Numerical modelling of adsorption of metallic particles on graphite substrate via molecular dynamics simulation

A computer-based numerical modelling of the adsorption process of gas phase metallic particles on the surface of a graphite substrate has been performed via the application of molecular dynamics simulation method. The simulation relates to an extensive STM-based experiment performed in this field, and reproduces part of the experimental results. Both two-body and many-body inter-atomic potentials have been employed. A Morse-type potential describing the metal-carbon interactions at the interface was specifically formulated for this modelling. Intercalation of silver in graphite has been observed as well as the correct alignments of monomers, dimers and two-dimensional islands on the surface. PACS numbers: 02.60.Cb, 07.05.Tp, 68.55.-a, 81.05.Tp

Liquid metal turbulent flow dynamics in a cylindrical container with free surface: experiment and numerical analysis

The liquid metal flow in induction crucible models is known to be unstable, turbulent and difficult to predict in the regime of medium frequencies when the electromagnetic skin-layer is of considerable extent. We present long term turbulent flow measurements by a permanent magnet incorporated potential difference velocity probe in a cylindrical container filled with eutectic melt In-Ga-Sn. The parallel numerical simulation of the long time scale development of the turbulent average flow is presented. The numerical flow model uses an implicit pseudo-spectral code and k-w turbulence model, which was recently developed for the transitional flow modelling. The results compare reasonably to the experiment and demonstrate the time development of the turbulent flow field and the turbulence energy.

Magnetic levitation fluid dynamics

This work is concerned with the accurate computation of flow in a rapidly deforming liquid metal droplet, suspended in an AC magnetic field. Intense flow motion due to the induced electromagnetic force distorts dynamically the droplet envelope, which is initially spherical. The relative positional change between the liquid metal surface and the surrounding coil means that fluid flow and magnetic field computations need to be closely coupled. A spectral technique is used to solve this problem, which is assumed axisymmetric. The computed results are compared against a physical experiment and "ideal sphere" analytic solutions. A comparison between the "magnetic pressure" approximation and the full electromagnetic force solutions, shows fundamental differences; the full electromagnetic force solution is necessary for accurate results in most practical applications of this technique. The physical reason for the fundamental discrepancy is the difference in the electromagnetic force representation: only the gradient part of the full force is accounted for in the "magnetic pressure" approximation. Figs 9, Refs 13.

Finite volume methods applied to the computational modelling of welding phenomena

This paper presents the computational modelling of welding phenomena within a versatile numerical framework. The framework embraces models from both the fields of computational fluid dynamics (CFD) and computational solid mechanics (CSM). With regard to the CFD modelling of the weld pool fluid dynamics, heat transfer and phase change, cell-centred finite volume (FV) methods are employed. Additionally, novel vertex-based FV methods are employed with regard to the elasto-plastic deformation associated with the CSM. The FV methods are included within an integrated modelling framework, PHYSICA, which can be readily applied to unstructured meshes. The modelling techniques are validated against a variety of reference solutions.

Parallel performance in multi-physics simulation

A comprehensive simulation of solidification/melting processes requires the simultaneous representation of free surface fluid flow, heat transfer, phase change, non-linear solid mechanics and, possibly, electromagnetics together with their interactions in what is now referred to as "multi-physics" simulation. A 3D computational procedure and software tool, PHYSICA, embedding the above multi-physics models using finite volume methods on unstructured meshes (FV-UM) has been developed. Multi-physics simulations are extremely compute intensive and a strategy to parallelise such codes has, therefore, been developed. This strategy has been applied to PHYSICA and evaluated on a range of challenging multi-physics problems drawn from actual industrial cases.

Dynamic solid mechanics using finite volume methods

A procedure for evaluating the dynamic structural response of elastic solid domains is presented. A prerequisite for the analysis of dynamic fluid–structure interaction is the use of a consistent set of finite volume (FV) methods on a single unstructured mesh. This paper describes a three-dimensional (3D) FV, vertex-based method for dynamic solid mechanics. A novel Newmark predictor–corrector implicit scheme was developed to provide time accurate solutions and the scheme was evaluated on a 3D cantilever problem. By employing a small amount of viscous damping, very accurate predictions of the fundamental natural frequency were obtained with respect to both the amplitude and period of oscillation. This scheme has been implemented into the multi-physics modelling software framework, PHYSICA, for later application to full dynamic fluid structure interaction.

Representing the dividing instant

The so-called dividing instant (DI) problem is an ancient historical puzzle encountered when attempting to represent what happens at the boundary instant which divides two successive states. The specification of such a problem requires a thorough exploration of the primitives of the temporal ontology and the corresponding time structure, as well as the conditions that the resulting temporal models must satisfy. The problem is closely related to the question of how to characterize the relationship between time periods with positive duration and time instants with no duration. It involves the characterization of the ‘closed’ and ‘open’ nature of time intervals, i.e. whether time intervals include their ending points or not. In the domain of artificial intelligence, the DI problem may be treated as an issue of how to represent different assumptions (or hypotheses) about the DI in a consistent way. In this paper, we shall examine various temporal models including those based solely on points, those based solely on intervals and those based on both points and intervals, and point out the corresponding DI problem with regard to each of these temporal models. We shall propose a classification of assumptions about the DI and provide a solution to the corresponding problem.

Modelling electromagnetically levitated liquid droplet oscillations

This work comprises accurate computational analysis of levitated liquid droplet oscillations in AC and DC magnetic fields. The AC magnetic field interacting with the induced electric current within the liquid metal droplet generates intense fluid flow and the coupled free surface oscillations. The pseudo-spectral technique is used to solve the turbulent fluid flow equations for the continuously dynamically transformed axisymmetric fluid volume. The volume electromagnetic force distribution is updated with the shape and position change. We start with the ideal fluid test case for undamped Rayleigh frequency oscillations in the absence of gravity, and then add the viscous and the DC magnetic field damping. The oscillation frequency spectra are further analysed for droplets levitated against gravity in AC and DC magnetic fields at various combinations. In the extreme case electrically poorly conducting, diamagnetic droplet (water) levitation dynamics are simulated. Applications are aimed at pure electromagnetic material processing techniques and the material properties measurements in uncontaminated conditions.

The effect of reflow process on the contact resistance and reliability of anisotropic conductive film interconnection for flip chip on flex applications

The work presented in this paper focuses on the effect of reflow process on the contact resistance and reliability of anisotropic conductive film (ACF) interconnection. The contact resistance of ACF interconnection increases after reflow process due to the decrease in contact area of the conducting particles between the mating I/O pads. However, the relationship between the contact resistance and bonding parameters of the ACF interconnection with reflow treatment follows the similar trend to that of the as-bonded (i.e. without reflow) ACF interconnection. The contact resistance increases as the peak temperature of reflow profile increases. Nearly 40% of the joints were found to be open after reflow with 260 °C peak temperature. During the reflow process, the entrapped (between the chip and substrate) adhesive matrix tries to expand much more than the tiny conductive particles because of the higher coefficient of thermal expansion, the induced thermal stress will try to lift the bump from the pad and decrease the contact area of the conductive path and eventually, leading to a complete loss of electrical contact. In addition, the environmental effect on contact resistance such as high temperature/humidity aging test was also investigated. Compared with the ACF interconnections with Ni/Au bump, higher thermal stress in the Z-direction is accumulated in the ACF interconnections with Au bump during the reflow process owing to the higher bump height, thus greater loss of contact area between the particles and I/O pads leads to an increase of contact resistance and poorer reliability after reflow.

Multi-physics-multi-scale simulation and optimisation: the next generation

FEA and CFD analysis is becoming ever more complex with an emerging demand for simulation software technologies that can address ranges of problems that involve combinations of interactions amongst varying physical phenomena over a variety of time and length scales. Computation modelling of such problems requires software technologies that enable the representation of these complex suites of 'physical' interactions. This functionality requires the structuring of simulation modules for specific physical phemonmena so that the coupling can be effectiely represented. These 'multi-physics' and 'multi-scale' computations are very compute intensive and so the simulation software must operate effectively in parallel if it is to be used in this context. Of course the objective of 'multi-physics' and 'multi-scale' simulation is the optimal design of engineered systems so optimistation is an important feature of such classes of simulation. In this presentation, a multi-disciplinary approach to simulation based optimisation is described with some key examples of application to challenging engineering problems.

[Conference report] Magic and mathematics: The life and work of John Dee. National Maritime Museum, Greenwich, 13-14 June 2003

Tony Mann provides a report of a two-day meeting "Magic and mathematics: The life and work of John Dee" held from 13-14 June 2003 at the National Maritime Museum, Greenwich.

An acoustic correction method for extracting sound signals

Sound waves are propagating pressure fluctuations and are typically several orders of magnitude smaller than the pressure variations in the flow field that account for flow acceleration. On the other hand, these fluctuations travel at the speed of sound in the medium, not as a transported fluid quantity. Due to the above two properties, the Reynolds averaged Navier-Stokes (RANS) equations do not resolve the acoustic fluctuations. Direct numerical simulation of turbulent flow is still a prohibitively expensive tool to perform noise analysis. This paper proposes the acousticcorrectionmethod, an alternative and affordable tool based on a modified defect correction concept, which leads to an efficient algorithm for computational aeroacoustics and noise analysis.

Computational modeling techniques for reliability of electronic components on printed circuit boards

This paper describes modeling technology and its use in providing data governing the assembly and subsequent reliability of electronic chip components on printed circuit boards (PCBs). Products, such as mobile phones, camcorders, intelligent displays, etc., are changing at a tremendous rate where newer technologies are being applied to satisfy the demands for smaller products with increased functionality. At ever decreasing dimensions, and increasing number of input/output connections, the design of these components, in terms of dimensions and materials used, is playing a key role in determining the reliability of the final assembly. Multiphysics modeling techniques are being adopted to predict a range of interacting physics-based phenomena associated with the manufacturing process. For example, heat transfer, solidification, marangoni fluid flow, void movement, and thermal-stress. The modeling techniques used are based on finite volume methods that are conservative and take advantage of being able to represent the physical domain using an unstructured mesh. These techniques are also used to provide data on thermal induced fatigue which is then mapped into product lifetime predictions.

Polymer waveguide and VCSEL array multi-physics modelling for OECB based optical backplanes [opto-electrical circuit boards]

The deployment of OECBs (opto-electrical circuit boards) is expected to make a significant impact in the telecomm switches arena within the next five years. This will create optical backplanes with high speed point-to-point optical interconnects. The crucial aspect in the manufacturing process of the optical backplane is the successful coupling between VCSEL (vertical cavity surface emitting laser) device and embedded waveguide in the OECB. The results from a thermo-mechanical analysis are being used in a purely optical model, which solves optical energy and attenuation from the VCSEL aperture into, and then through, the waveguide. Results from the modelling are being investigated using DOE analysis to identify packaging parameters that minimise misalignment. This is achieved via a specialist optimisation software package. Results from the thermomechanical and optical models are discussed as are experimental results from the DOE.