Modelling the reliability of components on flexible substrates

The use of flexible substrates is growing in many applications such as computer peripherals, hand held devices, telecommunications, automotive, aerospace, etc. The drive to adopt flexible circuits is due to their ability to reduce size, weight, assembly time and cost of final product. they also accommodate flexibility by allowing relative movement between component parts and provide a route for three dimensional packaging. This paper will describe some of the current research results from the Flex-No-Lead project, European Commission sponsored programme. The principle aim of this project is to investigate the processing, performance and reliability of flexible substrates when subjected to new environmentally friendly, lead-free soldering technologies. This paper will discuss the impact of specific design variables on performance and reliability. In particular the paper will focus on copper track designs, substrate material, dielectric material and solder mask defined joints

Modelling technologies and applications

Numerical modelling technology and software is now being used to underwrite the design of many microelectronic and microsystems components. The demands for greater capability of these analysis tools are increasing dramatically, as the user community is faced with the challenge of producing reliable products in ever shorter lead times. This leads to the requirement for analysis tools to represent the interactions amongst the distinct phenomena and physics at multiple length and timescales. Multi-physics and Multi-scale technology is now becoming a reality with many code vendors. This chapter discusses the current status of modelling tools that assess the impact of nano-technology on the fabrication/packaging and testing of microsystems. The chapter is broken down into three sections: Modelling Technologies, Modelling Application to Fabrication, and Modelling Application to Assembly/Packing and Modelling Applied for Test and Metrology.

Numerical modelling of electrodeposition phenomena

Electrodeposition is a widely used technique for the fabrication of high aspect ratio microstructure components. In recent years much research has been focused within this area with an aim to understanding the physics behind the filling of high-aspect ratio vias and trenches on PCB's and in particular how they can be made without the formation of voids in the deposited material. This paper describes some of the fundamental work towards the advancement of numerical models that can predict the electrodeposition process and addresses: i) A novel technique for interface motion based on a variation of a donor-acceptor technique ii) A methodology for the investigation of stress profiles in deposits iii) The implementation of acoustic forces to generate replenishing electrolytic flow circulation in recessed features.

Computer simulation of crack propagation in power electronics module solder joints

A numerical modelling method for the analysis of solder joint damage and crack propagation has been described in this paper. The method is based on the disturbed state concept. Under cyclic thermal-mechanical loading conditions, the level of damage that occurs in solder joints is assumed to be a simple monotonic scalar function of the accumulated equivalent plastic strain. The increase of damage leads to crack initiation and propagation. By tracking the evolution of the damage level in solder joints, crack propagation path and rate can be simulated using Finite Element Analysis method. The discussions are focused on issues in the implementation of the method. The technique of speeding up the simulation and the mesh dependency issues are analysed. As an example of the application of this method, crack propagation in solder joints of power electronics modules under cyclic thermal-mechanical loading conditions has been analyzed and the predicted cracked area size after 3000 loading cycles is consistent with experimental results.

Implementation of cognitive mapping, spatial representation and wayfinding behaviours of people within evacuation modelling tools

Within the building evacuation context, wayfinding describes the process in which an individual located within an arbitrarily complex enclosure attempts to find a path which leads them to relative safety, usually the exterior of the enclosure. Within most evacuation modelling tools, wayfinding is completely ignored; agents are either assigned the shortest distance path or use a potential field to find the shortest path to the exits. In this paper a novel wayfinding technique that attempts to represent the manner in which people wayfind within structures is introduced and demonstrated through two examples. The first step is to encode the spatial information of the enclosure in terms of a graph. The second step is to apply search algorithms to the graph to find possible routes to the destination and assign a cost to the routes based on their personal route preferences such as "least time" or "least distance" or a combination of criteria. The third step is the route execution and refinement. In this step, the agent moves along the chosen route and reassesses the route at regular intervals and may decide to take an alternative path if the agent determines that an alternate route is more favourable e.g. initial path is highly congested or is blocked due to fire.

Time-dependent modelling and experimental validation of the metal/flux interface in a continuous casting mould

A finite volume computer model of the continuous casting process for steel flat products has been developed. In this first stage, the model concentrates on the hydrodynamic aspects of the process and in particular the dynamic behavior of the metal/slag interface. The model was validated against experimental measurements obtained in a water model apparatus.

Modelling and optimization of a pneumatic microfeeder system

This paper presents modelling and design optimization of a microfeeder which, as part of a microassembly system, is used for contactless object delivery. The microfeeder consists of an array of microactuators which are controlled by electrostatic actuation and used for maneuvering outcoming air jet for object hovering and delibery. The airflow behaviour in the microactuator is analysed by means of fluid mechanics and Computational Fluid Dynamics (CFD) simulation from three aspects, theoretical analysis, initial design assessment, and design modifications. The focus is put on the basic types of the microfeeder structure and the effects of structural details to the systematic performance. The structural pattern of the microactuator for forming airflow nozzle is identified and two design plans are proposed as basic structure patterns of pneumatic microactuators. The optimized design numerically shows the ability of delivering objects. This paper analyses the flow distribution pattern in microactuators and points out a way for effective design of pneumatic microfeeder systems. The optimization strategy provided by the present paper has close relevance to the design and manufacture of pneumatic microfeeder systems.

Modelling turbulent flow dynamics in AC magnetic field

Abstract not available

Computational modelling of reduction and smelting processes in the primary metals industries

Abstract not available