Schedules with due-date assignment and position-dependent processing times

Single machine scheduling problems are considered, in which the processing of jobs depend on positions of the jobs in a schedule and the due-dates are assigned either according to the CON rule (a due-date common to all jobs is chosen) or according to the SLK rule (the due-dates are computed by increasing the actual processing times of each job by a slack, common to all jobs). Polynomial-time dynamic programming algorithms are proposed for the problems with the objective functions that include the cost of assigning the due-dates, the total cost of disgarded jobs (which are not scheduled) and, possibly, the total earliness of the scheduled jobs.

Numerical simulation of encapsulant curing within a variable frequency microwave processing system

Curing of encapsulant material in a simplified microelectronics package using an open oven Variable Frequency Microwave (VFM) system is numerically simulated using a coupled solver approach. A numerical framework capable of simulating electromagnetic field distribution within the oven system, plus heat transfer, cure rate, degree of cure and thermally induced stresses within the encapsulant material is presented. The discrete physical processes have been integrated into a fully coupled solution, enabling usefully accurate results to be generated. Numerical results showing the heating and curing of the encapsulant material have been obtained and are presented in this contribution. The requirement to capture inter-process coupling and the variation in dielectric and thermophysical material properties is discussed and illustrated with simulation results.

Multiphysics simulation of microwave processing using a multidomain coupled solver approach

Microwave processing of materials is numerically simulated using a coupled solver approach. Microwave heating is a complex coupled process due to the variation in dielectric properties during heating. The effects of heating an object in a electromagnetic field directly influence the manner in which it interacts with the field. Simplifying assumptions and empirical solutions do not capture the fundamental physics involved and, in general, do not provide usefully accurate solutions in a number of practical problems. In order to capture the underlying processes involved in microwave heating, the problem must be looked at in a holistic manner rather than a number of discrete processes. This contribution outlines a coupled-solver multiphysics analysis approach to the solution of practical microwave heating problems.

Concise introduction to image processing using C++

A Concise Intro to Image Processing using C++ presents state-of-the-art image processing methodology, including current industrial practices for image compression, image de-noising methods based on partial differential equations, and new image compression methods such as fractal image compression and wavelet compression. It includes elementary concepts of image processing and related fundamental tools with coding examples as well as exercises. With a particular emphasis on illustrating fractal and wavelet compression algorithms, the text covers image segmentation, object recognition, and morphology. An accompanying CD-ROM contains code for all algorithms.

On the application of variable frequency microwave technology for processing of individual surface mount components

Dual-section variable frequency microwave systems enable rapid, controllable heating of materials within an individual surface mount component in a chip-on=board assembly. The ability to process devices individually allows components with disparate processing requirements to be mounted on the same assembly. The temperature profile induced by the microwave system can be specifically tailored to the needs of the component, allowing optimisation and degree of cure whilst minimising thermomechanical stresses. This paper presents a review of dual-section microwave technology and its application to curing of thermosetting polymer materials in microelectronics applications. Curing processes using both conventional and microwave technologies are assessed and compared. Results indicate that dual-section microwave systems are able to cure individual surface mount packages in a significantly shorter time, at the expense of an increase in thermomechanical stresses and a greater variation in degree of cure.

Single machine scheduling and due date assignment with positionally dependent processing times

We consider single machine scheduling and due date assignment problems in which the processing time of a job depends on its position in a processing sequence. The objective functions include the cost of changing the due dates, the total cost of discarded jobs that cannot be completed by their due dates and, possibly, the total earliness of the scheduled jobs. We present polynomial-time dynamic programming algorithms in the case of two popular due date assignment methods: CON and SLK. The considered problems are related to mathematical models of cooperation between the manufacturer and the customer in supply chain scheduling.

Preemptive scheduling on uniform parallel machines with controllable job processing times

In this paper, we provide a unified approach to solving preemptive scheduling problems with uniform parallel machines and controllable processing times. We demonstrate that a single criterion problem of minimizing total compression cost subject to the constraint that all due dates should be met can be formulated in terms of maximizing a linear function over a generalized polymatroid. This justifies applicability of the greedy approach and allows us to develop fast algorithms for solving the problem with arbitrary release and due dates as well as its special case with zero release dates and a common due date. For the bicriteria counterpart of the latter problem we develop an efficient algorithm that constructs the trade-off curve for minimizing the compression cost and the makespan.

Research and perspectives on processing instruction

This volume tracks the impact processing instruction has made since its conception. It provides an overview of new research trends on measuring the relative effects of processing instruction. Firstly, the authors explain processing instruction, both its main theoretical underpinnings as well as the guidelines for developing structured input practices. Secondly, they review the empirical research conducted, to date, so that readers have an overview of new research carried out on the effects of processing instruction. The authors finally reflect on the generalizability and limits of the research on processing instruction and offer future directions for processing instruction research.

Delivering processing instruction in classroom and virtual contexts

Processing Instruction (PI) is an approach to grammar instruction for second language learning. It derives its name from the fact that the instruction (both the explicit explanation as well as the practices) attempt to influence, alter, and/or improve the way learners process input. PI contrasts with traditional grammar instruction in many ways, most principally in its focus on input whereas traditional grammar instruction focuses on learners' output. The greatest contribution of PI to both theory and practice is the concept of "structured input", a form of comprehensible input that has been manipulated to maximize learners' benefit of exposure to input. This volume focuses on a new issue for PI, the role of technology in language learning. It examines empirically the differential effects of delivering PI in classrooms with an instructor and students interacting (with each other and with the instructor) versus on computers to students working individually. It also contributes to the growing body of research on the effects of PI on different languages as well as different linguistic items: preterite/imperfect aspectual contrast and negative informal commands in Spanish, the subjunctive of doubt and opinion in Italian, and the subjunctive of doubt in French. Further research contributions are made by comparing PI with other types of instruction, specifically, with meaning-oriented output instruction.

Second language processing: an analysis of theory, problems and possible solutions

Second Language Processing examines the problems facing learners in the second language classroom from the theoretical perspectives of Processing Instruction (structured input) and Enhanced Input. These two theories are brought to bear on a variety of processing problems, such as the difficulty of connecting second language grammatical forms encoding tense and mood as well as noun-adjective agreement with their meaning. Empirical studies examine a range of languages including Japanese, Italian and Spanish, through which the authors suggest practical solutions to these processing problems.

Grammar acquisition and processing instruction: Secondary and cumulative effects

Research on Processing Instruction has so far investigated the primary effects of Processing Instruction. In this book, the results of a series of experimental studies investigating possible secondary and cumulative effects of Processing Instruction on the acquisition of French, Italian and English as a second language will be presented. The results of the three experiments have demonstrated that Processing Instruction not only provides learners the direct or primary benefit of learning to process and produce the morphological form on which they received instruction, but also a secondary benefit in that they transferred that training to processing and producing another morphological form on which they had received no instruction.

On variable frequency microwave processing of heterogeneous chip-on-board assemblies

Variable Frequency Microwave (VFM) processing of heterogeneous chip-on-board assemblies is assessed using a multiphysics modelling approach. The Frequency Agile Microwave Oven Bonding System (FAMOBS) is capable of rapidly processing individual packages on a Chip-On-Board (COB) assembly. This enables each package to be processed in an optimal manner, with temperature ramp rate, maximum temperature and process duration tailored to the specific package, a significant benefit in assemblies containing disparate package types. Such heterogeneous assemblies may contain components such as large power modules alongside smaller modules containing low thermal budget materials with highly disparate processing requirements. The analysis of two disparate packages has been assessed numerically to determine the applicability of the dual section microwave system to curing heterogeneous devices and to determine the influence of differing processing requirements of optimal process parameters.

Solid phase velocity measurements utilising electrostatic sensors and cross correlation signal processing

Gas-solids two phase systems are widely employed within process plant in the form of pneumatic conveyors, dust extraction systems and solid fuel injection systems. The measurement of solids phase velocity therefore has wide potential application in flow monitoring and, in conjunction with density measurement instrumentation, solids mass flow rate measurement. Historically, a number of authors have detailed possible measurement techniques, and some have published limited test results. It is, however, apparent that none of these technologies have found wide application in industry. Solids phase velocity measurements were undertaken using real time cross correlation of signals from two electrostatic sensors spaced axially along a pipeline conveying pulverised coal (PF). Details of the measurement equipment, the pilot scale test rig and the test results are presented.