An improved approximation algorithm for the two-machine open shop scheduling problem with family setup times

We consider the problem of scheduling families of jobs in a two-machine open shop so as to minimize the makespan. The jobs of each family can be partitioned into batches and a family setup time on each machine is required before the first job is processed, and when a machine switches from processing a job of some family to a job of another family. For this NP-hard problem the literature contains (5/4)-approximation algorithms that cannot be improved on using the class of group technology algorithms in which each family is kept as a single batch. We demonstrate that there is no advantage in splitting a family more than once. We present an algorithm that splits one family at most once on a machine and delivers a worst-case performance ratio of 6/5.

Optimization of an open-ended microwave oven for microelectronics packaging

A physically open, but electrically shielded, microwave open oven can be produced by virtue of the evanescent fields in a waveguide below cutoff. The below cutoff heating chamber is fed by a transverse magnetic resonance established in a dielectric-filled section of the waveguide exploiting continuity of normal electric flux. In order to optimize the fields and the performance of the oven, a thin layer of a dielectric material with higher permittivity is inserted at the interface. Analysis and synthesis of an optimized open oven predicts field enhancement in the heating chamber up to 9.4 dB. Results from experimental testing on two fabricated prototypes are in agreement with the simulated predictions, and demonstrate an up to tenfold improvement in the heating performance. The open-ended oven allows for simultaneous precision alignment, testing, and efficient curing of microelectronic devices, significantly increasing productivity gains.

Open ended microwave oven for packaging

A novel open waveguide cavity resonator is presented for the combined variable frequency microwave curing of bumps, underfills and encapsulants, as well as the alignment of devices for fast flip-chip assembly, direct chip attach (DCA) or wafer-scale level packaging (WSLP). This technology achieves radio frequency (RF) curing of adhesives used in microelectronics, optoelectronics and medical devices with potential simultaneous micron-scale alignment accuracy and bonding of devices. In principle, the open oven cavity can be fitted directly onto a flip-chip or wafer scale bonder and, as such, will allow for the bonding of devices through localised heating thus reducing the risk to thermally sensitive devices. Variable frequency microwave (VFM) heating and curing of an idealised polymer load is numerically simulated using a multi-physics approach. Electro-magnetic fields within a novel open ended microwave oven developed for use in micro-electronics manufacturing applications are solved using a dedicated Yee scheme finite-difference time-domain (FDTD) solver. Temperature distribution, degree of cure and thermal stresses are analysed using an Unstructured Finite Volume method (UFVM) multi-physics package. The polymer load was meshed for thermophysical analysis, whilst the microwave cavity - encompassing the polymer load - was meshed for microwave irradiation. The two solution domains are linked using a cross mapping routine. The principle of heating using the evanescent fringing fields within the open-end of the cavity is demonstrated. A closed loop feedback routine is established allowing the temperature within a lossy sample to be controlled. A distribution of the temperature within the lossy sample is obtained by using a thermal imaging camera.

Transporting jobs through a two-machine open shop

We consider the two-machine open shop scheduling problem in which the jobs are brought to the system by a single transporter and moved between the processing machines by the same transporter. The purpose is to split the jobs into batches and to find the sequence of moves of the transporter so that the time by which the completed jobs are collected together on board the transporter is minimal. We present a 7/5-approximation algorithm. © 2008 Wiley Periodicals, Inc. Naval Research Logistics 2009

The varieties of student experience - an open research question and some ways to answer it

Based on meetings of the Society for Research into Higher Education’s Student Experience Network over the past three years, the genuinely open research question is posed whether there is one or more undergraduate student experience within English higher education. Answering this question depends on whether what is taught or what is learnt is examined. If the latter, then a unitary student experience can be said to exist only in the narrowest of normative senses. What undergraduates actually learn – defined in the widest sense – is the $64,000 question of research on the student experience. Various ways to answer this question are proposed, including using students to research students. Conceptual tools to apply to findings can be developed from youth studies and cognate disciplines, particularly in relation to student identities and aspirations. Lastly, these proposals are placed in the wider context of comparative models of the varieties of student experience, including those emerging in the UK’s national regions.