2 resultados para 769

em Greenwich Academic Literature Archive - UK


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This paper details and demonstrates integrated optimisation-reliability modelling for predicting the performance of solder joints in electronic packaging. This integrated modelling approach is used to identify efficiently and quickly the most suitable design parameters for solder joint performance during thermal cycling and is demonstrated on flip-chip components using “no-flow” underfills. To implement “optimisation in reliability” approach, the finite element simulation tool – PHYSICA, is coupled with optimisation and statistical tools. This resulting framework is capable of performing design optimisation procedures in an entirely automated and systematic manner.

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Accurate design of two-phase air-solid pipelines requires data from flow and pressure measurements, requiring the appropriate positioning and selection of sensors as well as judicious processing of signals. This paper shows how detailed measurements of pressure profiles have been obtained for use in design of improved pneumatic conveying pipelines.