A modelling and experimental analysis of the no-flow underfill process for flip-chip assembly

In the flip-chip assembly process, no-flow underfill materials have a particular advantage over traditional underfills as the application and curing of this type of underfill can be undertaken before and during the reflow process - adding high volume throughput. Adopting a no-flow underfill process may result in underfill entrapment between solder and fluid, voiding in the underfill, a possible delamination between underfill and surrounding surfaces. The magnitude of these phenomena may adversely affect the reliability of the assembly in terms of solder joint thermal fatigue. This paper presents both an experimental and mdeling analysis investigating the reliabity of a flip-chip component and how the magnitude of underfill entrapment may affect thermal-mechanical fatigue life.

Approximation results for flow shop scheduling problems with machine availability constraints

This paper considers two-machine flow shop scheduling problems with machine availability constraints. When the processing of a job is interrupted by an unavailability period of a machine, we consider both the resumable scenario in which the processing can be resumed when the machine next becomes available, and the semi-resumable scenario in which some portion of the processing is repeated but the job is otherwise resumable. For the problem with several non-availability intervals on the first machine under the resumable scenario, we present a fast (3/2)-approximation algorithm. For the problem with one non-availability interval under the semi-resumable scenario, a polynomial-time approximation scheme is developed.

Rheological characterisation of solder pastes and isotropic conductive adhesives used for flip-chip assembly

Solder pastes and isotropic conductive adhesives (ICAs) are widely used as a principal bonding medium in the electronic industry. This study investigates the rheological behaviour of the pastes (solder paste and isotropic conductive adhesives) used for flip-chip assembly. Oscillatory stress sweep test are performed to evaluate solid characteristic and cohesiveness of the lead-free solder pastes and isotropic conductive adhesive paste materials. The results show that the G' (storage modulus) is higher than G '' (loss modulus) for the pastes material indicating a solid like behaviour. It result shows that the linear visco-elastic region for the pastes lies in a very small stress range, below 10 Pa. in addition, the stress at which the value of storage modulus is equal to that of loss modulus can be used as an indicator of the paste cohesiveness. The measured cross-over stress at G'=G '' shows that the solder paste has higher stress at G'=G '' compared to conductive adhesives. Creep-recovery test method is used to study the slump behaviour in the paste materials. The conductive adhesive paste shows a good recovery when compared to the solder pastes. (C) 2008 Elsevier B.V. All rights reserved.

Velocity measurement of pneumatically conveyed solids using electrodynamic sensors

Theoretical and experimental studies of cross correlation techniques applied to non-restrictive velocity measurement of pneumatically conveyed solids using ring-shaped electrodynamic flow sensors are presented. In-depth studies of the electrodynamic sensing mechanism, and also of the spatial sensitivity and spatial filtering properties of the sensor are included, together with their relationships to measurement accuracy and the effects of solids' velocity profiles. The experimental evaluation of a 53 mm bore sensing head is described, including trials using a calibrated pneumatic conveyor circulating pulverized fuel and cement. Comparisons of test results with the mathematical models of the sensor are used to identify important aspects of the instrument design. Off-line test results obtained using gravity-fed solids flow show that the system repeatability is within +/-0.5% over the velocity range of 2-4 m s(-1) for volumetric concentrations of solids no greater than 0.2%. Results obtained in the pilot-plant trials demonstrate that the system is capable of achieving repeatability better than +/-2% and linearity within +/-2% over the velocity range 20-40 m s(-1) for volumetric concentrations of solids in the range 0.01-0.44%.