of protection metals on the pad and Cu column in the reflow process. For small solder joints the amount of Cu which dissolves into the molten solder after the protection layers have worn out may significantly affect solder joint properties.