A critical analysis of polymer cure modeling for microelectronics applications

A review of polymer cure models used in microelectronics packaging applications reveals no clear consensus of the chemical rate constants for the cure reactions, or even of an effective model. The problem lies in the contrast between the actual cure process, which involves a sequence of distinct chemical reactions, and the models, which typically assume only one, (or two with some restrictions on the independence of their characteristic constants.) The standard techniques to determine the model parameters are based on differential scanning calorimetry (DSC), which cannot distinguish between the reactions, and hence yields results useful only under the same conditions, which completely misses the point of modeling. The obvious solution is for manufacturers to provide the modeling parameters, but failing that, an alternative experimental technique is required to determine individual reaction parameters, e.g. Fourier transform infra-red spectroscopy (FTIR).

Microwave curing of thermosetting polymer materials in microelectronics applications

Thermosetting polymer materials are widely utilised in modern microelectronics packaging technology. These materials are used for a number of functions, such as for device bonding, for structural support applications and for physical protection of semiconductor dies. Typically, convection heating systems are used to raise the temperature of the materials to expedite the polymerisation process. The convection cure process has a number of drawbacks including process durations generally in excess of 1 hour and the requirement to heat the entire printed circuit board assembly, inducing thermomechanical stresses which effect device reliability. Microwave energy is able to raise the temperature of materials in a rapid, controlled manner. As the microwave energy penetrates into the polymer materials, the heating can be considered volumetric – i.e. the rate of heating is approximately constant throughout the material. This enables a maximal heating rate far greater than is available with convection oven systems which only raise the surface temperature of the polymer material and rely on thermal conductivity to transfer heat energy into the bulk. The high heating rate, combined with the ability to vary the operating power of the microwave system, enables the extremely rapid cure processes. Microwave curing of a commercially available encapsulation material has been studied experimentally and through use of numerical modelling techniques. The material assessed is Henkel EO-1080, a single component thermosetting epoxy. The producer has suggested three typical convection oven cure options for EO1080: 20 min at 150C or 90 min at 140C or 120 min at 110C. Rapid curing of materials of this type using advanced microwave systems, such as the FAMOBS system [1], is of great interest to microelectronics system manufacturers as it has the potential to reduce manufacturing costs, increase device reliability and enables new device designs. Experimental analysis has demonstrated that, in a realistic chip-on-board encapsulation scenario, the polymer material can be fully cured in approximately one minute. This corresponds to a reduction in cure time of approximately 95 percent relative to the convection oven process. Numerical assessment of the process [2] also suggests that cure times of approximately 70 seconds are feasible whilst indicating that the decrease in process duration comes at the expense of variation in degree of cure within the polymer.

Cross-cultural partnerships must talk to build trust

Academic partnerships bring knowledge and drive economic growth, but success depends on good communications that build trust, says Tim Gore.

Globalising knowledge

The technology enablers of Friedman’s Flat World have made enormous differences to knowledge creation and sharing. The disaggregation of supply chains has been followed by the partial disaggregation of knowledge supply chains as some knowledge producers set up innovation centres in various locations around the world. But there is considerable evidence that instead of a flat world distribution of knowledge production there are hubs of innovation and knowledge creation developing in a relatively limited number of locations around the world. This paper discusses this clustering effect and looks at some of the possible explanations. In particular it looks at the human and social aspects of knowledge creation and sharing that resist distance and are starting to be taken into account in the design of technological approaches to knowledge management.

Global research collaboration: the UKIERI India-UK initiative – lessons from practice for sustainable international partnerships

As knowledge development is claimed to underpin the development of globalisation, interest in research collaboration and its internationalisation has become more widespread. This paper looks at the motivations behind, and development of, higher educational collaborations with a focus on research collaboration, and also compares some of the key issues surrounding academic collaborations. It employs current thinking on strategic alliances and in particular on social network and social capital theories to judge how collaborations can best be encouraged and managed. The paper uses the specific case of India-UK relationship as an example and looks at the context and motivation for collaboration in these two countries. It presents the UK India Education and Research Initiative (UKIERI) and reviews how this initiative deals with the issues discussed by current writers in relation to collaboration, as well as drawing lessons from the initiative for research collaboration more widely.