Communication system model for information rate evaluation of differential detection over time-varying channels

A communication system model for mutual information performance analysis of multiple-symbol differential M-phase shift keying over time-correlated, time-varying flat-fading communication channels is developed. This model is a finite-state Markov (FSM) equivalent channel representing the cascade of the differential encoder, FSM channel model and differential decoder. A state-space approach is used to model channel phase time correlations. The equivalent model falls in a class that facilitates the use of the forward backward algorithm, enabling the important information theoretic results to be evaluated. Using such a model, one is able to calculate mutual information for differential detection over time-varying fading channels with an essentially finite time set of correlations, including the Clarke fading channel. Using the equivalent channel, it is proved and corroborated by simulations that multiple-symbol differential detection preserves the channel information capacity when the observation interval approaches infinity.

Mutual information performance of differential MPSK detection over time-varying channels

This paper provides mutual information performance analysis of multiple-symbol differential WSK (M-phase shift keying) over time-correlated, time-varying flat-fading communication channels. A state space approach is used to model time correlation of time varying channel phase. This approach captures the dynamics of time correlated, time-varying channels and enables exploitation of the forward-backward algorithm for mutual information performance analysis. It is shown that the differential decoding implicitly uses a sequence of innovations of the channel process time correlation and this sequence is essentially uncorrelated. It enables utilization of multiple-symbol differential detection, as a form of block-by-block maximum likelihood sequence detection for capacity achieving mutual information performance. It is shown that multiple-symbol differential ML detection of BPSK and QPSK practically achieves the channel information capacity with observation times only on the order of a few symbol intervals

An investigation into the rheological properties of different lead-free solder pastes for surface mount applications

Purpose – The purpose of this paper is to investigate the rheological behaviour of three different lead-free solder pastes used for surface mount applications in the electronic industry.Design/methodology/approach – This study concerns the rheological measurements of solder paste samples and is made up of three parts. The first part deals with the measurement of rhelogical properties with three different measuring geometries, the second part looks into the effect of frequencies on oscillatory stress sweep measurements and the final part reports on the characterisation and comparison of three different types of Pb-free solder pastes. Findings – Among the three geometries, the serrated parallel plate was found effective in minimising the wall-slip effect. From the oscillatory stresssweep data with different frequencies; it was observed that the linear visco-elastic region is independent of frequency for all the solder paste samples. To understand the shear thinning behaviour of solder paste, the well known Cross and Carreau models were fitted to the viscosity data. Moreover,creep-recovery and dynamic frequency-sweep tests were also carried out without destroying the sample’s structure and have yielded useful information on the pastes behaviour.Research limitations/implications – More extensive research is needed to fully characterise the wall-slip behaviour during the rheological measurements of solder pastes. Practical implications – The rheological test results presented in this paper will be of important value for research and development, quality control and facilitation of the manufacturing of solder pastes and flux mediums. Originality/value – This paper shows how wall-slip effects can be effectively avoided during rheological measurements of solder pastes. The paper also outlines how different rheological test methods can be used to characterise solder paste behaviours

Modelling of the time-dependent flow behaviour of lead-free solder pastes used for flip-chip assembly applications

The market for solder paste materials in the electronic manufacturing and assembly sector is very large and consists of material and equipment suppliers and end users. These materials are used to bond electronic components (such as flip-chip, CSP and BGA) to printed circuit boards (PCB's) across a range of dimensions where the solder interconnects can be in the order of 0.05mm to 5mm in size. The non-Newtonian flow properties exhibited by solder pastes during its manufacture and printing/deposition phases have been of practical concern to surface mount engineers and researchers for many years. The printing of paste materials through very small-sized stencil apertures is known to lead to increased stencil clogging and incomplete transfer of paste to the substrate pads. At these very narrow aperture sizes the paste rheology and particle-wall interactions become crucial for consistent paste withdrawal. These non-Newtonian effects must be understood so that the new paste formulations can be optimised for consistent printing. The focus of the study reported in this paper is the characterisation of the rheological properties of solder pastes and flux mediums, and the evaluation of the effect of these properties on the pastes' printing performance at the flip-chip assembly application level. Solder pastes are known to exhibit a thixotropic behaviour, which is recognised by the decrease in apparent viscosity of paste material with time when subjected to a constant shear rate. The proper characterisation of this time-dependent theological behaviour of solder pastes is crucial for establishing the relationships between the pastes' structure and flow behaviour; and for correlating the physical parameters with paste printing performance. In this paper, we present a number of methods which have been developed for characterising the time-dependent and non-Newtonian rheological behaviour of solder pastes and flux mediums as a function of shear rates. We also present results of the study of the rheology of the solder pastes and flux mediums using the structural kinetic modelling approach, which postulates that the network structure of solder pastes breaks down irreversibly under shear, leading to time and shear dependent changes in the flow properties. Our results show that for the solder pastes used in the study, the rate and extent of thixotropy was generally found to increase with increasing shear rate. The technique demonstrated in this study has wide utility for R&D personnel involved in new paste formulation, for implementing quality control procedures used in solder paste manufacture and packaging; and for qualifying new flip-chip assembly lines

Influence of solder paste components on rheological behaviour

Rheological properties of solder pastes are very important for a high quality surface mount technology process. The stencil/screen printing process of solder pastes is one of the most critical steps in the SMT assembly process, as most of the assembly defects can often be shown to originate from paste rheology and associated poor printing performance. This paper concerns an investigation of the effect of solder paste composition on the rheological properties and behaviour of four different solder pastes. We report on the evaluation of three different paste formulations based on the no-clean flux composition, with different alloy composition, metal content and particle size using a range of rheological characterisation techniques - including viscosity measurements, yield stress, oscillatory and creep-recovery tests. Our results show that in the viscosity test, all solder pastes exhibited a shear thinning behaviour in nature with different highest maximum viscosity. In the region of shear thinning behaviour the paste 3 delivered the best results. Viscosity test helps to understand the solid and cohesive behaviour of solder pastes. Good solid and cohesive behaviour indicates a good paste roll and helps to avoid paste bleeding. The yield stress test has been used to study the effect of temperature on the flow behaviour of solder pastes. Yield stress was measured for a range of temperature from 15deg C to 35deg C with an increment of 5degC. The result indicated a decreasing of the yield stress point if the temperature was increased. Paste 4 has shown the minimum dependence on temperature. The oscillatory test has been used to find out the linear visco-elastic range and to study the solid and liquid like behaviours of solder pastes. Paste 1 indicated the biggest linear visco-elastic region (LVR) and the highest value of G' and G" which means solder paste 1 will be needed a higher squeegee pressure in the printing process. In the creep recovery test paste 4 showed the best- - recovery and the lowest values of creep and recovery compliance which indicated a good printing behaviour. The test also has showed the solder paste with smaller particle size exhibit less recovery

Effect of temperature on slumping behaviour of lead-free solder paste and its rheological simulation

Variation in temperature can have a significant impact on the rheological characterisation of solder pastes used in the electronic assembly of surface mount devices. This paper concerns the study of the effect of temperature on slumping characteristics of lead-free solder pastes. The identification of the slumping characteristics can help in the correlation of the pastes characteristics to its printing performance. Further issues, which aid in justifying the undertaking of such a study, include the temperature differences identified both at the squeegee during the print, and during reflow. Due to these temperature variations, it is imperative to understand how slump differs with a temperature gradient

On information rates of time-varying fading channels modeled as finite-state Markov channels

We study information rates of time-varying flat-fading channels (FFC) modeled as finite-state Markov channels (FSMC). FSMCs have two main applications for FFCs: modeling channel error bursts and decoding at the receiver. Our main finding in the first application is that receiver observation noise can more adversely affect higher-order FSMCs than lower-order FSMCs, resulting in lower capacities. This is despite the fact that the underlying higher-order FFC and its corresponding FSMC are more predictable. Numerical analysis shows that at low to medium SNR conditions (SNR lsim 12 dB) and at medium to fast normalized fading rates (0.01 lsim fDT lsim 0.10), FSMC information rates are non-increasing functions of memory order. We conclude that BERs obtained by low-order FSMC modeling can provide optimistic results. To explain the capacity behavior, we present a methodology that enables analytical comparison of FSMC capacities with different memory orders. We establish sufficient conditions that predict higher/lower capacity of a reduced-order FSMC, compared to its original high-order FSMC counterpart. Finally, we investigate the achievable information rates in FSMC-based receivers for FFCs. We observe that high-order FSMC modeling at the receiver side results in a negligible information rate increase for normalized fading rates fDT lsim 0.01.

Development of an in-situ, non-destructive ultrasonic monitoring technique for solder pastes

This paper concerns the use of a non-destructive ultrasonic technique for characterising the rheological properties of solder paste and specifically, the use of through-mode microsecond ultrasonic pulses for evaluation of viscoelastic properties of paste materials at the molecular level. Ultrasonic techniques are a widely used and a reliable form of non-destructive testing of materials. This is because techniques such as ultrasounds while used for testing or monitoring material properties, has offered immense benefits in applications where access to the sample is restricted or when handling the sample for testing could interfere with the monitoring or analysis process. Very often, this would mean that the measurements taken are not a true representation of the behaviour of the material (due to externally incorporated changes into the material's physical state during the removal or testing process). Ultrasonic based techniques are being increasingly used for quality control and production monitoring functions which requires evaluation of the changes in material properties over wide range of industrial applications such as cement paste quality, plastic/polymer extrusion process, dough, and even sugar content in beverage drinks. In addition, ultrasound techniques are of great interest for their capacity to take rapid measurements in systems which are optically opaque. The viscometer and rheometer are two of the most widely used rheological instruments used in industry for monitoring the quality of solder pastes, during the production and packaging stage. One of the potential limitations of viscometer and rheometer based measurements is that the collection and preparation of the solder paste samples can irreversibly alter the structure and flow behaviour of the sample. Hence the measurement may not represent the actual quality of the whole production batch. Secondly, rheological measurements and the interpretation of rheological data is a very technical and time consuming process, which requires professionally trained R&D personnel. It is for these reasons that materials suppliers (who formulate and produce solder pastes) and solder paste consumers (especially, contract electronics manufacturers) are keen to see the development of simple, easy to use and accurate techniques for the theological characterisation of solder pastes. The results from the work show that the technique can be used by R&D personnel involved in paste formulation and manufacture to monitor the batch-to-batch quality and consistency.

In-situ non-destructive ultrasonic rheology technique for monitoring different lead-free solder pastes for surface mount applications

This paper investigates the application of a non-destructive ultrasonic technique for characterising the rheological properties of solder paste through the use of through-mode microsecond ultrasonic pulses for evaluation of viscoelastic properties of lead-free solder paste containing different types of flux. Ultrasonic techniques offer a robust and reliable form of non-destructive testing of materials where access to the sample is restricted or when sample handling can interfere with the monitoring or analysis process due to externally incorporated changes to the material’s physical state or accidental contamination during the removal or testing process. Ultrasonic based techniques are increasingly used for quality control and production monitoring functions which requires evaluation of changes in material properties for a wide range of industrial applications such as cement paste quality, plastic/polymer extrusion process, dough and even sugar content in beverage drinks. In addition, ultrasound techniques are of great interest for their capability to take rapid measurements in systems which are optically opaque. The conventional industry approach for characterising the rheological properties of suspensions during processing/packaging stage is mainly through the use of viscometer and some through the use of rheometer. One of the potential limitations of viscometer and rheometer based measurements is that the collection and preparation of the solder paste samples can irreversibly alter the structure and flow behaviour of the sample. Hence the measurement may not represent the actual quality of the whole production batch. Secondly, rheological measurements and the interpretation of rheological data is a very technical and time consuming process, which requires professionally trained R&D personnel. The ultrasound technique being proposed provides simple, yet accurate and easy to use solution for the in-situ rheological characterisation of solder pastes which will benefit the materials suppliers (who formulate and produce solder pastes) and solder paste consumers (especially, contract electronics manufacturers). The results from the work show that the technique can be used by R&D personnel involved in paste formulation and manufacture to monitor the batch-to-batch quality and consistency.

Adaptive ordering for imperfect successive decision feedback multiuser detection

A method for selecting the order in which the users are detected in communication systems employing adaptive successive decision feedback multiuser detection is proposed. Systems employing channel coding without the assumption of perfect decision feedback are analyzed. The method is based on the mean squared error (MSE) measurements during a training period for each user. The analysis' shows that the method delivers BER performance improvement relative to other previously proposed ordering methods

Design of differential amplifier with negative impedance compensation

Design of differential amplifier with high gain accuracy and high linearity is presented in the paper. The amplifier design is based on the negative impedance compensation technique reported by the authors in [1]. A negative impedance with high precision, low sensitivity, wide input signal range and simple structure is used for the compensation of differential amplifier. Analysis and simulation results show that gain accuracy and linearity can be improved significantly with the negative impedance compensation

Stability analysis of the amplifier with negative impedance compensation

A novel amplifier design technique based on negative impedance compensation has been proposed in our recent paper. In this paper, we investigate the stability of this amplifier system. The parameter space approach has been used to determine system parameters in the negative impedance circuit such that the stability of the amplifier system can be guaranteed in a certain region represented by those parameters. The simulation results have demonstrated that stable circuit behavior for the amplifier can be achieved

The future of energy: are competitive markets and nuclear power the answer?

The inaugural lecture of Professor Stephen Thomas at the University of Greenwich, 4th February 2010. It examines whether further pursuit of competition in energy markets and expansion in the role of nuclear power can be the main elements in a policy to meet goals of security, sustainability and affordability.

Safety issues with the South African Pebble Bed Modular Reactor: when were the issues apparent? A briefing paper

This is a briefing report on when the safety issues identified in a July 2008 report by Jülich should have become apparent In July 2008, the German Jülich nuclear research centre published a report entitled ‘A safety re-evaluation of the AVR pebble bed reactor operation and its consequences for future HTR concepts.’ It concluded: ‘pebble bed HTRs require additional safety related R&D effort and updating of safety analyses before construction.’

Can nuclear power plants be built in Britain without public subsidies and guarantees?

This report examines the credibility of the claim by the UK government that nuclear power plants can be built in the UK without public subsidies and guarantees