Numerical Modelling for Electronic Packaging - Future Requirements

The fabrication, assembly and testing of electronic packaging can involve complex interactions between physical phenomena such as temperature, fluid flow, electromagnetics, and stress. Numerical modelling and optimisation tools are key computer-aided-engineering technologies that aid design engineers. This paper discusses these technologies and there future developments.

Predicting HCl concentrations in fire enclosures using an HCl decay model coupled to a CFD-based fire field model

The amount of atmospheric hydrogen chloride (HCl) within fire enclosures produced from the combustion of chloride-based materials tends to decay as the fire effluent is transported through the enclosure due to mixing with fresh air and absorption by solids. This paper describes an HCl decay model, typically used in zone models, which has been modified and applied to a computational fluid dynamics (CFD)-based fire field model. While the modified model still makes use of some empirical formulations to represent the deposition mechanisms, these have been reduced from the original three to two through the use of the CFD framework. Furthermore, the effect of HCl flow to the wall surfaces on the time to reach equilibrium between HCl in the boundary layer and on wall surfaces is addressed by the modified model. Simulation results using the modified HCl decay model are compared with data from three experiments. The model is found to be able to reproduce the experimental trends and the predicted HCl levels are in good agreement with measured values

Design process knowledge reuse challenges and issues

Product knowledge support needs are compared in two companies with different production volumes and product complexity. Knowledge support requirements identified include: function, performance data, requirements data, common parts, regulatory guidelines and layout data. A process based data driven knowledge reuse method is evaluated in light of the identified product knowledge needs. The evaluation takes place through developing a pilot case with each company. It is found that the method provides more benefit to the high complexity design domain, in which a significant amount of work takes place at the conceptual design stages, relying on a conceptual product representation. There is not such a clear value proposition in a design environment whose main challenge is layout design and the application of standard parts and features. The method supports the requirement for conceptual product representation but does not fully support a standard parts library.