5 resultados para 100602 Input Output and Data Devices

em Greenwich Academic Literature Archive - UK


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With the growth in computing power, and advances in numerical methods for the solution of partial differential equations, modeling technologies based around computational fluid dynamics, finite element analysis and optimisation are now being widely used by researchers and industry. Polymer and adhesive materials are now being widely used in electronic and photonic devices. This paper will illustrate the use of modeling tools to predict the behaviour of these materials from product assembly to its performance and reliability.

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Analysis of the generic attacks and countermeasures for block cipher based message authentication code algorithms (MAC) in sensor applications is undertaken; the conclusions are used in the design of two new MAC constructs Quicker Block Chaining MAC1 (QBC-MAC1) and Quicker Block Chaining MAC2 (QBC-MAC2). Using software simulation we show that our new constructs point to improvements in usage of CPU instruction clock cycle and energy requirement when benchmarked against the de facto Cipher Block Chaining MAC (CBC-MAC) based construct used in the TinySec security protocol for wireless sensor networks.

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We consider the optimum design of pilot-symbol-assisted modulation (PSAM) schemes with feedback. The received signal is periodically fed back to the transmitter through a noiseless delayed link and the time-varying channel is modeled as a Gauss-Markov process. We optimize a lower bound on the channel capacity which incorporates the PSAM parameters and Kalman-based channel estimation and prediction. The parameters available for the capacity optimization are the data power adaptation strategy, pilot spacing and pilot power ratio, subject to an average power constraint. Compared to the optimized open-loop PSAM (i.e., the case where no feedback is provided from the receiver), our results show that even in the presence of feedback delay, the optimized power adaptation provides higher information rates at low signal-to-noise ratios (SNR) in medium-rate fading channels. However, in fast fading channels, even the presence of modest feedback delay dissipates the advantages of power adaptation.

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This paper describes modeling technology and its use in providing data governing the assembly and subsequent reliability of electronic chip components on printed circuit boards (PCBs). Products, such as mobile phones, camcorders, intelligent displays, etc., are changing at a tremendous rate where newer technologies are being applied to satisfy the demands for smaller products with increased functionality. At ever decreasing dimensions, and increasing number of input/output connections, the design of these components, in terms of dimensions and materials used, is playing a key role in determining the reliability of the final assembly. Multiphysics modeling techniques are being adopted to predict a range of interacting physics-based phenomena associated with the manufacturing process. For example, heat transfer, solidification, marangoni fluid flow, void movement, and thermal-stress. The modeling techniques used are based on finite volume methods that are conservative and take advantage of being able to represent the physical domain using an unstructured mesh. These techniques are also used to provide data on thermal induced fatigue which is then mapped into product lifetime predictions.

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A novel circuit design technique is presented which improves gain-accuracy and linearity in differential amplifiers. The technique employs negative impedance compensation and results demonstrate a significant performance improvement in precision, lowering sensitivity, and wide dynamic range. A theoretical underpinning is given together with the results of a demonstrator differential input/output amplifier with gain of 12 dB. The simulation results show that, with the novel method, both the gain-accuracy and linearity can be improved greatly. Especially, the linearity improvement in IMD can get to more than 23 dB with a required gain.