The Royal Statistical Society and statistical education

This paper describes the role of the Royal Statistical Society in shaping statistical education within the UK and further afield. Until 2001 the Society had four agencies concerned with education at all levels. The work of these is discussed and recent new arrangements are outlined. The Society’s efforts to disseminate good practice through organising meetings and running a network of Associate Schools and College are explored in some detail.

[Review] Assessment: Problems, Developments and Statistical Issues; a Volume of Expert Contributions. Edited by H. Goldstein and T. Lewis. ISBN 0 471 95668 6. Wiley, Chichester, 1996. viii+274 pp., £45.

This is a book on general issues to do with assessment, not a statistics book, although it touches on statistical issues. Although it is intended for an international readership to include teachers, educationalists, policy makers and personnel managers and would be of interest to such groups it has been written mainly from the viewpoint of developed countries and is not obviously essential reading or an essential purchase for anyone. Short biographies of the 15 contributors are given at the start of the book and references from all the chapters are brought together at the end. The order of chapters appears to be arbitrary to some extent and there is little cross-referencing from one chapter to another.

Optimization and finite element analysis for reliable electronic packaging

This paper demonstrates a modeling and design approach that couples computational mechanics techniques with numerical optimisation and statistical models for virtual prototyping and testing in different application areas concerning reliability of eletronic packages. The integrated software modules provide a design engineer in the electronic manufacturing sector with fast design and process solutions by optimizing key parameters and taking into account complexity of certain operational conditions. The integrated modeling framework is obtained by coupling the multi-phsyics finite element framework - PHYSICA - with the numerical optimisation tool - VisualDOC into a fully automated design tool for solutions of electronic packaging problems. Response Surface Modeling Methodolgy and Design of Experiments statistical tools plus numerical optimisaiton techniques are demonstrated as a part of the modeling framework. Two different problems are discussed and solved using the integrated numerical FEM-Optimisation tool. First, an example of thermal management of an electronic package on a board is illustrated. Location of the device is optimized to ensure reduced junction temperature and stress in the die subject to certain cooling air profile and other heat dissipating active components. In the second example thermo-mechanical simulations of solder creep deformations are presented to predict flip-chip reliability and subsequently used to optimise the life-time of solder interconnects under thermal cycling.

Multi-physics modelling for microelectronics and microsystems - current capabilities and future challenges

At present the vast majority of Computer-Aided- Engineering (CAE) analysis calculations for microelectronic and microsystems technologies are undertaken using software tools that focus on single aspects of the physics taking place. For example, the design engineer may use one code to predict the airflow and thermal behavior of an electronic package, then another code to predict the stress in solder joints, and then yet another code to predict electromagnetic radiation throughout the system. The reason for this focus of mesh-based codes on separate parts of the governing physics is essentially due to the numerical technologies used to solve the partial differential equations, combined with the subsequent heritage structure in the software codes. Using different software tools, that each requires model build and meshing, leads to a large investment in time, and hence cost, to undertake each of the simulations. During the last ten years there has been significant developments in the modelling community around multi- physics analysis. These developments are being followed by many of the code vendors who are now providing multi-physics capabilities in their software tools. This paper illustrates current capabilities of multi-physics technology and highlights some of the future challenges