A hybrid Laplace transform/finite difference boundary element method for diffusion problems

The solution process for diffusion problems usually involves the time development separately from the space solution. A finite difference algorithm in time requires a sequential time development in which all previous values must be determined prior to the current value. The Stehfest Laplace transform algorithm, however, allows time solutions without the knowledge of prior values. It is of interest to be able to develop a time-domain decomposition suitable for implementation in a parallel environment. One such possibility is to use the Laplace transform to develop coarse-grained solutions which act as the initial values for a set of fine-grained solutions. The independence of the Laplace transform solutions means that we do indeed have a time-domain decomposition process. Any suitable time solver can be used for the fine-grained solution. To illustrate the technique we shall use an Euler solver in time together with the dual reciprocity boundary element method for the space solution

Semantic web and e-learning

With emergence of "Semantic Web" there has been much discussion about the impact of technologies such as XML and RDF on the way we use the Web for developing e-learning applications and perhaps more importantly on how we can personalise these applications. Personalisation of e-learning is viewed by many authors (see amongst others Eklund & Brusilovsky, 1998; Kurzel, Slay, & Hagenus, 2003; Martinez, 2000; Sampson, Karagiannidis, & Kinshuk, 2002; Voigt & Swatman, 2003) as the key challenge for the learning technologists. According to Kurzel (2004) the tailoring of e-learning applications can have an impact on content and how it's accesses; the media forms used; method of instruction employed and the learning styles supported. This paper will report on a research project currently underway at the eCentre in University of Greenwich which is exploring different approaches and methodologies to create an e-learning platform with personalisation built-in. This personalisation is proposed to be set from different levels of within the system starting from being guided by the information that the user inputs into the system down to the lower level of being set using information inferred by the system's processing engine.

Fracture mechanics analysis of cracks in solder joint intermetallic compounds

The trend towards miniaturization of electronic products leads to the need for very small sized solder joints. Therefore, there is a higher reliability risk that too large a fraction of solder joints will transform into Intermetallic Compounds (IMCs) at the solder interface. In this paper, fracture mechanics study of the IMC layer for SnPb and Pb-free solder joints was carried out using finite element numerical computer modelling method. It is assumed that only one crack is present in the IMC layer. Linear Elastic Fracture Mechanics (LEFM) approach is used for parametric study of the Stress Intensity Factors (SIF, KI and KII), at the predefined crack in the IMC layer of solder butt joint tensile sample. Contrary to intuition, it is revealed that a thicker IMC layer in fact increases the reliability of solder joint for a cracked IMC. Value of KI and KII are found to decrease with the location of the crack further away from the solder interfaces while other parameters are constant. Solder thickness and strain rate were also found to have a significant influence on the SIF values. It has been found that soft solder matrix generates non-uniform plastic deformation across the solder-IMC interface near the crack tip that is responsible to obtain higher KI and KII.

Failure mechanisms of ACF joints under isothermal ageing

The possible failure mechanisms of anisotropic conductive film (ACF) joints under isothermal ageing conditions have been identified through experiments. It has been found that ACF joints formed at higher bonding temperatures can prevent increases in the contact resistance for any ageing temperature. The higher the ageing temperature the higher the electrical failure rate is. The formation of conduction gaps between the conductive particles and the pads and damages to the metal coatings of the particle have been identified as the reasons behind the electrical failures during ageing. In order to understand the mechanism for the formation of the conduction gap and damages in metal coatings during the isothermal ageing, computer modelling has been carried out and the results are discussed extensively. The computer analysis shows that stresses concentrate at the edges of the particle–pad interface, where the adhesive matrix meets the particle. This could lead to subsequent damages and reductions in the adhesion strength in that region and it is possible for the conductive particle to be detached from the pad and the adhesive matrix. It is believed that because of this a conduction gap appears. Furthermore, under thermal loading the thermal expansion of the adhesive matrix squeezes the conductive particle and damages the metal coatings. Experimental evidences support this computational finding. It is, therefore, postulated that if an ACF-based electronic component operates in a high temperature aging condition, its electrical and mechanical functionalities will be at risk.

The impact on students of coursework assessment deadlines and penalties

The use by students of an e-learning system that enhances traditional learning in a large university computing school where there are clear assessment deadlines and severe penalties for late submission of coursework is examined to assess the impact of changes to the deadline model on the way students use the system and on the results they achieve. It is demonstrated that the grade a student achieves is partly dependent on the time before the deadline when the work is completed - in general, students who submit earlier gain higher grades. Possible reasons for this are explored. Analysis of the data from a range of different implementations of deadline policies is presented. Suggestions are made on how to minimise any possible negative impact of the assessment policy on the student's overall learning.

Some issues on assessment methods and learning in mathematics and statistics

This paper looks at the application of some of the assessment methods in practice with the view to enhance students’ learning in mathematics and statistics. It explores the effective application of assessment methods and highlights the issues or problems, and ways of avoiding them, related to some of the common methods of assessing mathematical and statistical learning. Some observations made by the author on good assessment practice and useful approaches employed at his institution in designing and applying assessment methods are discussed. Successful strategies in implementing assessment methods at different levels are described.

A framework to integrate design knowledge reuse and requirements management in engineering design

This paper presents a framework to integrate requirements management and design knowledge reuse. The research approach begins with a literature review in design reuse and requirements management to identify appropriate methods within each domain. A framework is proposed based on the identified requirements. The framework is then demonstrated using a case study example: vacuum pump design. Requirements are presented as a component of the integrated design knowledge framework. The proposed framework enables the application of requirements management as a dynamic process, including capture, analysis and recording of requirements. It takes account of the evolving requirements and the dynamic nature of the interaction between requirements and product structure through the various stages of product development.