Droplet oscillations in high gradient magnetic field

In high intensity and high gradient magnetic fields the volumetric force on diamagnetic material, such as water, leads to conditions very similar to microgravity in a terrestrial laboratory. In principle, this opens the possibility to determine material properties of liquid samples without wall contact, even for electrically non-conducting materials. In contrast, AC field levitation is used for conductors, but then terrestrial conditions lead to turbulent flow driven by Lorentz forces. DC field damping of the flow is feasible and indeed practiced to allow property measurements. However, the AC/DC field combination acts preferentially on certain oscillation modes and leads to a shift in the droplet oscillation spectrum.What is the cause? A nonlinear spectral numerical model is presented, to address these problems

Parallel genetic algorithms for the solution of inverse heat conduction problems

A parallel genetic algorithm (PGA) is proposed for the solution of two-dimensional inverse heat conduction problems involving unknown thermophysical material properties. Experimental results show that the proposed PGA is a feasible and effective optimization tool for inverse heat conduction problems

Droplet oscillations in high gradient static magnetic field

In high intensity and high gradient magnetic fields the volumetric force on diamagnetic material, such as water, leads to conditions very similar to microgravity in a terrestrial laboratory. In principle, this opens the possibility to determine material properties of liquid samples without wall contact, even for electrically non-conducting materials. In contrast, AC field levitation is used for conductors, but then terrestrial conditions lead to turbulent flow driven by Lorentz forces. DC field damping of the flow is feasible and indeed practiced to allow property measurements. However, the AC/DC field combination acts preferentially on certain oscillation modes and leads to a shift in the droplet oscillation spectrum.What is the cause? A nonlinear spectral numerical model is presented, to address these problems.

Numerical simulation of encapsulant curing within a variable frequency microwave processing system

Curing of encapsulant material in a simplified microelectronics package using an open oven Variable Frequency Microwave (VFM) system is numerically simulated using a coupled solver approach. A numerical framework capable of simulating electromagnetic field distribution within the oven system, plus heat transfer, cure rate, degree of cure and thermally induced stresses within the encapsulant material is presented. The discrete physical processes have been integrated into a fully coupled solution, enabling usefully accurate results to be generated. Numerical results showing the heating and curing of the encapsulant material have been obtained and are presented in this contribution. The requirement to capture inter-process coupling and the variation in dielectric and thermophysical material properties is discussed and illustrated with simulation results.

Influence of megasonic agitation on the electrodeposition of high aspect ratio blind vias

This paper presents preliminary studies in electroplating using megasonic agitation to avoid the formation of voids within high aspect ratio microvias that are used for the redistribution of interconnects in high density interconnection technology in printed circuit boards. Through this technique, uniform deposition of metal on the side walls of the vias is possible. High frequency acoustic streaming at megasonic frequencies enables the decrease of the Nernst diffusion layer down to the sub-micron range, allowing thereby conformal electrodeposition in deep grooves. This effect enables the normally convection free liquid near the surface to be agitated. Higher throughput and better control of the material properties of the deposits can be achieved for the manufacturing of embedded interconnections and metal-based MEMS. For optimal filling performance of the microvias, a full design of experiments (DOE) and a multi-physics numerical simulation have been conducted to analyse the influence of megasonic agitation on the plating quality of the microvias. Megasonic based deposition has been found to increase the deposition rate as well as improving the quality of the metal deposits.

Computer modelling analysis of the globtop's effects on aluminium wirebond reliability

In power electronics modules, heavy aluminium wires, i.e. wire diameters greater than 100 microns, are bonded to the active semiconductor devices and conductor metallization to form electric circuits of the power electronic module. Due to the high currents that may flow through these wires, a single connection usually contains several wires and thus, a large number of wires are used in a power electronics module. Under normal operation or test condition, a significant amount of stresses and strains induced in the wire and bonding interfaces, resulting in failure over time. In this paper, computer modelling techniques are used to analyse the effect of globtop design on the reliability of aluminium wirebonds under cyclic thermal-mechanical loading conditions. The results will show the sensitivity of the reliability of the wirebonds to the changes in the geometry and the material properties of the wirebond globtop.

Development of an in-situ, non-destructive ultrasonic monitoring technique for solder pastes

This paper concerns the use of a non-destructive ultrasonic technique for characterising the rheological properties of solder paste and specifically, the use of through-mode microsecond ultrasonic pulses for evaluation of viscoelastic properties of paste materials at the molecular level. Ultrasonic techniques are a widely used and a reliable form of non-destructive testing of materials. This is because techniques such as ultrasounds while used for testing or monitoring material properties, has offered immense benefits in applications where access to the sample is restricted or when handling the sample for testing could interfere with the monitoring or analysis process. Very often, this would mean that the measurements taken are not a true representation of the behaviour of the material (due to externally incorporated changes into the material's physical state during the removal or testing process). Ultrasonic based techniques are being increasingly used for quality control and production monitoring functions which requires evaluation of the changes in material properties over wide range of industrial applications such as cement paste quality, plastic/polymer extrusion process, dough, and even sugar content in beverage drinks. In addition, ultrasound techniques are of great interest for their capacity to take rapid measurements in systems which are optically opaque. The viscometer and rheometer are two of the most widely used rheological instruments used in industry for monitoring the quality of solder pastes, during the production and packaging stage. One of the potential limitations of viscometer and rheometer based measurements is that the collection and preparation of the solder paste samples can irreversibly alter the structure and flow behaviour of the sample. Hence the measurement may not represent the actual quality of the whole production batch. Secondly, rheological measurements and the interpretation of rheological data is a very technical and time consuming process, which requires professionally trained R&D personnel. It is for these reasons that materials suppliers (who formulate and produce solder pastes) and solder paste consumers (especially, contract electronics manufacturers) are keen to see the development of simple, easy to use and accurate techniques for the theological characterisation of solder pastes. The results from the work show that the technique can be used by R&D personnel involved in paste formulation and manufacture to monitor the batch-to-batch quality and consistency.

In-situ non-destructive ultrasonic rheology technique for monitoring different lead-free solder pastes for surface mount applications

This paper investigates the application of a non-destructive ultrasonic technique for characterising the rheological properties of solder paste through the use of through-mode microsecond ultrasonic pulses for evaluation of viscoelastic properties of lead-free solder paste containing different types of flux. Ultrasonic techniques offer a robust and reliable form of non-destructive testing of materials where access to the sample is restricted or when sample handling can interfere with the monitoring or analysis process due to externally incorporated changes to the material’s physical state or accidental contamination during the removal or testing process. Ultrasonic based techniques are increasingly used for quality control and production monitoring functions which requires evaluation of changes in material properties for a wide range of industrial applications such as cement paste quality, plastic/polymer extrusion process, dough and even sugar content in beverage drinks. In addition, ultrasound techniques are of great interest for their capability to take rapid measurements in systems which are optically opaque. The conventional industry approach for characterising the rheological properties of suspensions during processing/packaging stage is mainly through the use of viscometer and some through the use of rheometer. One of the potential limitations of viscometer and rheometer based measurements is that the collection and preparation of the solder paste samples can irreversibly alter the structure and flow behaviour of the sample. Hence the measurement may not represent the actual quality of the whole production batch. Secondly, rheological measurements and the interpretation of rheological data is a very technical and time consuming process, which requires professionally trained R&D personnel. The ultrasound technique being proposed provides simple, yet accurate and easy to use solution for the in-situ rheological characterisation of solder pastes which will benefit the materials suppliers (who formulate and produce solder pastes) and solder paste consumers (especially, contract electronics manufacturers). The results from the work show that the technique can be used by R&D personnel involved in paste formulation and manufacture to monitor the batch-to-batch quality and consistency.

Multi-physics modelling - A vital component of virtual manufacturing

One of the core tasks of the virtual-manufacturing environment is to characterise the transformation of the state of material during each of the unit processes. This transformation in shape, material properties, etc. can only be reliably achieved through the use of models in a simulation context. Unfortunately, many manufacturing processes involve the material being treated in both the liquid and solid state, the trans-formation of which may be achieved by heat transfer and/or electro-magnetic fields. The computational modelling of such processes, involving the interactions amongst various interacting phenomena, is a consider-able challenge. However, it must be addressed effectively if Virtual Manufacturing Environments are to become a reality! This contribution focuses upon one attempt to develop such a multi-physics computational toolkit. The approach uses a single discretisation procedure and provides for direct interaction amongst the component phenomena. The need to exploit parallel high performance hardware is addressed so that simulation elapsed times can be brought within the realms of practicality. Examples of Multiphysics modelling in relation to shape casting, and solder joint formation reinforce the motivation for this work.

Development of a model to predict the life of pneumatic conveyor bends subject to erosive wear

The erosion processes resulting from flow of fluids (gas-solid or liquid-solid) are encountered in nature and many industrial processes. The common feature of these erosion processes is the interaction of the fluid (particle) with its boundary thus resulting in the loss of material from the surface. This type of erosion in detrimental to the equipment used in pneumatic conveying systems. The puncture of pneumatic conveyor bends in industry causes several problems. Some of which are: (1) Escape of the conveyed product causing health and dust hazard; (2) Repairing and cleaning up after punctures necessitates shutting down conveyors, which will affect the operation of the plant, thus reducing profitability. The most common occurrence of process failure in pneumatic conveying systems is when pipe sections at the bends wear away and puncture. The reason for this is particles of varying speed, shape, size and material properties strike the bend wall with greater intensity than in straight sections of the pipe. Currently available models for predicting the lifetime of bends are inaccurate (over predict by 80%. The provision of an accurate predictive method would lead to improvements in the structure of the planned maintenance programmes of processes, thus reducing unplanned shutdowns and ultimately the downtime costs associated with these unplanned shutdowns. This is the main motivation behind the current research. The paper reports on two aspects of the first phases of the study-undertaken for the current project. These are (1) Development and implementation; and (2) Testing of the modelling environment. The model framework encompasses Computational Fluid Dynamics (CFD) related engineering tools, based on Eulerian (gas) and Lagrangian (particle) approaches to represent the two distinct conveyed phases, to predict the lifetime of conveyor bends. The method attempts to account for the effect of erosion on the pipe wall via particle impacts, taking into account the angle of attack, impact velocity, shape/size and material properties of the wall and conveyed material, within a CFD framework. Only a handful of researchers use CFD as the basis of predicting the particle motion, see for example [1-4] . It is hoped that this would lead to more realistic predictions of the wear profile. Results, for two, three-dimensional test cases using the commercially available CFD PHOENICS are presented. These are reported in relation to the impact intensity and sensitivity to the inlet particle distributions.