Modelling induction melting energy savings

Electromagnetic processing of liquid metals involves dynamic change of the fluid volume interfacing with a melting solid material, gas or vacuum, and possibly a different liquid. Electromagnetic field and the associated force field are strongly coupled to the free surface dynamics and the heat-mass transfer. We present practical modelling examples of the flow and heat transfer using an accurate pseudo-spectral code and the k-omega turbulence model suitable for complex and transitional flows with free surfaces. The 'cold crucible' melting is modelled dynamically including the melting front gradual propagation and the magnetically confined free surrounding interface. Intermittent contact with the water-cooled segmented wall and the radiation heat losses are parts of the complex problem.

Modeling the diffusion of solid copper into liquid solder alloys

During the soldering process, the copper atoms diffuse into liquid solders. The diffusion process determines integrity and the reworking possibility of a solder joint. In order to capture the diffusion scenarios of solid copper into liquid Sn–Pb and Sn–Cu solders, a computer modeling has been performed for 10 s. An analytical model has also been proposed for calculating the diffusion coefficient of copper into liquid solders. It is found that the diffusion coefficient for Sn–Pb solder is 2.74 × 10− 10 m2/s and for Sn–Cu solder is 6.44 × 10−9 m2/s. The modeling results reveal that the diffusion coefficient is one of the major factors that govern the rate at which solid Cu dissolve in the molten solder. The predicted dissolved amounts of copper into solders have been validated with the help of scanning electron microscopic analysis.