Analysing the evacuation procedures employed on a Thames passenger boat using the maritimeEXODUS evacuation model

On the 19 June 2001, a Thames passenger/tour boat underwent several evacuation trials. This work was conducted in order to collect data for the validation of marine-based computer models. The trials involved 111 participants who were distributed throughout the vessel. The boat had two decks and two points of exit from the lower deck placed on either side of the craft, forward and aft. The boat had a twin set of staircases towards the rear of the craft, just forward of the rear exits. maritimeEXODUS was used to simulate the full-scale evacuation trials conducted. The simulation times generated were compared against the original results and categorised according to the exit point availability. The predictions closely approximate the original results, differing by an average of 6.6% across the comparisons, with numerous qualitative similarities between the predictions and experimental results. The maritimeEXODUS evacuation model was then used to examine the evacuation procedure currently employed on the vessel. This was found to have potential to produce long evacuation times. maritimeEXODUS was used to suggest modifications to the mustering procedures. These theoretical results suggest that it is possible to significantly reduce evacuation times.

The relationship between disgust sensitivity, anxiety and obsessions

Three hundred participants, including volunteers from an obsessional support group, filled in questionnaires relating to disgust sensitivity, health anxiety, anxiety, fear of death, fear of contamination and obsessionality as part of an investigation into the involvement of disgust sensitivity in types of obsessions. Overall, the data supported the hypothesis that a relationship does exist between disgust sensitivity and the targeted variables. A significant predictive relationship was found between disgust sensitivity and total scores on the obsessive compulsive inventory (OCI; Psychological Assessment 10 (1998) 206) for both frequency and distress of symptomatology. Disgust sensitivity scores were significantly related to health anxiety scores and general anxiety scores and to all the obsessional subscales, with the exception of hoarding. Additionally, multiple regression analyses revealed that disgust sensitivity may be more specifically related to washing compulsions: frequency of washing behaviour was best predicted by disgust sensitivity scores. Washing distress scores were best predicted by health anxiety scores, though disgust sensitivity entered in the second model. It is suggested that further research on the relationship between disgust sensitivity and obsessionality could be helpful in refining the theoretical understanding of obsessions.

Modelling the performance of lead-Free solder interconnects for copper bumped flip-chip devices

Traditionally, before flip chips can be assembled the dies have to be attached with solder bumps. This process involves the deposition of metal layers on the Al pads on the dies and this is called the under bump metallurgy (UBM). In an alternative process, however, Copper (Cu) columns can be used to replace solder bumps and the UBM process may be omitted altogether. After the bumping process, the bumped dies can be assembled on to the printed circuit board (PCB) by using either solder or conductive adhesives. In this work, the reliability issues of flip chips with Cu column bumped dies have been studied. The flip chip lifetime associated with the solder fatigue failure has been modeled for a range of geometric parameters. The relative importance of these parameters is given and solder volume has been identified as the most important design parameter for long-term reliability. Another important problem that has been studied in this work is the dissolution of protection metals on the pad and Cu column in the reflow process. For small solder joints the amount of Cu which dissolves into the molten solder after the protection layers have worn out may significantly affect solder joint properties.