Modelling the tilt-casting process for the tranquil filling of titanium alloy turbine blades

The tilt-casting method is used to achieve tranquil filling of gamma-TiAl turbine blades. The reactive alloy is melted in a cold crucible using an induction coil and then the complete crucible-mould- running system assembly is rotated through 180degrees to transfer the metal into the mould. The induction current is ramped down gradually as the rotation starts and the mould is preheated to maintain superheat. The liquid metal then enters the mould and the gas within it (argon) escapes through the inlet aperture and through auxiliary vents. Solidification starts as soon the metal enters the mould and it is important to account for this effect to predict and prevent misruns. The rotation rate has to be controlled carefully to allow sufficient time for gas evacuation, but at the same time preserve superheat. This 3-phase system is modelled using the FV method, with a fast implicit numerical scheme used to capture the transient liquid free surface. The enthalpy method is used to model solidification and predict defects such as trapped bubbles, macro-porosity or surface connected porosity. Modeling is used to support an experimental program for the development of a production method for gamma-TiAl blades, with a target length of 40cm. The experiments provide validation for the model and the model in turn optimizes the tilt-casting process. The work is part of the EU project IMPRESS.

Time-dependent modelling and experimental validation of the metal/flux interface in a continuous casting mould

A finite volume computer model of the continuous casting process for steel flat products has been developed. In this first stage, the model concentrates on the hydrodynamic aspects of the process and in particular the dynamic behavior of the metal/slag interface. The model was validated against experimental measurements obtained in a water model apparatus.

Modeling the diffusion of solid copper into liquid solder alloys

During the soldering process, the copper atoms diffuse into liquid solders. The diffusion process determines integrity and the reworking possibility of a solder joint. In order to capture the diffusion scenarios of solid copper into liquid Sn–Pb and Sn–Cu solders, a computer modeling has been performed for 10 s. An analytical model has also been proposed for calculating the diffusion coefficient of copper into liquid solders. It is found that the diffusion coefficient for Sn–Pb solder is 2.74 × 10− 10 m2/s and for Sn–Cu solder is 6.44 × 10−9 m2/s. The modeling results reveal that the diffusion coefficient is one of the major factors that govern the rate at which solid Cu dissolve in the molten solder. The predicted dissolved amounts of copper into solders have been validated with the help of scanning electron microscopic analysis.